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Tuesday, November 28, 2017

• Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
• Transphorm raises $15m from major customer for GaN develeopment
• Texas Instruments announces integration of its SimpleLink™ MCU platform with new Amazon FreeRTOS for quick cloud connectivity
• STMicroelectronics Collaborates with Amazon Web Services on Complete STM32-Based IoT Node-to-Cloud Solution for Amazon FreeRTOS
• Lattice Simplifies Audio Connectivity and Improves Performance with HDMI 2.1 Enhanced Audio Return Channel (eARC) Solutions
• Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
• Intrinsic ID Names Alpesh Saraiya as Senior Director Product Management
• Cadence Announces Availability of Industry's First PCI Express 5.0 Verification IP
• Lattice will migrate products to FDSOI
• Western Digital To Accelerate The Future Of Next-Generation Computing Architectures For Big Data And Fast Data Environments
• SiFive Joins FDXcelerator Program to Bring RISC-V Core IP to GLOBALFOUNDRIES' 22FDX Process Technology
• Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning, based on the open RISC-V standard

Monday, November 27, 2017

• Siemens set to buy EDA firm Solido
• CEA-Leti Moves Fast on New CEO
• Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents
• Intrinsix Cryptographic IP Selected by DARPA for Use in Chips Program, Featuring RISC-V Security Processor
• Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Grenoble 2017
• Digital Blocks DB9000 Display Controller & Processor IP Core Family Extends Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, AR/VR Headsets, Wearables, Signage, and Cinema Applications
• Titan IC lauches "Hyperion F1 10G RegEx File Scan" on AWS Marketplace
• TTTech collaborates with Intel to develop FPGA-based TSN solution for Industrial Automation
• Codasip Announces Bk5-64, a New 64-bit RISC-V Processor
• Amazon Web Services Names Intrinsic ID Advanced Tier Technology Partner in AWS Partner Network
• Minima Processor Reduces SoC Energy Consumption for Near-Threshold Voltage Design
• Inside Secure Selected by Neopost to Protect Online Postage Transactions
• EnSilica's RADAR Imaging Co-processor addresses problem of automotive data overload to accelerate development of self-drive cars
• SiFive and Microsemi Expand Relationship with Strategic Roadmap Alignment and a Linux-Capable, RISC-V Development Board
• HDMI Forum Releases Version 2.1 of the HDMI Specification

Sunday, November 26, 2017

• SkyWater acquires specialty foundry business

Wednesday, November 22, 2017

• GUC Announces Nanjing Office Opening
• Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost

Tuesday, November 21, 2017

• 7nm SERDES Design and Qualification Challenges!
• Soitec Tunes Wafers for RF, Imagers, Photonics
• Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost
• Analyst Warns on Semiconductor Stock Valuations
• Cybertrust Japan Selects CryptoManager IoT Security Service from Rambus
• North American Semiconductor Equipment Industry Posts October 2017 Billings

Monday, November 20, 2017

• Startup Breathes Life into Bio IoT
• Microsemi Announces IEEE 1588 Timing Synchronization Module Providing High Performance Network Clock Synchronization
• Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications
• Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
• Overall GPU shipments increased 9.3% from last quarter, AMD increased 8% Nvidia increased 30%
• 成功案例 新思科技与AMD
• 2017年全球60家潜力新创公司榜单出炉：谁能成为下一个Intel或Arm？
• ICCAD 2017 向建军： IoT浪潮下的机遇和挑战|锐成芯微现场
• Marvell宣布以60亿美元收购竞争对手Cavium
• 2017全球半导体排名洗牌：三星取代英特尔成龙头
• Siemens strengthens IC market commitment with acquisition of Solido Design Automation

Monday, November 20, 2017

• Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP

Sunday, November 19, 2017

• Synopsys宣布在中国设立战略投资基金
• 华为基于Xilinx的云服务器于2017 超算大会首秀北美市场 专为大规模加速云计算
• 被对手举报 台积电证实正遭欧盟反垄断调查
• Sankalp Semiconductor receives STPI Highest Exporter award
• GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
• iPhone X's TrueDepth Module Dissected
• Truechip and Uniquify Achieve Sign-off Verification of DDR Interface IP
• Andes Announces Advanced SoC Development Environments for V5 AndesCore N25 and NX25 Processors with Tool Partners
• Argonne to install Comanche system to explore Arm technology for high-performance computing
• AI to Spur Uptick in ASIC Design Starts
• Cadence Appoints Anirudh Devgan as President
• Synapse Design Acquires Tech Vulcan to Address Fast Growth and Provide Increased Customer Access to Design Centers
• Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017
• Embedded Tools provider Ashling joins RISC-V Foundation
• Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores
• Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17
• Marvell and Cavium to Combine Creating an Infrastructure Solutions Powerhouse