Search News

Tuesday, February 20, 2018

• Samsung Electronics and Qualcomm Expand Foundry Cooperation on EUV Process Technology
• Broadcom reduces bid for Qualcomm
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2018
• Integrated Circuit Technology Advances Continue to Amaze
• Vidatronic, Inc. Awarded National Science Foundation Grant for the Development of High Performance CMOS Transmitters for Wireless Applications
• SoC-e's MTSN Switch IP Core solution now supports 802.1AB (LLDP)
• AdaSky, STMicroelectronics enhance visual acuity of cars
• Cadence to Showcase Verification Suite at DVCon 2018
• Arm delivers integrated SIM identity to secure next wave of cellular IoT devices
• FD-SOI Adoption Expands
• TSMC remained top local patent applicant last year
• Samsung building new 7nm foundry plant to catch up with TSMC
• 48 Arteris IP Engineers Attain ISO 26262 Functional Safety Practitioner Certification by exida

Monday, February 19, 2018

• Samsung Electronics Begins Mass Production of Industry's Largest Capacity SSD - 30.72TB - for Next-Generation Enterprise Systems
• Arm Cortex-M3 processor - the core of the Internet of Things (IoT)
• Synopsys offers a range of security solutions-Securing embedded SIMs
• CEVA Announces Industry's First 802.11ax Wi-Fi IPs
• UltraSoC and Lauterbach RISC-V collaboration furthers vendor-neutral debug and development environment
• Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized, Low Power Mid-Range PolarFire FPGAs at Embedded World
• Qualcomm Enters into Amended Definitive Agreement with NXP
• QuickLogic Announces Partnership with Aldec for eFPGA Simulation Flow
• PRO DESIGN Introduces Zynq UltraScale+ Based FPGA SoC and IP Prototyping Platform

Sunday, February 18, 2018

• Will China Succeed In Memory?
• Prototyping board simplifies Zynq UltraScale+ multi-processor verification
• Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017

Saturday, February 17, 2018

• 8 Trends of IoT in 2018

Thursday, February 15, 2018

• What does a Deep Learning Chip look like
• Forward Thinking Blog The Promises and Challenges of EUV at GlobalFoundries

Wednesday, February 14, 2018

• OneSpin Announces Immediate Availability of OneSpin 360 EC-FPGA Tool Qualification Kit Certified for ISO 26262, IEC 61508, EN 50128
• Silicon Library Adopts Averant's Solidify Automated Checks Using CDC Inc. EDA Cloud Services
• Synopsys to Showcase its Industry Leading Electronic Design, IP, and Software Security Solutions at Embedded World 2018
• Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
• A leading provider in embedded IP solutions is looking for a representative in South East Asia for security and video IP.
• Smartphone market to show weak growth in 2018
• Synopsys Webinar : Optimizing Analog Sensor Interfaces with Integrated Data Converter IP
• Moortec Appoints Mark Davitt ex Sidense Sales Director to grow PVT Monitoring Sales in North America
• Machine learning interview with Jem Davies of Arm

Wednesday, February 14, 2018

• Qualcomm Preps Silicon as a Service

Wednesday, February 14, 2018

• Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset

Tuesday, February 13, 2018

• 3 Design Aspects you shouldn't miss while building an NB-IoT Protocol Stack
• SiFive Appoints CFO to Executive Team
• Qualcomm Announces a New LTE IoT Software Development Kit in Support of the Commercialization of Internet of Things Solutions Using Cellular Connectivity
• Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset
• MIPS and NetSpeed Partner to Deliver Solutions for AI and ML SoCs
• ASICs Unlock Deep Learning Innovation: Live Seminar in Silicon Valley
• Solid State System Co., Ltd. selects Andes AndesCore N9 for Its SSS6131 USB 3.1 Gen 1 Flash Controller Highly Demand for Storage Application
• IntelliProp Announces Q1 2018 Release of Gen-Z IP Cores Supporting Rev 1.0 Specification
• VESA Highlights Growing Adoption of DisplayPort over USB-C, New Codec for Handheld Device-Specific Display Interface Compression at Mobile World Congress
• Gen-Z Consortium Announces the Public Release of its Core Specification 1.0

Monday, February 12, 2018

• Europe rises as chip market grew 21.6% in 2017
• Lattice Semiconductor Reports Fourth Quarter and Full Year 2017 Results
• Dolphin Integration Appoints Christian Dupont as CEO
• Unexpected Help for Simulation from Machine Learning
• Inomize is Appointed as TSMC Value Chain Aggregator (VCA) Partner
• Silvaco to Showcase Platform Products at Embedded World 2018
• TSMC Board of Directors Proposes NT$8 Cash Dividend per Share
• Arm's Project Trillium Offers the Industry's Most Scalable, Versatile ML Compute Platform

Sunday, February 11, 2018

• The Value Of Trust
• SMIC to enter volume production of 28nm HKMG chips in 2H18
• New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
• UMC Reports Sales for January 2018
• TSMC January 2018 Revenue Report
• Intrinsic ID to Demonstrate Hardware Root of Trust for IoT Security at Embedded World
• Defacto Technologies Announces Synapse Design in collaboration with a major semiconductor company Reduces Simulation Time by 5X When using Defacto's RTL Design Solutions
• Synopsys Expands Photonic Design Solution with the Acquisition of PhoeniX Software

Thursday, February 8, 2018

• TSMC-linked chipmaker weighs new plant as supply tightens
• China's SMIC vows to advance technology despite flagging profits