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Monday, July 31, 2017
Bluetooth SIG Announces Mesh Networking Capability
Sunday, July 30, 2017
Azul Systems Collaborates with Qualcomm to Bring Enterprise-Grade Open Source Java on Arm to Datacenters
INVECAS Acquires Lattice's HDMI Design Team and Simplay Labs Subsidiary
Taiwan ITRI reaching out to foreign IoT start-ups
Thursday, July 27, 2017
力旺晶片指紋IP已於聯電高階製程平台完成驗證
AMD首席技术官谈7nm芯片设计:史上最难
神经网络加速器研发竞赛开始
Thursday, July 27, 2017
Xilinx Sales Grow For 7th Consecutive Quarter; Advanced Product Sales Up 33% Year-Over-Year
Thursday, July 27, 2017
USB 3.0 Promoter Group Announces USB 3.2 Update
Wednesday, July 26, 2017
eMemory Announces Validation of On-Chip Security IP on UMC Advanced Nodes
Mentor supports Xilinx Zynq UltraScale+ MPSoC Platform with updated embedded platform release
UMC Breaks into 14nm
OVH and Accelize Demonstrate the Value of FPGAs in the Cloud with GZIP Compression, from CAST, Achieving Acceleration Factors of >100x
Wednesday, July 26, 2017
MediaTek Standardizes on Synopsys' HAPS-80 Prototyping System
Tuesday, July 25, 2017
ST Prepares for ToF Sensor Product Ramp
Sankalp Semiconductor to hire 300 engineers
IoT Growth Slower Than Expected
Automotive, Industrial Continue to Drive TI's Sales Gains
微软将推二代人工智能处理器,争夺行业话语权
Automotive, Industrial Continue to Drive TI's Sales Gains
Cadence推出针对最新移动和家庭娱乐应用的Tensilica HiFi 3z DSP架构
Tuesday, July 25, 2017
Xylon releases New logiADAK-VDF Video Framework Version
Monday, July 24, 2017
Value of Semiconductor Industry M&A Deals Slows Dramatically in 1H17
三星豪言五年将晶圆代工市占提至25%,台积电淡定回应
魏少军:机遇与挑战,中国高端芯片发展之路
Patents Detail IoT Security Scheme
用于优化性能、功耗和面积的7nm设计技巧
Synopsys Launches Complete HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Computing SoCs
Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications
Report: Samsung Plans to Triple Foundry Market Share
Blue Pearl Software Streamlines RTL Verification for Xilinx All Programmable FPGAs and SoCs
Monday, July 24, 2017
Security a Must for Auto GbE Switch
Monday, July 24, 2017
Enhanced Open Source Framework Available for Parallel Programming on Embedded Multicore Devices
Monday, July 24, 2017
Founders of DeepMind, OpenAI and Chief Scientist at Uber back Graphcore in new $30m funding round led by Atomico
Monday, July 24, 2017
AMD's CTO on 7nm, Chip Stacks
Sunday, July 23, 2017
Second Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
特斯拉自动驾驶仍不靠谱?那就改装一个更高阶的!
机器学习提升嵌入式视觉应用
Inside Secure announces new high-performance 400G MAC layer security (MACsec) IP for Datacenters and the Cloud
Rambus Reports Second Quarter 2017 Financial Results
Cadence Reports Second Quarter 2017 Financial Results
Friday, July 21, 2017
Neural Accelerator Battle Begins
Thursday, July 20, 2017
Flex Logix's EFLX Embedded FPGA Accelerates Processor Performance By 40-100X
Thursday, July 20, 2017
Mentor Adds Veloce Strato Emulation Platform Software to Mentor Safe ISO 26262 Qualification Program
Wednesday, July 19, 2017
DRAM and NAND are Setting Record Highs This Year, IC Insights Says
HDL Design House and AFuzion Synergy to Enhance DO-254 Projects
REFLEX CES Takes Its Autonomy with MBO Partenaires
Design Challenge - IoT on Wheels
Mentor 将 Veloce Strato 硬件加速仿真平台软件加入 Mentor Safe ISO 26262 验证程序
Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement
Innosilicon introduces next generation X11 miner, 30.2GH at 750W
Wednesday, July 19, 2017
2H17 DRAM, NAND ASP Growth to Cool, But Yearly Growth Strong
Tuesday, July 18, 2017
S2C Prodigy Quad Virtex UltraScale FPGA Prototyping Logic Module Now Available for Large Scale Designs
Arrow Electronics to Help Accelerate the Growth of Internet of Things in Asia-Pacific with its Offerings with IBM
全球领先,一步到位! 30.2GH Innosilicon达世大师矿机发布
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