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Wednesday, October 4, 2017

• NetSpeed's Turing Brings Machine Learning to SoC Design
• Synopsys Delivers Industry's First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs
• 32bit Arm power in a tiny wearable, sewable, package
• Renesas automotive chips make most of Android for cars
• Pure-Play Foundries Boosting Their Presence in China

Wednesday, October 4, 2017

• Cortus presenting at SEDEX 2017 in Seoul Korea, on the 17th October 2017

Tuesday, October 3, 2017

• IoT: Is privacy a priority or an afterthought?
• Smooth Succession Expected at TSMC
• NXP® Unveils Highest Performance Layerscape® Networking and Data Center Offload System-on-Chip Solution
• How to control automotive complexity
• SiFive Launches First RISC-V Based CPU Core with Linux Support
• ArterisIP announces Ncore 3 Cache Coherent Interconnect

Monday, October 2, 2017

• Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar
• STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks
• Eta Compute's David Baker, Ph.D. To Present On Low-Power IP For The Internet of Things At Arm TechCon October 25
• Silicon Creations Named 2017 TSMC Partner of the Year for Analog Mixed Signal IP
• Inside Secure and Toshiba Information Systems (Japan) Deepen Cooperation to Provide Embedded Security to Japanese Market
• Xilinx joins Linaro
• Intel Offers Innovative Approach to IoT Scaling and Security
• 利用低功耗蓝牙模块简化和加速物联网设计

Monday, October 2, 2017

• Lattice and Helion Accelerate Embedded Vision Designs with Turnkey ISP Solution

Monday, October 2, 2017

• Altair Acquires Runtime Design Automation, Broadens Software Portfolio for High Performance Computing

Sunday, October 1, 2017

• Semiconductor Sales Rose 25% in August, DRAM Spiked 85%; Can Sales Keep Rising?
• Monthly Semiconductor Sales Reach $35 Billion Globally for First Time in August
• TSMC Dr. Morris Chang Announces Retirement in June 2018. Future Dual Leadership Will Be Mark Liu as Chairman And C.C. Wei as CEO.
• Q&A: Ray Bingham on Canyon Bridge, Imagination
• Intel Eases Use of FPGA Acceleration: Combines Platforms, Software Stack and Ecosystem Solutions to Maximize Performance and Lower Data Center Costs
• 莱迪思携手Helion推出开箱即用的ISP解决方案，加速嵌入式视觉应用设计
• Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development

Saturday, September 30, 2017

• 格芯CEO：FD-SOI是中国需要的技术

Thursday, September 28, 2017

• Dialog Semiconductor releases BLE-enabled SoCs for automotive tire pressure monitoring systems
• TSMC to Build 3nm Fab in Tainan Science Park
• INVECAS, Inc. and Avery Design Systems Collaborate on LPDDR4/3 PHY, VIP Solutions

Thursday, September 28, 2017

• Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications

Wednesday, September 27, 2017

• Trusted IoT Alliance formed to add Blockchain layer to enterprise IoT products/services
• Tessera Files Legal Proceedings Against Samsung for Patent Infringement
• SMIC and Sanechips (ZTE Microelectronics) Announce the First Commercial NB-IoT Chip Designed and Manufactured in Mainland China

Wednesday, September 27, 2017

• TrueConnect - Annual Technical Conference of Truechip

Tuesday, September 26, 2017

• 智原SoReal! 2.0虚拟平台扩增硬件整合功能，加速SoC软件提前开发
• MIPS: Underdog or Dead Horse?
• DENSO Licenses NetSpeed IP for use in Advanced Automotive Platform SoCs
• Mn_nH release stereo 3D 360 stitching IP solution for high-end 3D VR camera
• SecureRF and Intel Collaboration Delivers Future-Proof FPGA Security Solutions
• Faraday Launches SoReal! 2.0 Virtual Platform to Support Its FPGA Board for Early SoC Software Development
• Partnership Puts ReRAM in SSDs
• Kilopass Technology Announces Design Win in Next Generation Nuvoton Embedded Controllers Targeting Desktop and Mobile computers
• SiFive Joins TSMC IP Alliance Program
• TowerJazz and Crocus Expand Presence in Magnetic Sensors Market through Successful Licensing of Crocus' IP and Volume Manufacturing by TowerJazz

Monday, September 25, 2017

• Samsung Announces Industry's First Embedded eUFS Solution For Next-Gen Automotive Applications
• Efinix Completes $9.5M Funding Round
• Pixelworks Licenses ArterisIP FlexNoC Interconnect IP Again for Advanced Video Processing SoCs
• Xilinx joins Linaro
• USB-IF Announces USB 3.2 Specification Published
• 中资凯桥资本宣布5.5亿英镑收购英国半导体公司
• Synopsys新型ARC安全IP子系统：解决嵌入式SIM卡及其他重要嵌入式应用程序安全威胁
• What's New With Cadence PCI Express IP? Almost Everything!

Monday, September 25, 2017

• Alizem Releases its New 3-phase PWM IP Core for Intel MAX 10 FPGAs

Monday, September 25, 2017

• ESD Alliance Reports EDA Industry Revenue Increase For Q2 2017

Monday, September 25, 2017

• 7 Views of Globalfoundries in 2017

Monday, September 25, 2017

• iPhone 8 Still Packs Qualcomm, NXP

Monday, September 25, 2017

• Imagination, MIPS to be sold to China-, California-connected VCs

Monday, September 25, 2017

• Truechip at DVCON India 2017

Monday, September 25, 2017

• Will Imagination Deals Deliver MIPS to China?

Monday, September 25, 2017

• Recommended Cash Acquisition of Imagination Technologies Group PLC by CBFI Investment Limited

Monday, September 25, 2017

• Cadence DFM Signoff Solutions Achieve Qualification for Samsung 28nm FD-SOI/14nm/10nm Process Technologies

Monday, September 25, 2017

• Moortec's Expansion Continues with New UK Headquarters

Sunday, September 24, 2017

• New Development Kit from Xylon Accelerates Design of Embedded Multi-Camera Vision Systems
• CCww's NB-IOT R13 Protocol-stack software is licensed by a leading IoT Chip developer
• Samsung Expands FD-SOI Process Technology Leadership and its Design Ecosystem Readiness
• Samsung Certifies Synopsys Design Platform for 28nm FD-SOI Process Technology

Friday, September 22, 2017

• North American Semiconductor Equipment Industry Posts August 2017 Billings