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Sunday, August 27, 2017

• Automotive Embedded System Market by Vehicle, Electric Vehicle, Type, Component, Application and Region - Global Forecast to 2022
• Inside Secure completes the acquisition of Meontrust and enters Security-as-a-Service market
• Movidius Beefs up HW Acceleration in AI Chip
• Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box

Thursday, August 24, 2017

• 恩智浦携手长安汽车共同打造高竞争力车载娱乐平台
• 详解百度AI芯片架构

Wednesday, August 23, 2017

• Wearable device sales to grow nearly 17% in 2017, says Gartner
• Silvaco Announces Completion of SoC Solutions Acquisition
• Intel Delivers Real Time AI in Microsoft's New Accelerated Deep Learning Platform
• Sondrel Announces 10M GBP Investment in European Semiconductor Sector
• Cambricon employs Moortec's embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips
• North American Semiconductor Equipment Industry Posts July 2017 Billings

Wednesday, August 23, 2017

• Worldwide Semiconductor Market growth is expected to be up 17 percent in 2017 after 1.1 percent growth in 2016.

Tuesday, August 22, 2017

• Hot Chips Spotlights Chip Stacks
• 灿芯半导体与SaberTek合作开发WiSUN 和 802.11ah低功耗收发器芯片
• Everspin Appoints Semiconductor Storage Veteran Kevin Conley as CEO
• Samsung Elec to make all home appliances smart embedded with AI and IoT by 2020
• Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF
• Brite Semiconductor partners with SaberTek, Inc. to develop low-cost transceiver chips for WiSUN and 802.11ah
• China to begin 14nm production next year
• Semiconductor Industry Capital Spending Forecast to Jump 20% in 2017

Monday, August 21, 2017

• Worldwide Semiconductor Market growth is expected to be up 17 percent in 2017 after 1.1 percent growth in 2016
• SSD Shipments Top 42 Million in 2Q17, NAND Ourput Up 6% Q/Q to 41EB
• R&D: 40nm Split Gate Embedded Flash Macro With Flexible 2-in-1 Architecture
• Sino Wealth借助DesignWare蓝牙低能耗IP缩短开发时间，并满足极高的设计要求
• 保护通过USB Type-C传输的内容

Monday, August 21, 2017

• Pinnacle Imaging Systems Launches Denali-MC HDR Image Signal Processor IP Core

Monday, August 21, 2017

• MediaTek selects MIPS for LTE modems

Sunday, August 20, 2017

• TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China
• Tower confirms Chinese fab project
• THINCI Inc. Will Present Its Next-Generation Graph Streaming Processor Architecture At the Hot Chips Symposium
• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
• Qualcomm Details Arm Server SoCs
• SiFive and Rambus to Provide IP to the 'DesignShare' Economy
• Codasip Announces Latest RISC-V Processor

Wednesday, August 16, 2017

• Qualcomm boosts machine learning capability by buying Scyfer
• Taiwan government supports academic edge AI chip development project

Wednesday, August 16, 2017

• SiFive Unveils the first RISC-V-based Arduino Board

Tuesday, August 15, 2017

• Automotive Grade Linux speeds in-car infotainment developments
• Fiat Chrysler joins autonomous driving platform from BMW / Intel / Mobileye
• 基于Xilinx Zynq Z7045 SoC的CNN的视觉识别应用
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2017
• IoT tech startup DeTect Technologies raises funding from CIIE, Axilor and Keiretsu
• AI Sees New Apps, Chips, says Q'comm
• Achronix to Attend HOT CHIPS: A Symposium on High Performance Chips
• Sankalp Semiconductor awarded with ISO 9001: 2015 certification
• Uniquify Announces Silicon Success for Latest Timing Controller (T-CON) for DTV