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Wednesday, August 9, 2017
TSMC July 2017 Revenue Report
EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal
Tuesday, August 8, 2017
UMC Reports Sales for July 2017
Mie Fujitsu and SST Announce Automotive Platform Development on 40 nm Technology
GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications
Tuesday, August 8, 2017
Truechip-Moving Towards 10 Years of Successfulness
Monday, August 7, 2017
Fault tolerant VirtuosoNext RTOS for Arm Cortex-M microcontrollers
USITC Institutes Section 337 Investigation of Certain Mobile Electronic Devices and Radio Frequency and Processing Components Thereof
IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND
DENSO licenses Imagination's newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic processing
Synopsys and Morpho Collaborate to Accelerate Deep Learning Processing for Embedded Vision Applications
Intel Closes $15.3B Mobileye Acquisition, Touting Connected Car Business As A 'Huge Growth Opportunity'
Monday, August 7, 2017
Faraday Monthly Consolidated Sales Report - July 2017
Monday, August 7, 2017
Everspin Announces Sampling of the World's First 1-Gigabit MRAM Product
Monday, August 7, 2017
PLDA Announces vDMA, a Highly Efficient Many-Channel DMA Engine Engineered for Virtualized Systems in Data Centers, to be demonstrated at Flash Memory Summit 2017
Sunday, August 6, 2017
Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU
Thursday, August 3, 2017
Mid-Year Global Semiconductor Sales Up 21 Percent Compared to 2016
Palma Ceia Announces Complete PHY Solution for HaLow 802.11ah, Supporting IoT WiFi Connectivity
Synopsys 16nm FinFET接口IP组合符合严格的汽车AEC-Q100 1级温度要求
Thursday, August 3, 2017
CEVA, Inc. Announces Second Quarter 2017 Financial Results
Wednesday, August 2, 2017
GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry's First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles
Mobiveil Announces FPGA-Based SSD Platform for 3D NAND Flash Devices, Upgrades NVMe, PCI Express Controllers to Support Latest Specifications
Significant Mid-Year Revision to 2017 IC Market Forecast
Artificial Machines Standardizes on Mentor EDA Design Solutions to Develop Smart Machine IP
Avery Design Systems Announces NVMe 1.3 and NVMe-MI Verification IP Updates
Global Unichip Achieves SGS-TUV ISO26262 Certification
Tuesday, August 1, 2017
Pixelworks Completes Acquisition of ViXS Systems
UltraSoC delivers industry's first debug and analytics solution for Arm's AMBA 5 CHI Issue B coherency architecture
Image recognition processor powers active safety system
Vidatronic Contributes Expertise to AMD's Latest High-Performance Processors
Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017
Monday, July 31, 2017
Synopsys推出完整的HBM2 IP解决方案,为图形和高性能计算SoC提供超过300GB/s的带宽
Moortec Semiconductor announces new sales representatives in Japan
Is Designing Your Chip Architecture Like Driving a Car with No Pedals?
Synopsys Interface IP Portfolio on 16-nm FinFET Process Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements
CEVA Deep Neural Network Software Framework Named "2017 Most Innovative Product" by Embedded Computing Design
Epostar Chooses PLDA's PCIe Controller for their Next-Generation NVMe-based SSD Controller
采用DesignStart和Cordio为你的设计解脱束缚
麦肯锡报告:2017年机器学习和人工智能现状
Shanghai raises $7.4bn IC promotion fund
Telink SDK supports Bluetooth mesh
实施安全可靠的汽车应用FPGA解决方案
Monday, July 31, 2017
Sierraware makes Global Platform compliant Trusted Execution Environment (TEE) available for MIPS-based devices
Monday, July 31, 2017
Bluetooth SIG Announces Mesh Networking Capability
Sunday, July 30, 2017
Azul Systems Collaborates with Qualcomm to Bring Enterprise-Grade Open Source Java on Arm to Datacenters
INVECAS Acquires Lattice's HDMI Design Team and Simplay Labs Subsidiary
Taiwan ITRI reaching out to foreign IoT start-ups
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