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Sunday, February 11, 2018

• The Value Of Trust
• SMIC to enter volume production of 28nm HKMG chips in 2H18
• New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
• UMC Reports Sales for January 2018
• TSMC January 2018 Revenue Report
• Intrinsic ID to Demonstrate Hardware Root of Trust for IoT Security at Embedded World
• Defacto Technologies Announces Synapse Design in collaboration with a major semiconductor company Reduces Simulation Time by 5X When using Defacto's RTL Design Solutions
• Synopsys Expands Photonic Design Solution with the Acquisition of PhoeniX Software

Thursday, February 8, 2018

• TSMC-linked chipmaker weighs new plant as supply tightens
• China's SMIC vows to advance technology despite flagging profits

Wednesday, February 7, 2018

• MIPI Alliance Releases MIPI UniPro v1.8 with Increased Performance and Improved Quality of Service
• Credo Demonstrates Robust 112G PAM4 Single Lane Electrical SerDes Techology at DesignCon 2018
• SMIC Reports 2017 Fourth Quarter Results
• Faraday Reports Gross Margin 54.6% for 4Q2017, Reaches 10-Year High 2017 EPS of NT$3.40 on Revenues of 5.34bn
• M31 and Innovative Logic USB 3.1 Gen 2 IP got Certification from USB-IF
• Samsung Begins Mass Production of 256GB Embedded Universal Flash Storage for Automotive Applications

Tuesday, February 6, 2018

• Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems
• Samsung and Cisco Team With Orange for First Multi-Vendor 5G Fixed Wireless Trial in Europe
• Aldec Launches Novel FPGA-based Networking Solution
• SiFive Launches World's First Linux-Capable RISC-V Based SoC
• SoC-e releases IEC 61850/62351 SASCrypt IP Core
• Faraday Monthly Consolidated Sales Report - January 2018
• NetSpeed and Synopsys Collaborate to Enable Early Architectural Exploration of Advanced ADAS and Datacenter SoCs
• NetSpeed Collaborates with Cadence to Optimize IP for Advanced Automotive SoC Designs
• Malta Tour Shows GF Rising
• Arm acquires ChaoLogix for security reasons

Tuesday, February 6, 2018

• Synopsys Announces Verification IP and Test Suite for Arm AMBA ACE5 and AXI5

Tuesday, February 6, 2018

• RISC-V processor Mr Wolf arrives to solve problems

Tuesday, February 6, 2018

• Annual Silicon Volume Shipments Remain at Record Highs

Tuesday, February 6, 2018

• Maxim Selects Methodics as IP Lifecyle Management Platform to Enable Enterprise IP-Centric Design Approach Across Global Design Network

Tuesday, February 6, 2018

• Taiwanese IP Firm Bets on Crypto Technology

Monday, February 5, 2018

• Samsung's ISOCELL Dual Software Solution Enables Dual Camera Features in a Wider Range of Smartphones
• Samsung, Apple bought 19.5% of global chip supply in 2017
• Semiconductor shipments set to exceed 1 trillion devices in 2018
• Eta raises funds for spiking neural networks
• Microsemi's Libero SoC Development Software Now Certified for IEC 61508 Functional Safety Requirements
• Taiwanese IP Firm Bets on Crypto Technology to continue the company's strong growth as security issues in the semiconductor industry
• CEVA, Inc. Announces Fourth Quarter and Year End 2017 Financial Results
• Broadcom Presents Best and Final Offer for Qualcomm of $82.00 Per Share
• RISC-V processor Mr Wolf arrives to solve problems, This processor core is written in System Verilog

Monday, February 5, 2018

• Annual Semiconductor Sales Increase 21.6 Percent, Top $400 Billion for First Time

Sunday, February 4, 2018

• AI-Leader Horizon Robotics Selects NetSpeed AI-based NoC IP For Next Generation Designs
• Samsung's processors to displace Qualcomm's in Audis, suggests report
• GlobalFoundries to Soon Pilot 7nm and EUV Production
• Sonics NoC Customer Starblaze Technology Reaches Volume Production With STAR1000 SSD Controller SoC
• Can Ex-Intel President Succeed with Old ARM SoC?
• GUC Monthly Sales Report - Jan 2018
• Sankalp Semiconductor opens a New Design Center in Ahmedabad
• Ampere Launches to Accelerate Hyperscale Cloud Computing Innovations
• intoPIX & Macnica Technology revolutionize AV signal distribution at ISE 2018: Integrating the new ST 2110 standards with intoPIX ultra-low latency compression technologies
• Xilinx to Showcase 8K and AV over IP Solutions at ISE 2018

Friday, February 2, 2018

• Mobile System on Chip Designs, Embedded Processing Lift MPU Market

Friday, February 2, 2018

• Chip Heads Gauge Silicon Roadmap

Friday, February 2, 2018

• NVM Express, Inc. Elects Cavium, Cisco, Dell, Facebook, Intel, Microsemi and NetApp to Promoter Board for 2018

Wednesday, January 31, 2018

• Metrics Announces Pay-by-Minute Cloud Simulator & Verification Manager
• Cadence Reports Fourth Quarter and Fiscal Year 2017 Financial Results
• Integrate ADAS Domain Controllers with Automotive IP
• Optimizing SMIC 40LL & 40ULP Designs for Speed & Energy Efficiency
• CAST Adds DO-254 Avionics Interface Cores though New Partnership with Nolam
• CAST Automotive Interconnect Challenges

Tuesday, January 30, 2018

• AI Expands Role in Design
• Qualcomm and Samsung Announce Expanded Strategic Relationship
• Faraday profits hit 5-year high in 2017
• Synopsys has collaborated with Arm to deliver the next-generation ACE5 and AXI5 VIP with increased performance for faster verification closure.
• Silex Inside releases JPEG 2000 AV over IP OEM boards
• New Silicon Device Solutions from Omnitek
• JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) Version 3.0 and UFS Card Extension Version 1.1
• Movellus Announces "True Digital" PLL, DLL, & LDO Generators
• Movellus Launches with Focus on Advancing Digital Design Tools to Implement Analog Functionality

Tuesday, January 30, 2018

• Horizon Robotics Licenses NetSpeed Interconnect IP for AI SoCs

Tuesday, January 30, 2018

• Xylon announces Motion JPEG Encoder