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Wednesday, November 15, 2017

• Socionext Starts Offering Graphics IP "SEERIS"

Wednesday, November 15, 2017

• SMIC Reports 2017 Third Quarter Results

Wednesday, November 15, 2017

• Will Samsung's 2017 Semi Capex Deliver Knockout Blow to Competition?

Wednesday, November 15, 2017

• VESA Rolls Out DisplayID Version 2.0 Standard to Optimize Plug-and-Play Connectivity for Leading-Edge Displays

Wednesday, November 15, 2017

• PA Semi, Apple "Interconnect" at Startup

Tuesday, November 14, 2017

• UltraSoC立足于提供通用智能SoC 基础架构IP，意在挑战行业独大
• Inside Secure Unveils Industry's First Root-of-Trust Solution based on RISC-V Processor
• Inside Secure Joins RISC-V Foundation
• Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC
• Samsung's Capex Seen Crushing Memory Startups
• Inuitive Adopts Synopsys' Embedded Vision Processor IP to Accelerate Computer Vision and Deep Learning Algorithms
• Green Hills ups spec for safety-critical C/C++ compilers
• GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions

Tuesday, November 14, 2017

• Analog Bits to Provide Precision PLL and SERDES IP to DesignShare for SiFive Freedom Platform

Tuesday, November 14, 2017

• Spin Transfer Technologies Announces Allowance of U.S. Patent For Next-Gen MRAM

Tuesday, November 14, 2017

• UMC Reports Sales for October 2017

Tuesday, November 14, 2017

• S3 Semiconductors Expands Sales Rep Network

Tuesday, November 14, 2017

• SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard

Tuesday, November 14, 2017

• Broad/Qual/NXP Battle Begins

Tuesday, November 14, 2017

• Sequoia backs Graphcore as the future of Artificial Intelligence processors

Tuesday, November 14, 2017

• Intel countersues Transmeta, say reports

Monday, November 13, 2017

• Andes Technology N9 CPU Designed in Customer's SoC Shipping in Home Smart Speaker Artificial Intelligence Device
• Rambus Selects Codasip Studio for SDK Development of RISC-V Processor
• UltraSoC selected by Microsemi for growing RISC-V product range
• Kilopass Achieves 1000-Hour Qualification on Mie Fujitsu Semiconductor Highly Demanded 40nm Low Power Process
• Faraday Technology will exhibit IoT SoC development platform and high-speed interface at ICCAD 2017
• Cray building Arm-based supercomputer
• Qualcomm officially rejected the acquisition, Broadcom said it would not give up
• Strong competitor of Arm -- a small company from Cambridge

Monday, November 13, 2017

• TSMC October 2017 Revenue Report

Sunday, November 12, 2017

• Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
• Automotive Seen as Strongest Semiconductor Driver Through 2021
• Cadence and Synopsys localized their company in Nanjing, China. Nanjing will be the next Chip Center of China?
• China Passes U.S. in Supercomputers
• US Synopsys Releases 2017 Coverity Scan Report Shows Plenty of Open Source Software Projects Implement Security Plans
• Arm Launches New Platform Security Framework PSA for IoT Products
• Samsung Shows EUV Design at ISSCC
• Synopsys and CEA Announce Partnership to Develop Emulation Solutions for Automotive Applications
• Announcing the Opening of the Global Unichip Corporation Tainan Office
• Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet Transport Applications

Saturday, November 11, 2017

• SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative

Thursday, November 9, 2017

• 台積公司2017年10月營收報告

Wednesday, November 8, 2017

• EasyIC announces it is now a member of the Xilinx Alliance Program
• Embedded FPGA IP is going to soar, how do chip design engineers choose?
• Growth in automotive brings videantis third Deloitte Technology Fast 50 award
• UMC Reports Sales for October 2017
• Barco Silex Partners with Intrinsic ID for North American Representation
• Power Efficient Implementation of CommSolid's CSN130 NB-IoT IP Solution Supported by Zephyr RTOS
• Videantis wins third Deloitte Technology Fast 50 award

