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Thursday, August 9, 2018

• Autonomous Vehicles Driving New Data Interfaces

Thursday, August 9, 2018

• Design Verification Challenges in Modern SoCs - HDL Design House Webinar

Wednesday, August 8, 2018

• Arm targets any number of devices and any type of data
• India Startup Preps RISC-V, AI Cores
• SMIC Reports 2018 Second Quarter Results
• UMC Reports Sales for July 2018
• Skyworks to Acquire Smart Interface Innovator Avnera Corporation
• Arm targets any number of devices and any type of data
• Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions

Tuesday, August 7, 2018

• Synopsys Announces Earnings Release Date for Third Quarter Fiscal Year 2018
• QuickLogic Reports Fiscal 2018 Second Quarter Results
• Cadence, Nvidia to apply machine learning to EDA
• 200mm wafer demand driving growth in Asia
• IDM or foundry: CanSemi builds on analog, MCU strategy
• QuickLogic Collaborates with ETH Zurich to Integrate eFPGA into PULP Platform
• CEVA, Inc. Announces Second Quarter 2018 Financial Results
• Mobiveil Inc. and SiFive, Inc. partner to develop RISC-V based configurable SSD Platform For Data Center and Enterprise storage Applications
• PLDA Announces Integration of their PCIe 3.0 Controller IP into Kazan Networks' NVMe Over Fabric Fuji ASIC, Providing a Dramatic Increase in Scalability and Flexibility for Storage Applications

Monday, August 6, 2018

• Achronix and Mentor Partner to Provide Link Between High-Level Synthesis and FPGA Technology
• Lekha Wireless appoints T2M for global marketing, representation and business development
• Avery Design Systems Pairs PCIe and NVM Express VIP with Teledyne LeCroy Summit Protocol Exercisers
• FADU Launches Industry Leading SSD Solutions Powered by SiFive RISC-V Core IP
• eSilicon Licenses Industry-Leading SiFive E2 Core IP for Next-Generation SerDes IP
• eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on DB HiTek's BCD Process

Sunday, August 5, 2018

• RISC-V Foundation Announces Call for Papers and Registration Promotions for Inaugural RISC-V Summit
• eSilicon 56Gbps PAM4 SerDes IP Hits the Lab
• UMC and Avalanche Technology Partner for MRAM Development and 28nm Production
• GUC Monthly Sales Report - July 2018
• TSMC Details Impact of Computer Virus Incident
• Where Did Qualcomm Go Wrong?
• Mid-Year Global Semiconductor Sales Up 20.4 Percent Compared to 2017
• Arm acquires Treasure Data to set the stage for IoT transformation
• Q'comm-NXP Break-Up: There Will Be Fallout
• IntelliProp to Demo Gen-Z 1.0 Compliant IP at Flash Memory Summit 2018
• Lessons from the Broadcom-Qualcomm Debacle

Thursday, August 2, 2018

• IP-Maker to showcase NVMe Host demo at Flash Memory Summit

Thursday, August 2, 2018

• WiLAN Provides Litigation Update

Wednesday, August 1, 2018

• MIPI Alliance to Advance Autonomous Driving, other Automotive Applications with New Data Interface Specifications at 12-24 Gbps and Beyond
• Wave Computing Announces Strategic Collaboration with Broadcom For Next-Generation AI DPU ASIC
• Microsemi Announces Sampling of Industry's Highest Performing Enterprise Gen 4 PCIe Controller
• Arasan to demonstrate its SD Card UHS-II PHY IP and eMMC 5.1 PHY IP for 12nm SoC Designs at the 2018 Flash Memory Summit
• UltraSoC brings SEGGER J-Link to embedded debug and analytics environment
• Stratix 10 FPGA: REFLEX CES adds 26G Acceleration hardware to the "XpressGXS10-FH200G" line already shipping.
• Numem exhibits and presents at MRAM Developer Day
• Numem exhibits at the Flash Memory Summit

Tuesday, July 31, 2018

• New 5G Hurdles
• Maxim's Secure Microcontroller Delivers Advanced Cryptography, Secure Key Storage and Tamper Detection in a 50 Percent Smaller Package
• Qualcomm Vets Join Blockchain RISC-V Chip Developer
• Nurlink and Vidatronic Collaborate to Develop SoC for Internet of Things (IoT) Applications
• Faster Verification With AI, ML
• Broadcom to Help Design Wave's 7-nm AI Chip

Monday, July 30, 2018

• STMicroelectronics Make Vehicle Sounds Safer
• Arm and Samsung Foundry 'push the possibilities' of semiconductor manufacturing
• North American PCB Industry Growth Trend Continues
• Intel selects SiTime for 5G timing MEMS
• Synopsys Redefines Interactive Application Security Testing with New Seeker Solution Optimized for DevSecOps
• Arm to Spend $600 Million to Widen IoT Ecosystem Offer
• Innosilicon's Bitcoin ASIC powered by Samsung's Low Power FinFET technology to achieve record breaking performance
• Thalia-DA and Catena confirm successful tape-outs of first analog IP re-use projects
• Applied, ARM to develop CeRAM for neuromorphic applications
• Soitec sales climb on 300mm FDSOI wafer demand
• TSMC trims sales forecast, capex
• IP Cores, Inc. Announces One-Year Anniversary of the Delivery of XTS4 Cores for the Server Memory Encryption
• eMemory's Reprogrammable eNVM solution available on TowerJazz BCD platform

Sunday, July 29, 2018

• Second Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter – All-Time Quarterly High
• AMD Will Fab Its 7nm 'Rome' Epyc CPUs at TSMC, Not GlobalFoundries
• ONKYO Joins HEVC Advance to Expand HEVC/H.265 Video Compression Technology
• Intel Claims Progress on 10nm Yields
• Second Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter - All-Time Quarterly High
• Xilinx Reports Record Quarterly Revenues And EPS; Raises Fiscal Year 2019 Guidance
• Moore's Law, China vs. Team USA
• Rambus Appoints Sanjay Saraf to Board of Directors
• Digital Blocks Extends its MIPI I3C Controller IP Core Family with I3C Master/Slave, I3C Master, and I3C Slave Releases.
• H1 2018 results: Inside Secure announces strong profitable growth
• Chips&Media announced new ISP deal to provide 4K UHD (8Mpixel) resolution Image Signal Processing (ISP) IP

Saturday, July 28, 2018

• ARM to Buy Treasure Data
• Samsung Memory is easy come easy go but for how low?
• Chipus Brings Ultra-Low-Power IP to SiFive's DesignShare Ecosystem
• PLDA and HPE collaborate to develop Gen-Z semiconductor IP