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Thursday, June 15, 2017

• Mobiveil to Exhibit at DAC in Avery Design Systems' Booth, Showcasing Portfolio of IP, Platforms, Solutions for Storage, IoT, Networking, Enterprise Markets

Wednesday, June 14, 2017

• Andes Technology and M31 Technology Collaborated on Optimal Power Efficiency CPU Implementation for IoT SoC Market
• Avery Design Systems Unveils DDR5 VIP Solution Targeting DDR5 Design Ecosystem
• Noesis Technologies releases its XTS mode AES processor IP Core
• 円星科技和晶心科技合作实现CPU最佳功效化解决方案-抢占物联网芯片市场
• Microsemi Announces SoftConsole v5.1, the World's First Freely Available Windows-Hosted Eclipse Integrated Development Environment Supporting RISC-V Open Instruction Set Architecture
• Arm模型助力Cortex-A75和Cortex-A55的软件开发及性能分析
• 7 of the Top 10 Smartphone Suppliers Headquartered in China

Wednesday, June 14, 2017

• Imagination launches the MIPS I6500-F, CPU IP designed for safety-critical systems in an autonomous age

Wednesday, June 14, 2017

• Achronix Revenues to Grow 700% YoY and Exceed $100M in 2017

Wednesday, June 14, 2017

• Mentor Achieves ISO 26262 Qualification for Oasys-RTL, Nitro-SoC and FormalPro Tool Reports

Wednesday, June 14, 2017

• True Circuits Attends Design Automation Conference

Wednesday, June 14, 2017

• UMC Restructures Executive Team

Tuesday, June 13, 2017

• Visible Light Communication Technology Shines in China Innovation and Entrepreneurship Fair 2017
• ReFLEX CES Partners with Orthogone Technologies to Provide Integrated Ethernet MAC/PCS IP Core Solutions on FPGA COTS Boards
• MIPS releases safety-critical processor core
• Google Ramps Mobile SoC Team
• Arasan Announces Advanced Process Nodes for High Performance SD Card UHS-II Physical Layer Interface
• UMC Restructures Executive Team

Monday, June 12, 2017

• Vidatronic to Exhibit at 54th Design Automation Conference (DAC) in Austin, TX

Monday, June 12, 2017

• CAST推动汽车电子IP更新，推出新的AVB / TSN以太网和SAE J2716传感器总线内核及CAN-FD时间戳
• 台积电7nm夺回高通骁龙845订单，三星傻眼
• GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology
• Arm, Enea, Marvell and PicoCluster announce world's most compact OPNFV Pharos Lab
• QuickLogic Taps Semiconductor Intellectual Property Veteran for Advisory Board
• CAST Drives Automotive IP Forward with New AVB/TSN Ethernet and SAE J2716 Sensor Bus Cores plus CAN-FD Time-Stamping
• HDL Design House to Exhibit at DAC as Arm Approved Design Partner
• Qualcomm Reportedly Taps TSMC's 7nm
• GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks

Monday, June 12, 2017

• Magillem EDA solution selected by Renesas for design automation, IP packaging and content generation

Monday, June 12, 2017

• The European Commission opens in-depth investigation into Qualcomm's proposed acquisition of NXP

Monday, June 12, 2017

• EC Refs Whistle Qualcomm-NXP Deal

Monday, June 12, 2017

• BT, Intercede and Imagination collaborate on IoT security

Monday, June 12, 2017

• Silab Tech Announces Release of XGS-PON SERDES IP Core

Sunday, June 11, 2017

• 莱迪思新一代FPGA将采用FD-SOI工艺以强化差异化竞争
• 全新Cadence Virtuoso系统设计平台帮助实现IC、封装和电路板无缝集成的设计流程
• RISC-V想革Arm的命？先解决这几个障碍
• 雷诺高通联合推出动态无线充电技术

Friday, June 9, 2017

• DARPA Funds Development of New Type of Processor

Friday, June 9, 2017

• Intel hints that Microsoft, Qualcomm's Windows 10/ARM x86 emulation could infringe on its IP

Friday, June 9, 2017

• TSMC May 2017 Revenue Report

Friday, June 9, 2017

• UMC Reports Sales for May 2017

Thursday, June 8, 2017

• 日本一家公司用FPGA做了一个物联网海量分析工具
• Barco Silex更新了4K超过1Gb的OEM解决方案，具备Pro A / V应用的新功能
• Barco Silex updates its 4K over 1Gb OEM solutions with new features for Pro A/V applications.
• 台積公司2017年5月營收報告
• 物联网芯片成半导体巨头最新蛋糕，战鼓擂响，谁是最后胜利者？
• 人工智能芯片领域群雄崛起，谁能抢得下一轮新科技浪潮的话语权