Wednesday, November 8, 2017

• The quandary of EDA software piracy

Wednesday, November 8, 2017

• CAST adds H.264 Main Profile Video Encoder Core to Compression IP Family

Wednesday, November 8, 2017

• CAST Full Hardware UDP/IP Stack Core Simplifies Streaming Media Over IP Networks

Wednesday, November 8, 2017

• Ultra-Low Latency H.264 Video Encoding Now Available from CAST

Wednesday, November 8, 2017

• Spectral Edge appoints new CTO, accelerating development of smartphone imaging technology

Wednesday, November 8, 2017

• Veriest announces expansion in Europe and opens new offices in Serbia

Wednesday, November 8, 2017

• Third Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; another Quarterly Record

Wednesday, November 8, 2017

• Faraday Monthly Consolidated Sales Report - October 2017

Tuesday, November 7, 2017

• Qualcomm Datacenter Technologies Announces Commercial Shipment of Qualcomm Centriq 2400 - The World's First 10nm Server Processor and Highest Performance Arm-based Server Processor Family Ever Designed
• iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
• Mercury Systems releases DO-178C-certifiable BuiltSAFE multi-core, OpenGL, 3D renderer for Zynq UltraScale+ MPSoC
• Intel quad-core Apollo Lake makes tiny PC IoT ready
• ON Semi Joins MCU Benchmarking Consortium
• Invensas DBI Technology Now Available at SMIC
• Codasip and Avery Partner to Improve Regression Test Methodology of RISC-V Processors
• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ICCAD in Beijing

Tuesday, November 7, 2017

• Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion

Tuesday, November 7, 2017

• FADU Completes Verification of next generation NVMe eSSD using S2C's Prodigy Virtex UltraScale Prototyping Platform

Tuesday, November 7, 2017

• MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications

Monday, November 6, 2017

• Arm Announces Its Most Comprehensive Tool Suite For The HPC Ecosystem
• Lattice Semiconductor Reports Third Quarter 2017 Results
• The Biggest SoC/FPGAs
• Farnell adds local language web-sites to IoT Hub
• RISC-V Ecosystem Surpasses 100 Members Globally, Paving the Way for the Next 50 Years of Computing Design and Innovation
• MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications
• Intellifusion Licenses ArterisIP FlexNoC Interconnect IP for Machine Learning and Visual Intelligence Systems-on-Chip
• Titan invests $5 million in wearable IoT firm CoveIoT
• 'Historic' AMD Pact Shows Intel's New Reality
• Top 5 increase grip on China phone market 2
• SiFive and eMemory Bring Embedded Memory to the DesignShare Economy to Accelerate Development of RISC-V Silicon
• True Circuits Signs Five Year PLL License with Tsinghua University in China
• True Circuits Attends the TSMC 2017 China OIP Ecosystem Forum
• Inside Secure acquires SypherMedia to boost its Silicon IP business and root-of-trust offering
• New bright future for FD-SOI

Monday, November 6, 2017

• Broadcom, Qualcomm Groked

Sunday, November 5, 2017

• AMD Delivers Semi-Custom Graphics Chip For New Intel Processor
• Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion 1
• Semiconductor IPOs Back in Vogue
• HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor
• GUC Monthly Sales Report - Oct 2017
• FPGAs in the Financial Services Industry
• Flex Logix Names Fan Mo Technical Director Of FPGA CAD Software Development

Friday, November 3, 2017

• Crypto Bugs in IEEE Standard Expose Intellectual Property in Plaintext
• Prioritise securing Internet of Things

Thursday, November 2, 2017

• Renesas Electronics has introduced 3D graphics dashboards to entry-level models with its R-Car D3 SoC
• Synopsys to Pay $565 Million for Security Software Firm
• New Laser Technique Promises Photonic Devices Inside of Silicon
• Xilinx Announces Intention to Invest $40M in Expansion of Research, Development, and Engineering Operations at EMEA Headquarters in Ireland