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Sunday, December 31, 2017

• Silicon Valley AI Chip Startup Gyrfalcon Technology Competes with Intel with its Newly Launched USB Stick

Friday, December 29, 2017

• AMD: At 45 nm and beyond ICs require high level HW/SW tools

Wednesday, December 27, 2017

• Globalfoundries gearing up to tap lucrative automotive chip market
• Arastu Systems enhances outreach with the establishment of its Global Sales Channel
• Xylon's Innovations at CAR-ELE Japan

Tuesday, December 26, 2017

• Intel fails to match TI's 25 year record as No.1

Thursday, December 21, 2017

• "The Year of the eFPGA" 2017 Recap
• Qualcomm's Snapdragon 855 Will Be Manufactured Using TSMC's 7nm Node; Chip Giant Will Return To Samsung In 2019
• Chipus Microelectronics receives ISO 9001 certification

Wednesday, December 20, 2017

• Engineer Spotlight: Shafy Eltoukhy, Head of SiFive's DesignShare Program
• M31 Technology launches the world's first 28nm certified USB 3.1 Gen 2 IP solution with Corigine
• The Deals and No Deals that shaped 2017
• QuickLogic to Demonstrate Sensor Processing and eFPGA Solutions at CES 2018
• NXP and Baidu Partner on Apollo Open Autonomous Driving Platform
• Rambus Renews Patent License Agreement with Panasonic
• Microchip releases COTS-based rad-tolerant solution
• Moortec: The Implementation of Embedded PVT Monitoring Subsystems in Today's Cutting Edge Technologies.
• 2017 Top Ten Foundries: TSMC, GLOBALFOUNDARIES, UMC, SAMSUNG and SMIC are ranked the top 5
• UMC Announces Availability of 40nm SST Embedded Flash Process

Tuesday, December 19, 2017

• Aggressive Push into New Growth Markets the "New Normal" at Intel
• Semiconductor Equipment Sales Back on the Rise
• Samsung to Unveil Wall-Mountable Lifestyle Soundbar at CES 2018
• Khronos Group Releases NNEF 1.0 Standard for Neural Network Exchange
• Samsung in Production of Second-gen 10nm DRAM