Search News

Thursday, July 4, 2024

• HCLTech sweeps top honors in the Institutional Investor Research Annual Asia Executive Team survey

Wednesday, July 3, 2024

• EU project to develop advanced navigation for satellites
• How RISC-V is changing the server market
• METASAT Project Celebrates 18 Months of Innovation: Key Developments in Satellite Technology
• Quantum communication : How will 'quantum-secure' communication technologies develop in future?
• TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5
• UMC Reports Sales for June 2024

Tuesday, July 2, 2024

• eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
• Google Shifts Foundry Partnership from Samsung to TSMC for Tensor G5 Chip
• How AI impacts the qualification of safety-critical automotive software
• New European Semiconductor Company, Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP
• Siemens and Boson Energy enter agreement to accelerate the green energy transition through waste-to-hydrogen (to-X) technology
• YorChip predicts 2026 will be the year of the chiplet

Monday, July 1, 2024

• C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture
• Flex Logix Boosts AI Accelerator Performance and Long-Term Efficiency
• GlobalFoundries acquires Tagore Technology's GaN technology
• Introducing Next-Generation Security IPs: Unmatched Protection with EEC, AES, SHA-2, CRP1A, and ECDSA
• Mixel Announces Immediate Availability of MIPI C-PHY/D-PHY Combo IP on STMicroelectronics 40LP Process Technology
• Renesas and Altium Announce the Conclusion of the Regulatory Review for Renesas' Proposed Acquisition of Altium
• Tiempo Secure and Menta announce strategic partnership to enhance security solutions

Sunday, June 30, 2024

• Altair Signs Agreement to Acquire Metrics Design Automation Inc. Expands Footprint in EDA Industry
• Arteris Joins Russell 2000® Index
• Arteris Joins Russell 2000® Index
• Building Intel's Foundry Ecosystem for the AI Era
• CEO Interview: Sameer Wasson of MIPS -- "Have a Steady Hand, Don't be Distracted"
• Creating a Center of Excellence for IC Design

Saturday, June 29, 2024

• EDA Companies Unite With Samsung for AI and 3D IC Technology

Thursday, June 27, 2024

• RISC-V Summit Europe News - Processor IP, Verification Tools, and More
• STMicroelectronics restructures for the AI age

Wednesday, June 26, 2024

• All systems go for 7nm FDSOI
• Axelera AI raises $68m for data centre push
• Crafting a Silicon Lifecycle Management Strategy for HPC and Data Centers
• Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications
• Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight
• Rambus offers DDR5 server PMICs to address AI workloads

Wednesday, June 26, 2024

• Lattice Introduces New Secure Control FPGA Family with Advanced Crypto-Agility and Hardware Root of Trust

Tuesday, June 25, 2024

• FortifyIQ Introduces FortiPKA-RISC-V: A Breakthrough in Public Key Cryptography Acceleration
• Tenstorrent To Offer AI Workstation For Developers
• Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity
• M31 Debuts at the North American Design Automation Conference, Showcasing IP Solutions for Advanced Processes

Tuesday, June 25, 2024

• Cypress Delivers Media Transfer Protocol Reference Design For Portable Media Players

Tuesday, June 25, 2024

• Intel's Latest FinFET Is Key to Its Foundry Plans
• Europe invests 830 million euros to build FAMES FD-SOI pilot line to achieve 7nm with planar CMOS

Monday, June 24, 2024

• Semidynamics releases Tensor Unit efficiency data for its new All-In-One AI IP
• Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal
• CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
• Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing
• Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
• Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
• Enosemi announces availability of C-band-compatible electronic-photonic design IP
• ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC
• Comcores Unveils Industry-First MAC Privacy Protection IP for Enhanced Ethernet Security
• SiFive Announces 4th Generation of Popular Essential Product Line to Spur Innovation Across Embedded Applications
• X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices

Monday, June 24, 2024

• True Circuits Introduces the JSPICEâ„¢ Design Environment (JDEâ„¢) at the Design Automation Conference

Monday, June 24, 2024

• Can Semiconductor Chips be Recycled?
• Efabless Empowers 40 Commercial Companies to Design Chips
• Siemens gets certification for Solido SPICE on Intel nodes, and adds EMIB
• EDA vendors put Intel EMIB interconnect in design flows for 3D ICs

Sunday, June 23, 2024

• RISC-V in Space Workshop in Gothenburg on April 2-3, 2025!
• Figuring Out the Carbon Footprint of an Individual Chip
• True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference
• Ventana CEO to Deliver a Keynote at RISC-V Summit Europe
• T2M-IP Announces Silicon-Proven MIPI D-PHY v2.5 Tx and DSI-2 Tx Controller Low-Power, Cost-Effective IP Cores Solutions for Advanced SoCs
• Flex Logix Celebrates 10 Years of Success and Innovation
• Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere
• Crypto Quantique, ZARIOT and Kigen unveil quantum-safe hardware root-of-trust for cellular IoT
• Semiwise, sureCore, and Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development for Quantum Computing and Energy-Efficient Data Centers
• Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite
• Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
• SignatureIP Makes Network-on-Chip (NoC) Design Widely Accessible with Cloud-Based iNoCulatorâ„¢ Platform