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Monday, September 25, 2017
Will Imagination Deals Deliver MIPS to China?
Monday, September 25, 2017
Recommended Cash Acquisition of Imagination Technologies Group PLC by CBFI Investment Limited
Monday, September 25, 2017
Cadence DFM Signoff Solutions Achieve Qualification for Samsung 28nm FD-SOI/14nm/10nm Process Technologies
Monday, September 25, 2017
Moortec's Expansion Continues with New UK Headquarters
Sunday, September 24, 2017
New Development Kit from Xylon Accelerates Design of Embedded Multi-Camera Vision Systems
CCww's NB-IOT R13 Protocol-stack software is licensed by a leading IoT Chip developer
Samsung Expands FD-SOI Process Technology Leadership and its Design Ecosystem Readiness
Samsung Certifies Synopsys Design Platform for 28nm FD-SOI Process Technology
Friday, September 22, 2017
North American Semiconductor Equipment Industry Posts August 2017 Billings
Thursday, September 21, 2017
Imagination Technologies: Sale of MIPS and update on Formal Sale Process
利用硬件安全模块将安全性置入你的系统级芯片(SoC)
Thursday, September 21, 2017
ST, ARM challenged by TI strategic shift, says analyst
Thursday, September 21, 2017
CAST Offers H.264 High-Profile Encoder IP Core for FPGAs and ASICs
Thursday, September 21, 2017
Imagination's new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices
Thursday, September 21, 2017
Sondrel Expands into India
Thursday, September 21, 2017
Top Women Execs Join NetSpeed Boards
Wednesday, September 20, 2017
Globalfoundries Reportedly Asks EU to Probe TSMC
Mentor Precision Synthesis announces support for the eFPGA fabric in Silicon Mobility's OLEA automotive IC
Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor
Wednesday, September 20, 2017
Cadence Tools and Flows Achieve Production-Ready Certification for TSMC's 12FFC Process
Wednesday, September 20, 2017
GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers
Tuesday, September 19, 2017
最新Cadence Allegro DesignTrue DFM技术全面加速产品开发及上市流程
MIPI Alliance to Host DevCon Event in the Heart of Taiwan's High-Tech Sector: Hsinchu City
videantis receives growth financing from eCAPITAL to accelerate market penetration in embedded vision and autonomous driving
Rambus Announces Industry's First Functional Silicon of Server DIMM Buffer Chipset Targeted for Next-generation DDR5
Leading-Edge Paves the Way For Pure-Play Foundry Growth
GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications
GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX FD-SOI Platform
Synopsys Design Platform Certified by GLOBALFOUNDRIES for 22nm FD-SOI Process Technology
Tuesday, September 19, 2017
Lattice Semiconductor's iCE40 FPGA Enables Low Latency and Concurrent Sensor Processing in SteamVR Tracking
Tuesday, September 19, 2017
Synopsys Strengthens Design-Technology Co-Optimization Solution with Acquisition of QuantumWise
Tuesday, September 19, 2017
SEGGER Adds Support for SiFive's Coreplex IP to Its Industry Leading J-Link Debug Probe
Tuesday, September 19, 2017
AFuzion and HDL Design House Joint Webinar: Optimizing DO-254: October 4, 2017, 4 pm CEST
Monday, September 18, 2017
The U.S., China and the Chip Industry
CommSolid is now a Member of 3GPP and ETSI
CoreHW accelerates growth - Panostaja invests in CoreHW by purchasing a majority shareholding
Intel and Waymo team up on driverless cars
Synopsys' New ARC Secure IP Subsystem Addresses Security Threats in Embedded SIM and Other High-Value Embedded Applications
ArterisIP Ncore Cache Coherent Interconnect and Resilience Package Licensed by NXP
Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology
Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry's First 64-Layer 3D NAND for Data Center
Intel Custom Foundry Certifies Synopsys Design Platform for Intel's 22nm FinFET Low Power Process Technology
Embedded FPGAs from Menta qualified for GLOBALFOUNDRIES' Advanced 14nm FinFET and 32nm SOI Process Technologies
Monday, September 18, 2017
Conversant Announces Semiconductor Memory Patent License Agreement With Toshiba
Monday, September 18, 2017
SMIC, Brite Semiconductor and Synopsys Collaborate to Deliver Low Power Platform for the Internet of Things
Sunday, September 17, 2017
Mentor emulation platform receives safety certificate
Cellular Puts IoT on Speed Dial
CEVA Named in Fortune's 2017 100 Fastest-Growing Companies List
TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
Cadence Recognized with Three TSMC Partner of the Year Awards
莱迪思半导体iCE40 FPGA为SteamVR跟踪平台实现低延迟的同步传感器数据处理功能
Synopsys' New ARC IoT Development Kit Accelerates Software Development for Sensor Fusion, Voice Recognition and Face Detection Designs
灿芯半导体、中芯国际及Synopsys合作开发物联网低功耗平台
Friday, September 15, 2017
Nevion integrates TICO lightweight compression into its Virtuoso product line.
