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Sunday, November 19, 2017
Synopsys宣布在中国设立战略投资基金
华为基于Xilinx的云服务器于2017 超算大会首秀北美市场 专为大规模加速云计算
被对手举报 台积电证实正遭欧盟反垄断调查
Sankalp Semiconductor receives STPI Highest Exporter award
GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
iPhone X's TrueDepth Module Dissected
Truechip and Uniquify Achieve Sign-off Verification of DDR Interface IP
Andes Announces Advanced SoC Development Environments for V5 AndesCore N25 and NX25 Processors with Tool Partners
Argonne to install Comanche system to explore Arm technology for high-performance computing
AI to Spur Uptick in ASIC Design Starts
Cadence Appoints Anirudh Devgan as President
Synapse Design Acquires Tech Vulcan to Address Fast Growth and Provide Increased Customer Access to Design Centers
Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017
Embedded Tools provider Ashling joins RISC-V Foundation
Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores
Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17
Marvell and Cavium to Combine Creating an Infrastructure Solutions Powerhouse
Wednesday, November 15, 2017
Arm to Discuss the Coming Era of Fog Computing in IoT During Keynote at IoT Evolution Expo
Faraday Unveils M1+ Library with Enhanced Routability on UMC 28HPC Process
Enyx Premieres the First TCP and UDP Offload Engines for Intel Stratix 10 FPGA On REFLEX CES XpressGXS10-FH200G Board
Barco Silex VC-2 HQ compression cores at the heart of IMAGENICS 4K HDMI-over-coax extender
Enyx Premieres the First TCP and UDP Offload Engines for Intel Stratix 10 FPGA On REFLEX CES XpressGXS10-FH200G Board
Faraday Unveils M1+ Library with Enhanced Routability on UMC 28HPC Process
UltraSoC will again be attending and participating in the latest (7th) RISC-V Workshop
Global Unichip Successfully Tapes Out 16nm TCAM Compiler
Wednesday, November 15, 2017
Socionext Starts Offering Graphics IP "SEERIS"
Wednesday, November 15, 2017
SMIC Reports 2017 Third Quarter Results
Wednesday, November 15, 2017
Will Samsung's 2017 Semi Capex Deliver Knockout Blow to Competition?
Wednesday, November 15, 2017
VESA Rolls Out DisplayID Version 2.0 Standard to Optimize Plug-and-Play Connectivity for Leading-Edge Displays
Wednesday, November 15, 2017
PA Semi, Apple "Interconnect" at Startup
Tuesday, November 14, 2017
UltraSoC立足于提供通用智能SoC 基础架构IP,意在挑战行业独大
Inside Secure Unveils Industry's First Root-of-Trust Solution based on RISC-V Processor
Inside Secure Joins RISC-V Foundation
Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC
Samsung's Capex Seen Crushing Memory Startups
Inuitive Adopts Synopsys' Embedded Vision Processor IP to Accelerate Computer Vision and Deep Learning Algorithms
Green Hills ups spec for safety-critical C/C++ compilers
GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions
Tuesday, November 14, 2017
Analog Bits to Provide Precision PLL and SERDES IP to DesignShare for SiFive Freedom Platform
Tuesday, November 14, 2017
Spin Transfer Technologies Announces Allowance of U.S. Patent For Next-Gen MRAM
Tuesday, November 14, 2017
UMC Reports Sales for October 2017
Tuesday, November 14, 2017
S3 Semiconductors Expands Sales Rep Network
Tuesday, November 14, 2017
SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard
Tuesday, November 14, 2017
Broad/Qual/NXP Battle Begins
Tuesday, November 14, 2017
Sequoia backs Graphcore as the future of Artificial Intelligence processors
Tuesday, November 14, 2017
Intel countersues Transmeta, say reports
Monday, November 13, 2017
Andes Technology N9 CPU Designed in Customer's SoC Shipping in Home Smart Speaker Artificial Intelligence Device
Rambus Selects Codasip Studio for SDK Development of RISC-V Processor
UltraSoC selected by Microsemi for growing RISC-V product range
Kilopass Achieves 1000-Hour Qualification on Mie Fujitsu Semiconductor Highly Demanded 40nm Low Power Process
Faraday Technology will exhibit IoT SoC development platform and high-speed interface at ICCAD 2017
Cray building Arm-based supercomputer
Qualcomm officially rejected the acquisition, Broadcom said it would not give up
Strong competitor of Arm -- a small company from Cambridge
Monday, November 13, 2017
TSMC October 2017 Revenue Report
Sunday, November 12, 2017
Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
Automotive Seen as Strongest Semiconductor Driver Through 2021
Cadence and Synopsys localized their company in Nanjing, China. Nanjing will be the next Chip Center of China?
China Passes U.S. in Supercomputers
US Synopsys Releases 2017 Coverity Scan Report Shows Plenty of Open Source Software Projects Implement Security Plans
Arm Launches New Platform Security Framework PSA for IoT Products
Samsung Shows EUV Design at ISSCC
Synopsys and CEA Announce Partnership to Develop Emulation Solutions for Automotive Applications
Announcing the Opening of the Global Unichip Corporation Tainan Office
Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet Transport Applications
Saturday, November 11, 2017
SiFive Adds Flex Logix eFPGA IPs to DesignShare Initiative
Thursday, November 9, 2017
台積公司2017年10月營收報告
Wednesday, November 8, 2017
EasyIC announces it is now a member of the Xilinx Alliance Program
Embedded FPGA IP is going to soar, how do chip design engineers choose?
Growth in automotive brings videantis third Deloitte Technology Fast 50 award
UMC Reports Sales for October 2017
Barco Silex Partners with Intrinsic ID for North American Representation
Power Efficient Implementation of CommSolid's CSN130 NB-IoT IP Solution Supported by Zephyr RTOS
Videantis wins third Deloitte Technology Fast 50 award
Wednesday, November 8, 2017
The quandary of EDA software piracy
Wednesday, November 8, 2017
CAST adds H.264 Main Profile Video Encoder Core to Compression IP Family
Wednesday, November 8, 2017
CAST Full Hardware UDP/IP Stack Core Simplifies Streaming Media Over IP Networks
Wednesday, November 8, 2017
Ultra-Low Latency H.264 Video Encoding Now Available from CAST
Wednesday, November 8, 2017
Spectral Edge appoints new CTO, accelerating development of smartphone imaging technology
Wednesday, November 8, 2017
Veriest announces expansion in Europe and opens new offices in Serbia
Wednesday, November 8, 2017
Third Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; another Quarterly Record
Wednesday, November 8, 2017
Faraday Monthly Consolidated Sales Report - October 2017
Tuesday, November 7, 2017
Qualcomm Datacenter Technologies Announces Commercial Shipment of Qualcomm Centriq 2400 - The World's First 10nm Server Processor and Highest Performance Arm-based Server Processor Family Ever Designed
iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
Mercury Systems releases DO-178C-certifiable BuiltSAFE multi-core, OpenGL, 3D renderer for Zynq UltraScale+ MPSoC
Intel quad-core Apollo Lake makes tiny PC IoT ready
ON Semi Joins MCU Benchmarking Consortium
Invensas DBI Technology Now Available at SMIC
Codasip and Avery Partner to Improve Regression Test Methodology of RISC-V Processors
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ICCAD in Beijing
Tuesday, November 7, 2017
Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion
Tuesday, November 7, 2017
FADU Completes Verification of next generation NVMe eSSD using S2C's Prodigy Virtex UltraScale Prototyping Platform
Tuesday, November 7, 2017
MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications
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