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Tuesday, November 28, 2017
Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
Transphorm raises $15m from major customer for GaN develeopment
Texas Instruments announces integration of its SimpleLink™ MCU platform with new Amazon FreeRTOS for quick cloud connectivity
STMicroelectronics Collaborates with Amazon Web Services on Complete STM32-Based IoT Node-to-Cloud Solution for Amazon FreeRTOS
Lattice Simplifies Audio Connectivity and Improves Performance with HDMI 2.1 Enhanced Audio Return Channel (eARC) Solutions
Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
Intrinsic ID Names Alpesh Saraiya as Senior Director Product Management
Cadence Announces Availability of Industry's First PCI Express 5.0 Verification IP
Lattice will migrate products to FDSOI
Western Digital To Accelerate The Future Of Next-Generation Computing Architectures For Big Data And Fast Data Environments
SiFive Joins FDXcelerator Program to Bring RISC-V Core IP to GLOBALFOUNDRIES' 22FDX Process Technology
Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning, based on the open RISC-V standard
Monday, November 27, 2017
Siemens set to buy EDA firm Solido
CEA-Leti Moves Fast on New CEO
Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents
Intrinsix Cryptographic IP Selected by DARPA for Use in Chips Program, Featuring RISC-V Security Processor
Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Grenoble 2017
Digital Blocks DB9000 Display Controller & Processor IP Core Family Extends Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, AR/VR Headsets, Wearables, Signage, and Cinema Applications
Titan IC lauches "Hyperion F1 10G RegEx File Scan" on AWS Marketplace
TTTech collaborates with Intel to develop FPGA-based TSN solution for Industrial Automation
Codasip Announces Bk5-64, a New 64-bit RISC-V Processor
Amazon Web Services Names Intrinsic ID Advanced Tier Technology Partner in AWS Partner Network
Minima Processor Reduces SoC Energy Consumption for Near-Threshold Voltage Design
Inside Secure Selected by Neopost to Protect Online Postage Transactions
EnSilica's RADAR Imaging Co-processor addresses problem of automotive data overload to accelerate development of self-drive cars
SiFive and Microsemi Expand Relationship with Strategic Roadmap Alignment and a Linux-Capable, RISC-V Development Board
HDMI Forum Releases Version 2.1 of the HDMI Specification
Sunday, November 26, 2017
SkyWater acquires specialty foundry business
Wednesday, November 22, 2017
GUC Announces Nanjing Office Opening
Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost
Tuesday, November 21, 2017
7nm SERDES Design and Qualification Challenges!
Soitec Tunes Wafers for RF, Imagers, Photonics
Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost
Analyst Warns on Semiconductor Stock Valuations
Cybertrust Japan Selects CryptoManager IoT Security Service from Rambus
North American Semiconductor Equipment Industry Posts October 2017 Billings
Monday, November 20, 2017
Startup Breathes Life into Bio IoT
Microsemi Announces IEEE 1588 Timing Synchronization Module Providing High Performance Network Clock Synchronization
Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications
Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time
Overall GPU shipments increased 9.3% from last quarter, AMD increased 8% Nvidia increased 30%
成功案例 新思科技与AMD
2017年全球60家潜力新创公司榜单出炉:谁能成为下一个Intel或Arm?
ICCAD 2017 向建军: IoT浪潮下的机遇和挑战|锐成芯微现场
Marvell宣布以60亿美元收购竞争对手Cavium
2017全球半导体排名洗牌:三星取代英特尔成龙头
Siemens strengthens IC market commitment with acquisition of Solido Design Automation
Monday, November 20, 2017
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
Sunday, November 19, 2017
Synopsys宣布在中国设立战略投资基金
华为基于Xilinx的云服务器于2017 超算大会首秀北美市场 专为大规模加速云计算
被对手举报 台积电证实正遭欧盟反垄断调查
Sankalp Semiconductor receives STPI Highest Exporter award
GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
iPhone X's TrueDepth Module Dissected
Truechip and Uniquify Achieve Sign-off Verification of DDR Interface IP
Andes Announces Advanced SoC Development Environments for V5 AndesCore N25 and NX25 Processors with Tool Partners
Argonne to install Comanche system to explore Arm technology for high-performance computing
AI to Spur Uptick in ASIC Design Starts
Cadence Appoints Anirudh Devgan as President
Synapse Design Acquires Tech Vulcan to Address Fast Growth and Provide Increased Customer Access to Design Centers
Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017
Embedded Tools provider Ashling joins RISC-V Foundation
Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores
Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17
Marvell and Cavium to Combine Creating an Infrastructure Solutions Powerhouse
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