Friday, September 15, 2017
Xilinx Software Defined Development Environment for Data Center Acceleration Now Available on Amazon Web Services
Thursday, September 14, 2017
iPhone X chip shows problems of Imagination
Synopsys成功完成台积公司7纳米FinFET制程IP组合的投片
SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology
Thursday, September 14, 2017
Credo Receives Coveted TSMC 2017 Open Innovation Platform® Partner of the Year Specialty Technology IP Award
Thursday, September 14, 2017
HCC Embedded's Extensive Suite of Advanced Middleware Now Available for Xilinx Zynq-7000 SoCs
Thursday, September 14, 2017
Configurable VLIW core boosts energy efficiency for long battery life
Thursday, September 14, 2017
PathPartner Will Be at IBC 2017, Showcasing 4K HEVC Encoder and Decoder Solutions
Thursday, September 14, 2017
Soitec launches FD-SOI pilot line in Singapore
Thursday, September 14, 2017
Sencore adopts intoPIX JPEG2000 Ultra Low Latency technology
Wednesday, September 13, 2017
Chip Consolidation Nearly Over, Analyst Says
China condemns protectionism after Lattice deal blocked
eMemory Receives 2017 TSMC IP Partner Award
Flex Logix Wins TSMC Open Innovation Platform Partner Of The Year Award 2017
TSMC Updates its Silicon Menu
Wednesday, September 13, 2017
Credo Demonstrates Single-Lane 112G and 56G PAM4 SerDes IP Solutions at TSMC 2017 OIP Ecosystem Forum
Wednesday, September 13, 2017
UltraSoC expands to address embedded analytics market opportunity
Wednesday, September 13, 2017
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 Design & Reuse IP SoC Event in Shanghai
Wednesday, September 13, 2017
Packet Partners with Arm to Accelerate Adoption of Armv8-A for Datacenter Workloads
Tuesday, September 12, 2017
Lattice Semiconductor and Canyon Bridge Capital Partners, LLC Announce Termination of Merger Agreement Following Decision from President Trump
eSilicon tapes out deep learning ASIC
Cadence Introduces the Conformal Smart Logic Equivalence Checker
Arrows all-in-one IoT platform has Renesas Synergy MCU and Bosch sensors
Synopsys and Alango Technologies Introduce Voice Enhancement Package Optimized for DesignWare ARC Data Fusion IP Subsystem
PLDA Further Strengthen Partner Ecosystem, Unveils Comprehensive PCIe PHY and Controller integrated Solutions, to be Presented at IP-SoC China 2017
Tuesday, September 12, 2017
BrainChip Introduces World's First Commercial Hardware Acceleration of Neuromorphic Computing
Tuesday, September 12, 2017
Analog Bits to Demonstrate New High Performance and Ultra-Low Power SERDES IP at TSMC Open Innovation Platform Ecosystem Forum
Tuesday, September 12, 2017
NGCodec and Tiledmedia to Show Cloud Hardware-Accelerated Low-Latency HEVC VR360 Streaming Solution at IBC 2017
Tuesday, September 12, 2017
ArterisIP FlexNoC Interconnect Licensed by Renesas
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