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Sunday, April 8, 2018

• GLOBALFOUNDRIES and Toppan Photomasks extend advanced photomask joint venture in Germany
• Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales
• Design Services Need Uber-izing
• Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory
• intoPIX demonstrates TICO implemented SMPTE 2110 IP running 4K live on FPGA CPU and GPU
• CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators
• MediaTek Announces World's First Complete 56G PAM4 SerDes, Silicon-Proven on 7nm for ASIC services
• intoPIX to unveil newest JPEG-XS compression tech at NAB Show 2018 in Las Vegas - A World First
• Flex Logix Validates EFLX 4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now
• PathPartner Technology unveils FPGA based HEVC & HEIF 4K Decoder on Amazon AWS EC2 Cloud
• GUC Monthly Sales Report - Mar 2018
• Samsung early with 7nm process, says report.
• Achronix: Speedcore eFPGAs Offer Unbeatable Bandwidth and Latency Performance

Thursday, April 5, 2018

• Arastu Systems evolving in the Industry with a strategic roadmap
• Low Voltage SRAM – The Missing Link

Wednesday, April 4, 2018

• China shows it takes Imagination opportunity seriously
• Nantero Expands NRAM Product Development, Signs New Customers
• Fraunhofer IIS Audio System Selected for Chinese 3D Audio Standard for UHD TV
• SEMI Reports 2017 Global Semiconductor Equipment Sales of $56.6 Billion
• HEVC Advance Highlights Momentum with Newest Licensors and Licensees
• The Low Profile PCIe Board XpressGXA10-LP 1150 and 1151 Versions Are Providing HPC, Finance and Networking Markets a Cost-Effective, Low-Latency Solution
• NVMEngines to Exhibit and Present at IP SOC 2018; Company to Be Renamed Numem
• Silvaco IP Revs Up Silicon Catalyst's Semiconductor Startup Ecosystem
• Silvaco and Silicon Catalyst to provide free IC IP to start-ups

Tuesday, April 3, 2018

• Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program
• China, Europe gain share in fabless chip market
• Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program
• China startup releases AI processors then raises $100 million
• Chipmakers Expand R&D Amid France's New AI Push
• AI Connects Imagination, Leo Li, China
• Neotion partners with Texplained creating stronger Secure by Design ICs
• ESD Alliance Reports EDA Industry Revenue Increase For Q4 2017

Tuesday, April 3, 2018

• VeriSilicon Announces ZView Developement Environment for its Industry Standard ZSP Processors

Monday, April 2, 2018

• China No.1 in IC package and test
• Intel sells Wind River to TPG
• Apple and TSMC starting Apple Watch MicroLED display mass production later this year
• TSMC advanced packaging seen crucial for HPC chips
• SMIC profit falls 52%
• IP-Maker to launch new NVMe host IP Family
• Global Semiconductor Sales Up 21 Percent Year-to-Year in February
• Imagination Technologies Group Ltd. Announces CEO Succession

Sunday, April 1, 2018

• SiFive Secures $50.6 Million Funding to Advance RISC-V Based Semiconductors
• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Santa Clara 2018
• Excluded from M&A, China Focuses on Expansion
• eMemory, Europractice IC Service form eNVM IP partnership

Thursday, March 29, 2018

• SMIC Announces 2017 Annual Results
• Mobile Semiconductor Introduces 40nm ULP Memory Compiler Support
• Silex Inside releases a high throughput, scalable and performant MACsec engine

Wednesday, March 28, 2018

• EU Project Delivers Open-Source Simulator for Cyber-Physical Systems
• CoreHW partners with GLOBALFOUNDRIES in RF Ecosystem Program
• Cryptocurrency mining demand sucking up TSMC IC production
• Samsung commits to AI R&D in France
• Synopsys Webinar: Getting More From Your IP Vendor
• Killer Apps Driving Adoption of USB 3.1 Gen 2

Wednesday, March 28, 2018

• The Alliance for Open Media Kickstarts Video Innovation Era with "AV1" Release

Tuesday, March 27, 2018

• The Alliance for Open Media Kickstarts Video Innovation Era with
• Chip Equipment Sales Remain Strong
• NVIDIA and Arm Partner to Bring Deep Learning to Billions of IoT Devices
• Mindtree announces BQB qualification of its Bluetooth Mesh v1.0 Software Stack and EtherMind Bluetooth v5.0 Software Stack & Profiles