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Sunday, October 8, 2017

• TSMC's 3nm Fab Could Cost $20 Billion
• 独家对话Imagination买家，了解收购案内情
• Dialog Semiconductor is acquiring Silego for up to $306 million in IoT push
• AImotive Highlights Significant Limitations In Hardware And Benchmarks For Fully Autonomous Vehicles
• SoC-e releases Multiport Time Sensitive Networking (TSN) IP Core
• Near zero power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library
• 格芯推出面向下一代移动和5G应用的8SW RF-SOI技术

Friday, October 6, 2017

• GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems

Friday, October 6, 2017

• GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications

Thursday, October 5, 2017

• TSMC September 2017 Revenue Report
• UMC Reports Sales for September 2017
• Faraday Monthly Consolidated Sales Report - September 2017
• Foundries Target China

Thursday, October 5, 2017

• GUC Monthly Sales Report - Sep 2017

Thursday, October 5, 2017

• Dialog Semiconductor to Acquire Silego Technology, the Leader in Configurable Mixed-Signal ICs

Wednesday, October 4, 2017

• NetSpeed's Turing Brings Machine Learning to SoC Design
• Synopsys Delivers Industry's First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs
• 32bit Arm power in a tiny wearable, sewable, package
• Renesas automotive chips make most of Android for cars
• Pure-Play Foundries Boosting Their Presence in China

Wednesday, October 4, 2017

• Cortus presenting at SEDEX 2017 in Seoul Korea, on the 17th October 2017

Tuesday, October 3, 2017

• IoT: Is privacy a priority or an afterthought?
• Smooth Succession Expected at TSMC
• NXP® Unveils Highest Performance Layerscape® Networking and Data Center Offload System-on-Chip Solution
• How to control automotive complexity
• SiFive Launches First RISC-V Based CPU Core with Linux Support
• ArterisIP announces Ncore 3 Cache Coherent Interconnect

Monday, October 2, 2017

• Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar
• STMicroelectronics and Objenious Collaborate to Speed Connection of IoT Nodes to LoRa® Networks
• Eta Compute's David Baker, Ph.D. To Present On Low-Power IP For The Internet of Things At Arm TechCon October 25
• Silicon Creations Named 2017 TSMC Partner of the Year for Analog Mixed Signal IP
• Inside Secure and Toshiba Information Systems (Japan) Deepen Cooperation to Provide Embedded Security to Japanese Market
• Xilinx joins Linaro
• Intel Offers Innovative Approach to IoT Scaling and Security
• 利用低功耗蓝牙模块简化和加速物联网设计

Monday, October 2, 2017

• Lattice and Helion Accelerate Embedded Vision Designs with Turnkey ISP Solution

Monday, October 2, 2017

• Altair Acquires Runtime Design Automation, Broadens Software Portfolio for High Performance Computing

Sunday, October 1, 2017

• Semiconductor Sales Rose 25% in August, DRAM Spiked 85%; Can Sales Keep Rising?
• Monthly Semiconductor Sales Reach $35 Billion Globally for First Time in August
• TSMC Dr. Morris Chang Announces Retirement in June 2018. Future Dual Leadership Will Be Mark Liu as Chairman And C.C. Wei as CEO.
• Q&A: Ray Bingham on Canyon Bridge, Imagination
• Intel Eases Use of FPGA Acceleration: Combines Platforms, Software Stack and Ecosystem Solutions to Maximize Performance and Lower Data Center Costs
• 莱迪思携手Helion推出开箱即用的ISP解决方案，加速嵌入式视觉应用设计
• Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development

Saturday, September 30, 2017

• 格芯CEO：FD-SOI是中国需要的技术

Thursday, September 28, 2017

• Dialog Semiconductor releases BLE-enabled SoCs for automotive tire pressure monitoring systems
• TSMC to Build 3nm Fab in Tainan Science Park
• INVECAS, Inc. and Avery Design Systems Collaborate on LPDDR4/3 PHY, VIP Solutions

Thursday, September 28, 2017

• Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications

Wednesday, September 27, 2017

• Trusted IoT Alliance formed to add Blockchain layer to enterprise IoT products/services
• Tessera Files Legal Proceedings Against Samsung for Patent Infringement
• SMIC and Sanechips (ZTE Microelectronics) Announce the First Commercial NB-IoT Chip Designed and Manufactured in Mainland China

Wednesday, September 27, 2017

• TrueConnect - Annual Technical Conference of Truechip

Tuesday, September 26, 2017

• 智原SoReal! 2.0虚拟平台扩增硬件整合功能，加速SoC软件提前开发
• MIPS: Underdog or Dead Horse?
• DENSO Licenses NetSpeed IP for use in Advanced Automotive Platform SoCs
• Mn_nH release stereo 3D 360 stitching IP solution for high-end 3D VR camera
• SecureRF and Intel Collaboration Delivers Future-Proof FPGA Security Solutions
• Faraday Launches SoReal! 2.0 Virtual Platform to Support Its FPGA Board for Early SoC Software Development
• Partnership Puts ReRAM in SSDs
• Kilopass Technology Announces Design Win in Next Generation Nuvoton Embedded Controllers Targeting Desktop and Mobile computers
• SiFive Joins TSMC IP Alliance Program
• TowerJazz and Crocus Expand Presence in Magnetic Sensors Market through Successful Licensing of Crocus' IP and Volume Manufacturing by TowerJazz