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Tuesday, January 9, 2018
Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology
The lofty rise of the lowly FPGA
Apple supplier TSMC posts 3% annual sales increase
TSMC December 2017 Revenue Report
Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development
MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications
Tuesday, January 9, 2018
CEVA Unveils NeuPro - A Family of AI Processors for Deep Learning at the Edge
Tuesday, January 9, 2018
Dolphin Integration paves the way for the next generation of Digital microphones "CoolMic"
Tuesday, January 9, 2018
BaySand expands its "Programmable-In-ASIC" initiative with Efinix Quantum programmable accelerator technology
Monday, January 8, 2018
IFI CLAIMS Announces 2017 Top U.S. Patent Recipients
Solar wafer production to see over-capacity by year-end 2018
China, Samsung Rise in U.S. Patents
UMC Reports Sales for December 2017
videantis introduces new processor and tools for deep learning
Microsemi and Future Electronics Announce Avalanche Board for Designing with Microsemi's PolarFire FPGAs
eSilicon announces 7nm FinFET ASIC design win
Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Chips
Memory differences remain as ST chooses Globalfoundries for FDSOI
NVM Express Set for Busy 2018
STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership
Arm Webinar - A guide to securing your IoT device with Arm TrustZone for Cortex-M
on Jan 31, 2018
Monday, January 8, 2018
Wi-Fi Alliance introduces security enhancements
Sunday, January 7, 2018
BaySand expands its 'Programmable-In-ASIC' initiative with Efinix Quantum programmable accelerator technology
Wi-Fi Alliance introduces security enhancements and new features for Wi-Fi Protected Access
CEVA Introduces ClearVox - Advanced Software Package Providing Enhanced Speech Intelligibility for Voice-Enabled Devices
Dolphin Integration paves the way for the next generation of Digital microphones
Flex Logix Names Valy Ossman Technical Director, Solutions Architecture
GUC Monthly Sales Report - Dec 2017
Moortec Opens New European Design Centre in Poland
Faraday Monthly Consolidated Sales Report - December 2017
Sankalp Semiconductor expands internationally with its operations in Malaysia
Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs
Thursday, January 4, 2018
Chip Sales Grew 22% in 2017, Gartner Says
Startup tapes out MRAM-based MCU demo for IoT
Xilinx Appoints Victor Peng As President And Chief Executive Officer
WiLAN Reaches IP Framework Agreement with TSMC
Fabless IC Company Sales Top $100 Billion for First Time Ever
Xilinx CEO Moshe Gavrielov Announces Retirement
Wednesday, January 3, 2018
Gartner Says Worldwide Semiconductor Revenue Grew 22.2 Percent in 2017; Samsung Takes Over No. 1 Position
UltraSoC appoints Aileen Smith as Chief Strategy Officer
AImotive, Leading Provider of Camera-First Autonomous Driving Technology, Raises $38 Million USD Series C
MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest USB Type-C Connectors
Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications and Richer Multimedia Content
Smartphone Production Projected to Increase 5%
TSMC to outpace Samsung in 7nm volume production in 2018
Tuesday, January 2, 2018
Himax Technologies, Inc. to Attend CES on January 8th - 10th , 2018
Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification
Qualcomm's New Spectra ISP and Camera Modules Enable Nextgen AR
OmniVision's First 0.9 Micron Pixel Image Sensor Family Enables Best-in-Class Performance and Features for High-End Smartphones
CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester
Global Semiconductor Sales Increase 21.5 Percent Year-to-Year in November
NGCodec Closes $8M Series A, Launches Live Broadcast H.265/HEVC Cloud Video Encoding and Demonstrates Cloud VR
Tuesday, January 2, 2018
FujiFilm Adopts DMP's Graphics IP Core "SMAPH-H"
Monday, January 1, 2018
Samsung, Micron, and NVIDIA Are 2017's Biggest Winners
Baidu Selects ON Semiconductor Image Sensors for its Apollo Autonomous Driving Platform
China major AI chipmakers maintain partnerships with TSMC
Faraday Signs Satris Group as Its Israeli Distributor
eVaderis Completes Tape-Out of Innovative MRAM-Based, Memory-Centric MCU Demonstrator for Next-Generation IoT Applications
Arrow Accelerates IoT Leadership Position with eInfochips Acquisition
DSP Group, Emza and Himax Announce Industry's First AI based Human Presence IoT Visual Sensor for Consumer Appliances and Industrial Applications
Sunday, December 31, 2017
Silicon Valley AI Chip Startup Gyrfalcon Technology Competes with Intel with its Newly Launched USB Stick
Friday, December 29, 2017
AMD: At 45 nm and beyond ICs require high level HW/SW tools
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