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Sunday, February 25, 2018

• Qualcomm and Broadcom agree non-price-related conditions of takeover
• The hierarchical architecture of an embedded FPGA
• Sequans Introduces New NB-IoT Only Platform: Monarch N
• Inside Secure to Provide Secure Provisioning Solutions to ALi Corporation
• Metrics Partners with Avery to Expand Cloud Verification with Robust VIP Portfolio
• Synopsys Delivers Industry's First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage
• IAR Systems enables high-performance machine learning based on latest neural network library from Arm
• CEVA Extends its IP Platforms for Bluetooth and Wi-Fi with RISC-V
• North American Semiconductor Equipment Industry Posts January 2018 Billings
• CEO interview: Flex Logix' Geoff Tate on licensing FPGA
• Magillem Partners with Imperas
• Avery Design Systems Announces SimXACT 5.0 for Improved X-Verification
• Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
• Dream Chip Technologies Demonstrates Superior Power Efficiency with Automotive Driver Assistance SoC on GLOBALFOUNDRIES 22FDX Technology
• Intel Ships Industry's First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV
• Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications
• CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors
• Qualcomm Taps Samsung's 7nm EUV for 5G
• Goodix Announces Entry into the Growing NB-IoT Market with Its Acquisition of German-Based CommSolid
• Ceragon License CEVA DSPs for Full 5G Wireless Backhaul
• RISC-V Gains Its Footing
• AMIQ EDA Announces its Design and Verification Tools Eclipse IDE Supports Cadence Perspec System Verifier using System Level Notation

Thursday, February 22, 2018

• Samsung Electronics Breaks Ground on New EUV Line in Hwaseong

Wednesday, February 21, 2018

• Semiconductor Industry 8-Point Policy Plan for 2018
• WuQi Technologies is the latest licensee of CCww's NB-IoT UE protocol-stack software
• Gartner Says Worldwide Sales of Smartphones Recorded First Ever Decline During the Fourth Quarter of 2017
• CEVA Introduces PentaG - A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices
• SecureRF to Showcase Future-Proof Security Solutions for Low-Resource Processors at Embedded World 2018
• PSA: Next steps toward a common industry framework for secure IoT
• CEVA Introduces PentaG™ - A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices
• New Arm Mbed IoT Device Platform capabilities enable companies to get more from their data

Tuesday, February 20, 2018

• Samsung Electronics and Qualcomm Expand Foundry Cooperation on EUV Process Technology
• Broadcom reduces bid for Qualcomm
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2018
• Integrated Circuit Technology Advances Continue to Amaze
• Vidatronic, Inc. Awarded National Science Foundation Grant for the Development of High Performance CMOS Transmitters for Wireless Applications
• SoC-e's MTSN Switch IP Core solution now supports 802.1AB (LLDP)
• AdaSky, STMicroelectronics enhance visual acuity of cars
• Cadence to Showcase Verification Suite at DVCon 2018
• Arm delivers integrated SIM identity to secure next wave of cellular IoT devices
• FD-SOI Adoption Expands
• TSMC remained top local patent applicant last year
• Samsung building new 7nm foundry plant to catch up with TSMC
• 48 Arteris IP Engineers Attain ISO 26262 Functional Safety Practitioner Certification by exida

Monday, February 19, 2018

• Samsung Electronics Begins Mass Production of Industry's Largest Capacity SSD - 30.72TB - for Next-Generation Enterprise Systems
• Arm Cortex-M3 processor - the core of the Internet of Things (IoT)
• Synopsys offers a range of security solutions-Securing embedded SIMs
• CEVA Announces Industry's First 802.11ax Wi-Fi IPs
• UltraSoC and Lauterbach RISC-V collaboration furthers vendor-neutral debug and development environment
• Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized, Low Power Mid-Range PolarFire FPGAs at Embedded World
• Qualcomm Enters into Amended Definitive Agreement with NXP
• QuickLogic Announces Partnership with Aldec for eFPGA Simulation Flow
• PRO DESIGN Introduces Zynq UltraScale+ Based FPGA SoC and IP Prototyping Platform

Sunday, February 18, 2018

• Will China Succeed In Memory?
• Prototyping board simplifies Zynq UltraScale+ multi-processor verification
• Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017

Saturday, February 17, 2018

• 8 Trends of IoT in 2018

Thursday, February 15, 2018

• What does a Deep Learning Chip look like
• Forward Thinking Blog The Promises and Challenges of EUV at GlobalFoundries

Wednesday, February 14, 2018

• OneSpin Announces Immediate Availability of OneSpin 360 EC-FPGA Tool Qualification Kit Certified for ISO 26262, IEC 61508, EN 50128
• Silicon Library Adopts Averant's Solidify Automated Checks Using CDC Inc. EDA Cloud Services
• Synopsys to Showcase its Industry Leading Electronic Design, IP, and Software Security Solutions at Embedded World 2018
• Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
• A leading provider in embedded IP solutions is looking for a representative in South East Asia for security and video IP.
• Smartphone market to show weak growth in 2018
• Synopsys Webinar : Optimizing Analog Sensor Interfaces with Integrated Data Converter IP
• Moortec Appoints Mark Davitt ex Sidense Sales Director to grow PVT Monitoring Sales in North America
• Machine learning interview with Jem Davies of Arm

Wednesday, February 14, 2018

• Qualcomm Preps Silicon as a Service

Wednesday, February 14, 2018

• Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset

Tuesday, February 13, 2018

• 3 Design Aspects you shouldn't miss while building an NB-IoT Protocol Stack
• SiFive Appoints CFO to Executive Team
• Qualcomm Announces a New LTE IoT Software Development Kit in Support of the Commercialization of Internet of Things Solutions Using Cellular Connectivity
• Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset
• MIPS and NetSpeed Partner to Deliver Solutions for AI and ML SoCs
• ASICs Unlock Deep Learning Innovation: Live Seminar in Silicon Valley
• Solid State System Co., Ltd. selects Andes AndesCore N9 for Its SSS6131 USB 3.1 Gen 1 Flash Controller Highly Demand for Storage Application
• IntelliProp Announces Q1 2018 Release of Gen-Z IP Cores Supporting Rev 1.0 Specification
• VESA Highlights Growing Adoption of DisplayPort over USB-C, New Codec for Handheld Device-Specific Display Interface Compression at Mobile World Congress
• Gen-Z Consortium Announces the Public Release of its Core Specification 1.0