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Sunday, April 22, 2018

• RISC-V Foundation and Informa Announce First Annual RISC-V Summit in Silicon Valley and 2018 Workshop Schedule
• Algodone, a Silicon Activation Licensing Technology Provider to the Semiconductor Industry, Expands Executive Team
• Gartner Says Worldwide Semiconductor Revenue Grew 21.6 Percent in 2017 as Samsung Takes Over No. 1 Position
• Alibaba Adds Embedded CPU Core Designer
• Algodone Signs a Strategic Partnership with Accelize
• Fujitsu choose INNOSILICON as cooperative partner
• Facebook to design own processors
• GlobalFoundries choose INNOSILICON as cooperative partner
• 3 Things That TSMC Wants You to Know About Its 7-Nano Tech

Friday, April 20, 2018

• Chipmakers' Rout Widens After TSMC Ignites Smartphone Fears

Thursday, April 19, 2018

• Intel Chip Performs 10 Trillion Calculations per Second

Thursday, April 19, 2018

• IEEE Publishes Standard Revision for SystemVerilog - Unified Hardware Design, Specification and Verification Language

Wednesday, April 18, 2018

• Mobile Semiconductor's 22nm ULL Memory Compiler Joins The GLOBALFOUNDRIES FDXcelerator™ Partner Program
• Microsemi Collaborates with MathWorks to Deliver First Integrated FPGA-in-the-Loop Workflow for PolarFire and SmartFusion2 FPGA Development Boards
• "Quasi-Non-Volatile" Memory Looks to Fill Gap Between Volatile and Non-Volatile Memory
• China Startup Packs AI in Camera
• Qualcomm Begins Layoffs
• TSMC Reports First Quarter EPS of NT$3.46
• TSMC's new chips hint at life after Apple
• T2M announces availability of Bluetooth SIG qualified v5 Bluetooth Low Energy Controller, Stack and Profiles IP from Mindtree

Tuesday, April 17, 2018

• Europe rises as chip market stays strong in February
• Soitec to hire 300 people in 2018
• NetSpeed: Artificial Intelligence calls for Smart Interconnect
• Microsoft to invest $5 billion in IoT
• Titan IC delivers innovative technology for Deep Packet Processing Module in IRD-100 for Strategic Partner Looking Glass
• Macnica's ST2110 IP Core Successfully Adopted by Sencore for its New SDI over IP Converter
• Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor Subsystems for PolarFire FPGAs

Monday, April 16, 2018

• US export ban on ZTE will hurt Qualcomm, others
• Cadence: Tensilica 5th Generation DSP: Mix of Vision and AI
• Microsoft, MediaTek Team on IoT SoC
• Synopsys Extends HAPS Prototyping Family with New Desktop Prototyping Solution
• IoT Security Milestone for Intrinsic ID Authentication: More Than 100 Million Devices Protected
• Arm Backs New Cybersecurity Tech Accord to Protect Consumers and Businesses
• Titan IC has licensed its RegEx Processor to Silicom Ltd for advanced FPGA SmartNIC platforms
• New Flexible SoC Solution from Arm to Enable Rapid Development of Secure IoT Devices
• Inside Secure's Root of Trust Engine Secures eWBM's System-on-Chip for IoT Market

Sunday, April 15, 2018

• QuickLogic Announces Webcast with AI Ecosystem Partners
• Samsung is bringing crypto and blockchain tech closer to its core business
• TSMC likely to see flat 2Q18 revenues, say reports
• No NN-dedicated hardware on Qualcomm IoT processors
• EnSilica becomes Arm Approved Design Partner
• Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest IP and Synopsys Tools
• Rambus Launches CryptoManager RISC-V Root of Trust Programmable Secure Processing Core

Friday, April 13, 2018

• MIPS and NetSpeed partner to deliver solutions for Artificial Intelligence and Machine Learning SoCs

Wednesday, April 11, 2018

• A Cloud-Based Marketplace Designed to Ease FPGA Workload Acceleration
• Dover Microsystems Brings Secure Silicon IP to DesignShare
• China's Unigroup plans to spend $60 billion, says report
• Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP
• Cadence: Last Holdout for Vision + AI Programmability
• Faraday Leads ASIC Industry with Supporting Major Projector Technologies
• Lip-Bu Tan on AI, China & Moore
• DapTechnology Releases 1394/AS5643 IP for Microsemi IGLOO2 and SmartFusion2 FPGA Devices
• Spectral Edge, the image fusion technology specialists, secures $5.3 million in further funding from existing investors Parkwalk Advisors and IQ Capital

Tuesday, April 10, 2018

• China shows it takes Imagination opportunity seriously
• Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances in Camera, AI and Computer Vision
• Cryptocurrency mining IC startup now a TSMC top-ten customer?
• JPEG XS - Image coding for video over IP transmission in production quality
• Aldec's HES UltraScale+ Reconfigurable Accelerator and Northwest Logic's PCI Express Cores Provide Proven PCI Express Solution
• Chip Designers Bank on AI, Bitcoin
• Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout
• Semiconductor Leaders' Marketshares Surge Over the Past 10 Years
• Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream
• CEVA-XM6 Computer Vision and Deep Learning Platform Honored by Vision Systems Design 2018 Innovators Awards Program