Thursday, June 8, 2017

• Mentor Catapult HLS Enables Stream TV's R&D Group SeeCubic to Develop Glasses-Free 3D Digital Display IP

Wednesday, June 7, 2017

• Long-Term Internet of Things Semiconductor Forecast Reduced
• Greengrass Embeds Amazon in IoT
• PCI-SIG Fast Tracks Evolution to 32GT/s with PCI Express 5.0 Architecture
• Synopsys Expands embARC Initiative to Include Additional ARC Processors and Open Source Projects to Accelerate Development of Embedded Systems
• ELSYS Eastern Europe Selected as Arm Approved Design Partner
• 新式AI芯片为IoT赋予机器学习功能

Wednesday, June 7, 2017

• TSMC Promotes Dave Keller to President, TSMC North America

Tuesday, June 6, 2017

• 5nm only a few years away, say IBM Research scientists
• Bosch, TomTom tap radar sensors to create road maps
• STMicroelectronics Standardizes on Synopsys VC Formal for Faster Verification Closure of Leading Microcontroller Designs
• VeriSilicon's Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP's i.MX 8 Flagship Applications Processor
• PLDA Announces "Inspector" - An Evolution of the PCI Express 4.0 PDK That Enables PCIe 4.0 Technology Design Validation and Performance Optimization Today
• Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node
• Faraday Monthly Consolidated Sales Report - May 2017
• 芯原人工智能引擎助恩智浦i.MX 8旗舰应用处理器实现多感官体验
• PCI-SIG Publishes PCI Express 4.0, Revision 0.9 Specification

Tuesday, June 6, 2017

• Mentor Ushers in New Era of C++ Verification Signoff with New Catapult Tools and Solutions

Tuesday, June 6, 2017

• Rambus Appoints Emiko Higashi to Its Board of Directors

Monday, June 5, 2017

• Mentor 宣布推出适用于三星 8LPP 和 7LPP 工艺技术的 工具和流程
• Synopsys' Complete CCIX IP Solution Enables Cache Coherency for High-Performance Cloud Computing SoCs
• Avery Design Systems Targets Accelerator Applications With Verification Solutions for CCIX, AMBA 5 CHI, and PCIe 4.0
• Report: Apple working on neural processor
• Record Fab Spending for 2017 and 2018
• Global Semiconductor Sales Increase 21 Percent Year-to-Year in April; Double-Digit Annual Growth Projected for 2017
• 世界首款5纳米工艺芯片诞生，谁这么不给英特尔面子？
• UEFI Forum Appoints Arm to Board of Directors Fortifying Its Commitment to Firmware Innovation

Monday, June 5, 2017

• Lattice Semiconductor's ECP5 FPGA Enables Energy-Efficient Embedded Vision Systems at the Edge

Monday, June 5, 2017

• Rambus and Synopsys Collaborate to Deliver Provisioning Services for Hardware Secure Modules

Monday, June 5, 2017

• 5nm nanosheet transistors cut power by 75%

Monday, June 5, 2017

• GUC Monthly Sales Report - May 2017

Monday, June 5, 2017

• EnSilica develops sureCore's new, Ultra-Low Power IoT reference platform

Monday, June 5, 2017

• Nvidia CEO Says Moore's Law Is Dead

Monday, June 5, 2017

• Qualcomm-NXP Deal Faces EU Snag

Sunday, June 4, 2017

• Apple, Amazon to Join Foxconn's Toshiba Bid
• 十年首次！2017年15家半导体厂商资本支出超10亿美元
• 想把存储器件卖给车厂？记住下面几个要点
• Harvard Researchers Select Flex Logix's Embedded FPGA Technology To Design Deep Learning SoCs
• 惊人！Python+FPGA 实现FPGA开发大提速？！！
• 莱迪思ECP5™ FPGA助力实现低功耗网络边缘嵌入式视觉系统
• Cadence扩展JasperGold平台用于高级形式化RTL签核
• 人工智能应用需要一种专用的处理器IP
• 彻底碾压Intel！三星8/7/6/5/4nm工艺齐登场
• SEMI Reports First Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $13.1 Billion