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Friday, January 12, 2018

• ARM's East hints at Cortex multiprocessor

Friday, January 12, 2018

• CAST Expands System IP Offerings with Embedded Internet and USB Subsystems

Friday, January 12, 2018

• CAST Deciphers Security System Design Challenges with New AES Encryption IP

Friday, January 12, 2018

• CAST Reference Design System Simplifies H.264 Video Compression Evaluation and Analysis

Friday, January 12, 2018

• CAST Releases Fast, Flexible Baseline H.264/AVC Video Encoder Core

Thursday, January 11, 2018

• Mentor Investigates Using Neural Networks for CMP Modeling
• Analog IC Market Forecast With Strongest Annual Growth Through 2022
• UMC Files Patent Infringement Lawsuit against Micron

Wednesday, January 10, 2018

• Racyics takes FDSOI down to 0.4V
• Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology

Tuesday, January 9, 2018

• Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology
• The lofty rise of the lowly FPGA
• Apple supplier TSMC posts 3% annual sales increase
• TSMC December 2017 Revenue Report
• Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development
• MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications

Tuesday, January 9, 2018

• CEVA Unveils NeuPro - A Family of AI Processors for Deep Learning at the Edge

Tuesday, January 9, 2018

• Dolphin Integration paves the way for the next generation of Digital microphones "CoolMic"

Tuesday, January 9, 2018

• BaySand expands its "Programmable-In-ASIC" initiative with Efinix Quantum programmable accelerator technology

Monday, January 8, 2018

• IFI CLAIMS Announces 2017 Top U.S. Patent Recipients
• Solar wafer production to see over-capacity by year-end 2018
• China, Samsung Rise in U.S. Patents
• UMC Reports Sales for December 2017
• videantis introduces new processor and tools for deep learning
• Microsemi and Future Electronics Announce Avalanche Board for Designing with Microsemi's PolarFire FPGAs
• eSilicon announces 7nm FinFET ASIC design win
• Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Chips
• Memory differences remain as ST chooses Globalfoundries for FDSOI
• NVM Express Set for Busy 2018
• STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership
• Arm Webinar - A guide to securing your IoT device with Arm TrustZone for Cortex-M
  on Jan 31, 2018

Monday, January 8, 2018

• Wi-Fi Alliance introduces security enhancements

Sunday, January 7, 2018

• BaySand expands its 'Programmable-In-ASIC' initiative with Efinix Quantum programmable accelerator technology
• Wi-Fi Alliance introduces security enhancements and new features for Wi-Fi Protected Access
• CEVA Introduces ClearVox - Advanced Software Package Providing Enhanced Speech Intelligibility for Voice-Enabled Devices
• Dolphin Integration paves the way for the next generation of Digital microphones
• Flex Logix Names Valy Ossman Technical Director, Solutions Architecture
• GUC Monthly Sales Report - Dec 2017
• Moortec Opens New European Design Centre in Poland
• Faraday Monthly Consolidated Sales Report - December 2017
• Sankalp Semiconductor expands internationally with its operations in Malaysia
• Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs

Thursday, January 4, 2018

• Chip Sales Grew 22% in 2017, Gartner Says
• Startup tapes out MRAM-based MCU demo for IoT
• Xilinx Appoints Victor Peng As President And Chief Executive Officer
• WiLAN Reaches IP Framework Agreement with TSMC
• Fabless IC Company Sales Top $100 Billion for First Time Ever
• Xilinx CEO Moshe Gavrielov Announces Retirement

Wednesday, January 3, 2018

• Gartner Says Worldwide Semiconductor Revenue Grew 22.2 Percent in 2017; Samsung Takes Over No. 1 Position
• UltraSoC appoints Aileen Smith as Chief Strategy Officer
• AImotive, Leading Provider of Camera-First Autonomous Driving Technology, Raises $38 Million USD Series C
• MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest USB Type-C Connectors
• Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications and Richer Multimedia Content
• Smartphone Production Projected to Increase 5%
• TSMC to outpace Samsung in 7nm volume production in 2018

Tuesday, January 2, 2018

• Himax Technologies, Inc. to Attend CES on January 8th - 10th , 2018
• Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification
• Qualcomm's New Spectra ISP and Camera Modules Enable Nextgen AR
• OmniVision's First 0.9 Micron Pixel Image Sensor Family Enables Best-in-Class Performance and Features for High-End Smartphones
• CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester
• Global Semiconductor Sales Increase 21.5 Percent Year-to-Year in November
• NGCodec Closes $8M Series A, Launches Live Broadcast H.265/HEVC Cloud Video Encoding and Demonstrates Cloud VR

Tuesday, January 2, 2018

• FujiFilm Adopts DMP's Graphics IP Core "SMAPH-H"

Monday, January 1, 2018

• Samsung, Micron, and NVIDIA Are 2017's Biggest Winners
• Baidu Selects ON Semiconductor Image Sensors for its Apollo Autonomous Driving Platform
• China major AI chipmakers maintain partnerships with TSMC
• Faraday Signs Satris Group as Its Israeli Distributor
• eVaderis Completes Tape-Out of Innovative MRAM-Based, Memory-Centric MCU Demonstrator for Next-Generation IoT Applications
• Arrow Accelerates IoT Leadership Position with eInfochips Acquisition
• DSP Group, Emza and Himax Announce Industry's First AI based Human Presence IoT Visual Sensor for Consumer Appliances and Industrial Applications

Sunday, December 31, 2017

• Silicon Valley AI Chip Startup Gyrfalcon Technology Competes with Intel with its Newly Launched USB Stick