Search News

Monday, August 14, 2017

• GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications

Sunday, August 13, 2017

• Two Senior-Level Appointments Boost EnSilica's Rapidly Expanding SoC Design and Supply Services

Thursday, August 10, 2017

• TSMC June 2017 Revenue Report

Wednesday, August 9, 2017

• TSMC July 2017 Revenue Report
• EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal

Tuesday, August 8, 2017

• UMC Reports Sales for July 2017
• Mie Fujitsu and SST Announce Automotive Platform Development on 40 nm Technology
• GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications

Tuesday, August 8, 2017

• Truechip-Moving Towards 10 Years of Successfulness

Monday, August 7, 2017

• Fault tolerant VirtuosoNext RTOS for Arm Cortex-M microcontrollers
• USITC Institutes Section 337 Investigation of Certain Mobile Electronic Devices and Radio Frequency and Processing Components Thereof
• IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND
• DENSO licenses Imagination's newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic processing
• Synopsys and Morpho Collaborate to Accelerate Deep Learning Processing for Embedded Vision Applications
• Intel Closes $15.3B Mobileye Acquisition, Touting Connected Car Business As A 'Huge Growth Opportunity'

Monday, August 7, 2017

• Faraday Monthly Consolidated Sales Report - July 2017

Monday, August 7, 2017

• Everspin Announces Sampling of the World's First 1-Gigabit MRAM Product

Monday, August 7, 2017

• PLDA Announces vDMA, a Highly Efficient Many-Channel DMA Engine Engineered for Virtualized Systems in Data Centers, to be demonstrated at Flash Memory Summit 2017

Sunday, August 6, 2017

• Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU

Thursday, August 3, 2017

• Mid-Year Global Semiconductor Sales Up 21 Percent Compared to 2016
• Palma Ceia Announces Complete PHY Solution for HaLow 802.11ah, Supporting IoT WiFi Connectivity
• Synopsys 16nm FinFET接口IP组合符合严格的汽车AEC-Q100 1级温度要求

Thursday, August 3, 2017

• CEVA, Inc. Announces Second Quarter 2017 Financial Results

Wednesday, August 2, 2017

• GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry's First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles
• Mobiveil Announces FPGA-Based SSD Platform for 3D NAND Flash Devices, Upgrades NVMe, PCI Express Controllers to Support Latest Specifications
• Significant Mid-Year Revision to 2017 IC Market Forecast
• Artificial Machines Standardizes on Mentor EDA Design Solutions to Develop Smart Machine IP
• Avery Design Systems Announces NVMe 1.3 and NVMe-MI Verification IP Updates
• Global Unichip Achieves SGS-TUV ISO26262 Certification

Tuesday, August 1, 2017

• Pixelworks Completes Acquisition of ViXS Systems
• UltraSoC delivers industry's first debug and analytics solution for Arm's AMBA 5 CHI Issue B coherency architecture
• Image recognition processor powers active safety system
• Vidatronic Contributes Expertise to AMD's Latest High-Performance Processors
• Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017