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Wednesday, September 6, 2017

• Cadence Delivers Comprehensive IP Portfolio for TSMC 16FFC Automotive Design Enablement Platform
• Barco Silex integrates new video coding technique from the latest VC-2 HQ standard.
• Sital Technology and Logicircuit to Provide DO-254 Certified IP Cores for Avionic Data Buses

Wednesday, September 6, 2017

• eSilicon at TSMC OIP 2017

Wednesday, September 6, 2017

• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC China 2017

Wednesday, September 6, 2017

• Flex Logix Joins TSMC IP Alliance Program

Tuesday, September 5, 2017

• Apple vs Qualcomm: Who Extorted Whom?
• Global Semiconductor Sales Increase 24 Percent Year-to-Year in July
• SILTERRA Unveils 180nm Ultra Low Leakage Technology To Position in IoT Sensor Hub IC Market
• Xilinx Powers Huawei FPGA Accelerated Cloud Server
• eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC's Custom IC Platform
• Cadence Announces Legato Memory Solution, Industry's First Integrated Memory Design and Verification Solution
• Innosilicon Announces the World most efficient LTC Miner A4+, 550Mh, 750W
• Menta Embeds sureCore Low Power SRAM IP on TSMC's 28nm Process
• Imec Reports World-Class Low-Power IP Blocks for 5G
• Kilopass Ultra-Low Power OTP NVM Provides Storage for Northrop Grumman Advanced Silicon Processor That Prevents Counterfeit Electronic Parts Entering DoD Supply Chains

Tuesday, September 5, 2017

• GlobalSign and Intrinsic ID Plan Joint Demos at Two Upcoming STMicroelectronics Events

Tuesday, September 5, 2017

• Ty Garibay Joins ArterisIP as Chief Technology Officer

Tuesday, September 5, 2017

• Electronics and Telecommunications Research Institute (ETRI) joins HEVC Advance

Tuesday, September 5, 2017

• Sidense Exhibiting and Presenting a Paper at the TSMC Open Innovation Platform (OIP) Ecosystem Forum

Monday, September 4, 2017

• Cadence优化全流程数字与签核及验证套装，支持Arm Cortex-A75、Cortex-A55 CPU及Arm Mali-G72 GPU
• With Acquisition in Doubt, Lattice Appeals to Trump
• SecureRF Joins STMicroelectronics Partner Program to Bring Security to the Smallest Devices in the IoT
• Stratix 10 FPGA: REFLEX CES Introduces the Widest Range of Boards Based on Stratix 10 GX and SoC technology from Intel PSG
• Samsung SARC Selects Synopsys as Primary Verification Solution for Advanced Mobile Processor Designs
• Conversant Announces Semiconductor Patent License Agreement With SK hynix
• Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications
• GUC Monthly Sales Report - Aug 2017
• Achronix to Speak at D&R IP-SOC Conference in Shanghai
• Synopsys硅验证DesignWare蓝牙低功耗链路层和实体层IP取得蓝牙5标准认证
• "专精化" --半导体厂商的获利秘诀
• Flex Logix加入台积电IP联盟计划

Monday, September 4, 2017

• Siemens to Acquire TASS International, Adding Automated Driving Solutions to Portfolio

Sunday, September 3, 2017

• President Trump to rule on Lattice's China deal
• Huawei integrates AI in its latest mobile processor
• NFC Semicon sets a new standard for NFC Sensor Chip Solutions

Thursday, August 31, 2017

• Leti Launches Emulator Service to Boost Roi and Speed Time to Market For European Chipmakers
• Atomic Rules launches TimeServo System Timer IP Core for FPGA
• Most of 2017 Capital Spending Will Go to Foundry and Flash Memory

Thursday, August 31, 2017

• Mentor extends functional safety assurance program to key design, verification and analog/mixed signal products

Thursday, August 31, 2017

• Socionext Partners with Advantech to Offer High-Density, Low-Cost Media Cloud Server Solutions

Wednesday, August 30, 2017

• Vidatronic Partners with Avant Technology as Its Distributor for Asian Markets
• Ex-Baidu Scientist Blazes AI Shortcut
• Arm's embedded TLS library fixes man-in-the-middle fiddle
• Pinnacle launches Denali-MCTM image processing IP

Tuesday, August 29, 2017

• Lidar to grow strongly in automotive sensor market
• Siemens expands automotive engineering software business with new takeover
• Qualcomm and Himax Technologies Jointly Announce High Resolution 3D Depth Sensing Solution
• Faraday Launches Its New FPGA to ASIC Turnkey Service
• S3 Semiconductors refocuses on design-to-delivery custom chip service for industrial applications

Tuesday, August 29, 2017

• Chief of Qualcomm's Licensing Business to Step Down

Monday, August 28, 2017

• 莱迪思半导体通过提供模块化IP核进一步丰富了CrossLink应用
• China Unicom announces IoT partnership
• Lattice Semiconductor Further Expands CrossLink Applications with Modular IP Cores
• Synopsys Silicon-Proven DesignWare Bluetooth Low Energy Link Layer and PHY IP Achieve Bluetooth 5 Qualification
• Samsung to Invest $7 Billion in China Fab
• Kilopass Anti-Fuse NVM OTP IP Designed into Tire Pressure Sensor SoC Manufactured on TSMC 55LP Process Node Now Shipping in High Volume
• Microcontroller Market revenue will reach $18.8 billion by 2024
• New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market
• Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications

Sunday, August 27, 2017

• Automotive Embedded System Market by Vehicle, Electric Vehicle, Type, Component, Application and Region - Global Forecast to 2022
• Inside Secure completes the acquisition of Meontrust and enters Security-as-a-Service market
• Movidius Beefs up HW Acceleration in AI Chip
• Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box