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Friday, March 23, 2018

• EDA Chief Calls AI the New Driver

Friday, March 23, 2018

• SIA Statement on Trump Administration Section 301 Action on China

Friday, March 23, 2018

• IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from China

Friday, March 23, 2018

• Path to 2nm May Not Be Worth It

Friday, March 23, 2018

• U.S. Companies Maintain Largest Share of Fabless Company IC Sales

Friday, March 23, 2018

• North American Semiconductor Equipment Industry Posts February 2018 Billings

Thursday, March 22, 2018

• Microsemi Switchtec PCIe Gen 4 available

Thursday, March 22, 2018

• SiFive Brings in Mobiveil as Newest Partner in the DesignShare Economy

Wednesday, March 21, 2018

• Samsung Pay Continues Global Expansion with Launch in Italy

Tuesday, March 20, 2018

• Design tools for safety-relevant receive ISO26262 certification
• Lattice CEO steps down
• Chinese autoparts makers go on global buying spree
• Fab Tool Spending Projected to Rise for 3rd Straight Year
• TSMC sales plunged in February
• GLOBALFOUNDRIES Names Ronald Sampson as General Manager of its Leading-Edge Silicon Manufacturing Facility in New York
• Report: Globalfoundries asks China to probe TSMC
• GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications
• Synopsys Acquires Silicon and Beyond Private Limited to Expand High-Speed SerDes IP Portfolio
• Synopsys Accelerates Development of Renesas R-Car V3H SoC that Achieves Cutting-edge Computer Vision

Tuesday, March 20, 2018

• ArterisIP Drives Artificial Intelligence & Machine Learning Innovation for 15 Chip Companies

Monday, March 19, 2018

• Microsemi Expands Market Opportunities for Cloud Data Centers with Announcement of Adaptec Smart Storage Compatibility with AMD EPYC Processor
• Synopsys Announces Industry's Most Comprehensive Automotive ISO 26262 Certification for Design Platform
• Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd.
• Stratix 10 FPGA: REFLEX CES is Shipping the Cloud Computing COTS Board "XpressGXS10-FH200G", and the Sargon Stratix 10 GX Development Kit
• Free Webinar: Silvaco 3D Solver Based Extraction for Device and Circuit Designers
• CEA Shows Path to Creating Building Blocks of Quantum Processors with 28Si Isotope in a CMOS Fab Line
• Samsung Electronics Diversifies Its 8-Inch Foundry Offerings With New RF/IoT and Fingerprint Technology Solutions
• Synopsys Introduces Breakthrough Fusion Technology to Transform the RTL-to-GDSII Flow
• Synopsys Enables Robust Design Optimization for Next-generation High-performance Computing, Mobile and Automotive Products with IC Compiler II and RedHawk Analysis Fusion
• Imagination announces powerful new capabilities in PVRTune performance analysis tool for PowerVR GPUs
• Imagination streamlines app and game development with GPU debugging as part of new PVRStudio IDE
• Mobiveil Joins Gen-Z Consortium

Sunday, March 18, 2018

• Semiconductor Design Firms are Embracing the Public Cloud. Here are 5 Reasons Why.
• GPU architecture not suited for AI, says Xilinx CEO
• Everspin Signs Long-term Patent License Agreement with Alps Electric
• Rambus to Develop Hybrid Memory System Architectures for Future Data Centers
• Xilinx CEO Outlines New Vision, Strategy for the Company
• Xilinx Unveils Revolutionary Adaptable Computing Product Category
• SambaNova Systems Emerges From Stealth and Secures $56 Million in Series A Funding Led by Walden International and GV
• HiTrend selects Dolphin Integration's cache controller for its next generation of smart energy metering chips
• Accellera Announces Proposed Working Group to Define an IP Security Assurance Specification
• Broadcom Eyes New Acquisition Targets

Friday, March 16, 2018

• Jacobs off Qualcomm board

Thursday, March 15, 2018

• Silicon Creations' PMA Technology Part of Microsemi Award-Winning FPGA

Wednesday, March 14, 2018

• Matlab, Simulink get functions for autonomous driving and deep learning
• TSMC seeing tight capacity for cryptocurrency mining chips

Tuesday, March 13, 2018

• United Microelectronics Corporation (UMC) on Focus After Forming Multiple Top
• IC Insights Raises 2018 IC Market Forecast from 8% to 15%
• Trump Precedent Won't Chill M&A
• Broadcom Withdraws Offer to Acquire Qualcomm
• EnSilica builds export drive with appointment of Asia Region Manager
• GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity
• Synopsys and Industry Technologists to Address the Path to 2-nm SoC Design
• New Architectures for Automotive Intelligence
• Eta Compute Launches Industry's First Neuromorphic Platform for Ultra-Low-Power Machine Intelligence at the Edge
• Stratix 10 FPGA: REFLEX CES is Shipping the Cloud Computing COTS Board
• Lattice Semiconductor Announces CEO Succession Plan
• Mobile Semiconductor Introduces 28nm Memory Compiler Support
• MIPI Alliance Welcomes Bosch and Qualcomm as Promoter Members

Tuesday, March 13, 2018

• Analysis: 1 GHz MIPS core is DSP speed demon

Tuesday, March 13, 2018

• CAST Rolls Ten Years of 8051 Experience into Configurable Processor Core

Tuesday, March 13, 2018

• Lattice Announces World's Smallest FPGA for Miniature Systems

Tuesday, March 13, 2018

• Arrow Devices announces world's first USB Power Delivery Verification IP

Tuesday, March 13, 2018

• Arrow Devices announces PDA, a revolutionary new debugging tool

Tuesday, March 13, 2018

• World's first MPHY 3.1 Verification IP Launched by Arrow Devices

Tuesday, March 13, 2018

• Global Leader in Flash Memory Storage Adopts Arrow Devices' JEDEC UFS and MIPI Solutions

Tuesday, March 13, 2018

• 3 of top 20 semiconductor companies adopt Arrow Devices' USB3 Validator

Monday, March 12, 2018

• Cadence Design Systems, Inc. (CDNS): From Top to Bottom
• Corigine adds certified USB IP to SiFive's Growing DesignShare Economy to Accelerate Adoption of RISC-V
• Interview with Rick O'Connor of RISC-V Foundation
• Synopsys Releases Enhanced Photonic Integrated Circuit Design Automation
• Inside GlobalFoundries long road to the leading edge
• Credo Demonstrates Robust, Low-Power 112G PAM4 Solutions at OFC 2018
• Arteris IP FlexNoC Interconnect Licensed by VeriSilicon for Multiple Chip Designs

Sunday, March 11, 2018

• Open-Silicon, Credo and IQ-Analog Showcase Complete End-to-End Networking ASIC Solutions at OFC 2018
• CSEM selects ID-Xplore to accelerate analog design and technology porting at functional level
• QuickLogic Joins RISC-V Foundation
• Following Significant Technology, Capacity and Expansion Milestones, GLOBALFOUNDRIES' Sanjay Jha to Pass Baton to Industry Veteran Tom Caulfield
• Xilinx Showcases Future of Optical Networking with Breakthrough Technology and Products at OFC 2018
• Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service
• Mnano selects Dolphin Integration's six-channel Audio converter for its next generation of Smart Speakers
• Fab Spending Poised For Remarkable Fourth Year of Growth
• Synopsys Advances Custom Platform to Accelerate Robust Custom Design