Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
Friday, August 2, 2024
Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly
DDR5 Gains Enhanced Security, Reliability, and Power Management Features
Thursday, August 1, 2024
Scaling sustainability impact
Arm's calendar Q2 revenues up 39% y-o-y
Chip index collapses 7% as Arm punctures AI optimism
M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform
Renesas Completes Acquisition of Altium
HCLTech recognized as Microsoft Partner of the Year for Dynamics 365 Service
Wednesday, July 31, 2024
Weebit Nano moves closer to availability at DB HiTek; tapes out first chip
FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs
Sondrel's SFA 100 is ideal for AI at the Edge
Weebit Nano and DB HiTek tape-out ReRAM module in DB HiTek's 130nm BCD process
QuickLogic Signs Distribution Agreement with Astute Electronics to Expand Global Reach
Europe launches 'AI Factories'
Samsung set to ship HBM3E chips in H2 after strong H1
Samsung Sees Solid Demand for 3nm in 2H24, Aiming a Ninefold Increase in AI/HPC Sales by 2028
Tuesday, July 30, 2024
Rambus Reports Second Quarter 2024 Financial Results
Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver
Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
BAE Systems Partners with Siemens for Industry 4.0 Revolution
Faraday Reports Second Quarter 2024 Results
Monday, July 29, 2024
RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
Monday, July 29, 2024
Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024
Monday, July 29, 2024
Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP Core with Time-Interleaved Pipeline Architecture Now Available for Whitebox Licensing with No Royalty Fees
Release of Post-Quantum Cryptographic Standards Is Imminent
Raaam signs lead licensee for SRAM replacement technology
RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024
Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC
It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026
Friday, July 26, 2024
New leap in Belgian quantum communication infrastructure: imec, UGent and Belnet realize first QKD links
Friday, July 26, 2024
Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models
Leveraging Safety Processor Expertise to Develop RISC-V Based Automotive Implementations
DDR5 Gets More Security, Power Management Features
HCLTech launches Enterprise AI Foundry on Microsoft Azure
Thursday, July 25, 2024
The transformational impact of AI
Sustainability vs. Progress: The Tightrope Walk of AI Chip Manufacturing
Conference on Battery Direct Recycling 2024
Ian Walsh appointed as Sondrel's Regional VP for America
Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow
Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
Wednesday, July 24, 2024
Comcores supports BAE systems as a key partner with JESD204C IP
Alphawave Semi: Q2 2024 Trading and Business Update
Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications
Imagination Technologies announces new capital investment from Fortress Investment Group
Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform
Experts urge EU to increase investment in photonics
Alphawave IP Q2 revenues up 98% y-o-y
Tuesday, July 23, 2024
Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform
Infineon and Amkor Sign MoU to Boost Supply Chain Sustainability
Monday, July 22, 2024
China's EDA startup X-Epic forced to lay off staff, says report
Source Photonics Licenses 800G Transceiver Module Designs from Intel
Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI
U.S.-China Tech War Likely to Escalate, Analysts Say
TSMC Reports Second Quarter EPS of NT$9.56
MIPI C-D Combo PHY and DSI Controller IP Cores, Silicon Proven, Immediate licensing at a Competitive Price for Your Next Project
Sunday, July 21, 2024
Tenstorrent launches new Wormhole high-performance AI chip using RISC-V architecture
Previous
|
Next
Did you miss last D&R News Alerts ?