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Tuesday, March 6, 2018
Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development
Wave Computing Adopts Low Power MIPS 64-bit Multi-Threaded Core
CEVA First to Deliver Bluetooth 5 Dual Mode IP
Intrinsic ID and Technolution Awarded SBIR to Develop SEMIO IoT Security Platform
M31 and Macroblock work together to deploy the global LED driver IC market
GCT Semiconductor Licenses CEVA Bluetooth Low Energy IP for its LTE IoT SoC
Imperas Appoints Kevin McDermott as Vice President of Marketing
Arm delivers compelling visual experiences to the mainstream
Are the Major DRAM Suppliers Stunting DRAM Demand?
Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra's IoT Platform
US chipmaker GlobalFoundries asks China to probe TSMC
Tuesday, March 6, 2018
Denali Announces State-of-the-Art GHz DDR PHY Technology
Monday, March 5, 2018
Rambus Initiates Accelerated Share Repurchase Program
January Semiconductor Sales Up 22.7 Percent Compared to Last Year
Palma Ceia Closes Series B Funding, Internet of Things Connectivity to be Accelerated
Synopsys Adds New Algorithms in DesignWare Security Protocol Accelerators to Increase Protection for IoT SoCs
Silvaco Completes Acquisition of NanGate
Broadcom Bid Gets U.S. Scrutiny
ARM and embedded SIM
Lattice launches 12Gbps wireless connector
Samsung Electronics' C-Lab to Reveal New AI Projects at SXSW 2018
Arm GPU Gets More AI Muscle
Smaller chips, bigger opportunities: Where GlobalFoundries is going next
GlobalFoundries gears up for the next generations of chip manufacturing
Sunday, March 4, 2018
HCC Embedded Releases MISRA-Compliant Embedded Cryptography Suite and Manager
GUC Monthly Sales Report - Feb 2018
Trilinear Technologies and Avery Design Systems Team on DisplayPort IP Solutions
Efinix Releases Trion Programmable Platform
Barefoot Networks and Xilinx to Showcase Unprecedented Programmability and Visibility for 5G Networks
Canaan-Creative employs Moortec's Temperature Sensor in their new ASIC aimed at HPC IC
Microchip Technology To Acquire Microsemi
Arm's John Ronco on IP for embedded
92 IC Wafer Fabs Closed or Repurposed From 2009-2017
China Plans $31.5 Billion IC Industry Fund
Analog-to-Digital Converter IP for IoT Designs
EU puts 20 year span on 5G spectrum licences
Embedded World: Cypress adds Arm secure firmware to PSoC6
Qualcomm: Huawei 5G chip is too large for mobile terminals,
Thursday, March 1, 2018
Ceva adds power DSP to Nokia 5G network
Processing Power Driving Practicality of Machine Learning
Wednesday, February 28, 2018
Imec and Cadence Tape Out Industry's First 3nm Test Chip
Brite Semiconductor Releases Gen2 DDR LP PHY IP
CEVA and Nokia Collaborate for 4.9G and 5G Technologies
Tuesday, February 27, 2018
China's semiconductor firms catching up, but technology gap with foreign rivals still remains
Worldwide Server Market Revenue Surges 26.4% in the Fourth Quarter Capping Off a Strong Second Half of 2017, According to IDC
Truphone Brings New Integrated SIM Solution to Life With Synopsys ARC Secure IP Subsystem
GloFo and eVaderis develop MRAM for MCU on 22nm FD-SOI
Cadence, Imec Disclose 3-nm Effort
Software-Based GPS Receiver from Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP
GOWIN Semiconductor selects PLDA XpressRICH3 Controller IP as the PCIe interface block in their FPGA product line
S3 Semiconductors joins Arm Approved design partner program
Trinamic Licenses Codasip's Bk3 RISC-V Processor for Next Generation Motion Control Applications
GreenWaves Technologies Unveils GAP8, the Industry's Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge
Tuesday, February 27, 2018
Truechip Announces First Customer Shipment of PCIe Gen 5 and JESD204C Verification IP
Tuesday, February 27, 2018
VeriSilicon Completes Series B Financing
Monday, February 26, 2018
Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt
Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers
Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt
Northwest Logic's Expresso 4.0 Controller Core and Fidus Systems' Zynq UltraScale+ Platform demonstrates PCIe 4.0 Support
RISC-V RV64GC High-Performance Extendable Platform Kit For Fast Linux Execution Released by Imperas
OPENAIRINTERFACE software stack powering 5G use-cases exhibited at Mobile World Congress Barcelona
Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays
Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development
Single-Chip Custom Solutions for the IoT Edge
Ashling and Imperas Partner to Extend the RISC-V Ecosystem
GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor
Sonics Partners With Inomize To Enable Automotive Chip Design For ISO 26262 Standard
GLOBALFOUNDRIES Strengthens 22FDX eMRAM Platform with eVaderis' Ultra-low Power MCU Reference Design
AccelerComm and Achronix Enable Fast Time to Market with 5G Polar Code for Speedcore eFPGAs
Blu Wireless Technology inside CCS self-organising mmWave access and backhaul solution
Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice DSPs
Sunday, February 25, 2018
Qualcomm and Broadcom agree non-price-related conditions of takeover
The hierarchical architecture of an embedded FPGA
Sequans Introduces New NB-IoT Only Platform: Monarch N
Inside Secure to Provide Secure Provisioning Solutions to ALi Corporation
Metrics Partners with Avery to Expand Cloud Verification with Robust VIP Portfolio
Synopsys Delivers Industry's First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage
IAR Systems enables high-performance machine learning based on latest neural network library from Arm
CEVA Extends its IP Platforms for Bluetooth and Wi-Fi with RISC-V
North American Semiconductor Equipment Industry Posts January 2018 Billings
CEO interview: Flex Logix' Geoff Tate on licensing FPGA
Magillem Partners with Imperas
Avery Design Systems Announces SimXACT 5.0 for Improved X-Verification
Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
Dream Chip Technologies Demonstrates Superior Power Efficiency with Automotive Driver Assistance SoC on GLOBALFOUNDRIES 22FDX Technology
Intel Ships Industry's First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV
Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications
CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors
Qualcomm Taps Samsung's 7nm EUV for 5G
Goodix Announces Entry into the Growing NB-IoT Market with Its Acquisition of German-Based CommSolid
Ceragon License CEVA DSPs for Full 5G Wireless Backhaul
RISC-V Gains Its Footing
AMIQ EDA Announces its Design and Verification Tools Eclipse IDE Supports Cadence Perspec System Verifier using System Level Notation
Thursday, February 22, 2018
Samsung Electronics Breaks Ground on New EUV Line in Hwaseong
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