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Monday, September 30, 2024

• Will Intel's restructuring affect Samsung's foundry business?
• Synopsys Software Integrity Group Rebrands as Black Duck ‐ A New Era in Application Security
• STMicroelectronics and Qualcomm Expand Collaboration to Drive Wireless IoT Solutions
• Samsung's New 3nm GAA Technology Has Failed To Attract New Customers Because Of Unstable Yields, With Industry Watchers Forecasting A $385 Million Loss
• RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time
• MulticoreWare collaborates with Arm to optimize and advance x265 video encoding on AWS Graviton4
• First IBM Quantum Data Centre opens in Europe
• Comcores announces the launch of the Centralized Network Configurator for TSN-based networks
• BrainChip Introduces Lowest-Power AI Acceleration Co-Processor

Monday, September 30, 2024

• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIeâ„¢ IP Subsystem with TSMC CoWoS® Technology

Monday, September 30, 2024

• M31 Honored with MSCI ESG 'A' Rating ‐ Advancing Toward a New Milestone in Sustainability
• A Q&A with Quantum Systems Accelerator Director Bert de Jong

Sunday, September 29, 2024

• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service
• Qualcomm and Sequans Complete Sale of 4G IoT Technology
• Paul Williamson on Edge AI, Llama 3.2 on Arm
• Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
• Flexible RISC-V processor offers prospect of low-cost smart objects
• Breakthrough in lithium-metal solid-state battery technology

Friday, September 27, 2024

• Paul Williamson on Edge AI, Llama 3.2 on Arm

Thursday, September 26, 2024

• Dnotitia Announces Strategic Partnership with Korea University Anam Hospital and Advanced Medical Imaging Research Institute to Develop LLM-based Medical AI Solutions

Wednesday, September 25, 2024

• The paradox of semiconductors - EU governance between sovereignty and interdependence
• Quside and PQShield Partner to Launch Integrated Quantum-Safe Cryptographic Solution for Enhanced Digital Security
• Europe takes a quantum leap: LUMI-Q consortium signs contract to establish quantum computer in the Czech Republic
• Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
• TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
• Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
• Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
• Siemens extends collaboration with TSMC to advance integrated circuit and systems design
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment
• MIPI Alliance Releases A-PHY v2.0, Doubling Maximum Data Rate of Automotive SerDes Interface To Enable Emerging Vehicle Architectures
• M31 Launches ONFi5.1 I/O IP on TSMC 5nm Process
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP
• EnSilica joins TSMC Design Center Alliance
• eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes

Tuesday, September 24, 2024

• Security Concerns Plague Emerging Chip Architecture
• Intel More Likely to Divest Units Than Seek Buyout
• EU Launches €73M Quantum Chip Funding to Support Technological Sovereignty and Semiconductor Innovation
• CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
• Boosting Efficiency and Reducing Costs: SilvacoÂ’s Approach to Semiconductor Fabrication
• Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies
• Samsung develops automotive SSD based on 8th-generation V-NAND
• Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design
• Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reachâ„¢ Technology for Automotive and Industrial Applications
• Introducing a Versatile 1G Ethernet PHY IP Core with BroadR-Reach™ Technology for Automotive and Industrial Applications
• Certus Semiconductor releases I/O library in TowerJazz's 65nm process
• Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America

Monday, September 23, 2024

• Intel's entire turnaround plan hinges on this one new chip family - Clearwater Forest pictured, Intel's first 18A chip slated for high-volume manufacturing
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller
• Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs
• GUC Announces Adoption of HBM3E IP by CSP Data Center
• GenAI v1-Q launched with 4 bits Quantization support to accelerate larger LLMs at the Edge
• Dnotitia Announces Strategic MOU with VESSL AI to Pioneer Next-Generation AI Innovation
• Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications
• Alphawave Semi and InnoLight Extend PCIe over Optics Collaboration with Demonstration of 128Gbps Gen 7.0 over Low Latency Linear Pluggable Optics at ECOC 2024

Sunday, September 22, 2024

• Codeplay Brings RISC-V Support to the oneAPI Construction Kit
• XtremeSilica Successfully Ships First SDRAM Controller for Tapeout GF40nm
• VyperCore plans 5nm RISC-V server chip and card
• TSMC and Samsung consider major chip manufacturing plants in UAE
• Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
• RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
• Omni Design Technologies extends partnership with EnSilica and expands Swiftâ„¢ Data Converter IP portfolio
• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio
• JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
• JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
• Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY
• Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
• Alphawave Semi - Interim results for the six months ended 30 June 2024
• €10m for European IoT 5G satellites

Thursday, September 19, 2024

• TSMC's Strategic Win: Full-Scale Semiconductor Production Starts Ahead of Schedule

Wednesday, September 18, 2024

• Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
• Cryptomathic and PQShield form strategic alliance to offer PQC solutions for code signing and data protection in compliance with latest NIST and CNSA recommendations
• Advanced Packaging Drives New Memory Solutions for the AI Era