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Monday, July 17, 2017

• GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks

Monday, July 17, 2017

• Green Hills Software INTEGRITY-178 tuMP Multicore Operating System Selected by Commercial & Military Flight Critical Equipment Supplier for DO-178B Level A Certification on the Xilinx Zynq Ultrascale+ MPSoC

Monday, July 17, 2017

• Chuang Fei Xin Anti-Fuse One Time Programming Solution Qualified In Silterra High Voltage Technology

Monday, July 17, 2017

• Imagination announces MIPSfpga 2.0: a comprehensive set of materials for teaching CPU architecture

Sunday, July 16, 2017

• Qualcomm grabs MediaTek's China slots
• Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM
• Does NVMe Have a Place in Industrial Embedded and IoT?
• Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
• Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM
• Continental's auto-driving software gets handover issue under control

Thursday, July 13, 2017

• 对人工智能芯片的思考，魏少军教授的认识绝对是最深刻的

Thursday, July 13, 2017

• Mentor Accelerates Android Development for Xilinx Zynq UltraScale+ MPSoC

Thursday, July 13, 2017

• Semi Content in Electronic Systems Forecast to Set New Record in 2017

Thursday, July 13, 2017

• Imec Aims 2-D FETs at Sub-5-nm Node

Wednesday, July 12, 2017

• Faraday Unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD Controller
• Semiconductor Content in an Electronic System will reach 28.1% in 2017, says IC Insights
• Imec enables 5nm 2D FETs
• Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project
• TSMC Reports Second Quarter EPS of NT$2.56
• 新一代标准让蓝牙更强大 Tech Shenzhen 研讨会上成
• 自动驾驶成功的关键是什么？--深度解析
• 芯原的Vivante视觉处理器IP助力ADAS投放大众市场
• 格芯与芯原联袂实现适合次世代物联网的单芯片解决方案
• 智原推出28HPC USB 3.1 PHY与40LP Type-C PHY并整合电力传输PD控制器
• TSMC Logs First 10nm Sales
• Siri disappoints again, this time with apps

Tuesday, July 11, 2017

• Arasan Announces IP solutions for the Next Generation of Mobile Storage - UFS 3.0
• University of Bath to build 60m pounds automotive R&D institute
• VeriSilicon's Vivante Vision Processor IP Enables ADAS for Mass Market
• NGCodec Joins the Alliance for Open Media
• Suppliers Beware: The Perils of Vertical Integration
• Arm Cortex-A55: 从端到云实现高效能

Tuesday, July 11, 2017

• U.S. Paves Roads to Trusted Fabs

Tuesday, July 11, 2017

• Apple hits back at Imagination's 'misleading' statements, disputes timeline

Tuesday, July 11, 2017

• GUC Opens New Korea Office

Monday, July 10, 2017

• Uniquify Joins FDXcelerator Program to Deliver DDR Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform
• 創意電子韓國新辦公室開幕
• Gartner Says Worldwide Semiconductor Revenue to Reach $400 Billion in 2017
• Synopsys扩大embARC计划纳入更多ARC处理器和开源项目以加速嵌入式系统的开发
• 200mm Fabs Thriving; SEMI's Updated 200mm Fab Report Now Available
• Embedded Security for Internet of Things Market to Widen at a CAGR of 14.6% by 2027
• Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs
• STMicroelectronics Partners with Kilopass For One-Time Programmable Anti-Fuse NVM Memory
• Chip Sales Now Expected to Top $400 Billion

Monday, July 10, 2017

• UMC Reports Sales for June 2017

Sunday, July 9, 2017

• 瞄准下一波高速成长市场，Synaptics获面向消费类物联网的关键技术
• 台積公司2017年6月營收報告
• Rambus Reportedly Exploring Sale Possibilities
• Mali-G72 -- 让明日科技今日成真
• IP-Maker NVMe IP, ready for persistent memories

Friday, July 7, 2017

• Graphcore's 'Colossus' chip due before end of year

Friday, July 7, 2017

• Faraday Monthly Consolidated Sales Report- June 2017

Thursday, July 6, 2017

• The fastest C-Compiler for i251 from Dolphin Integration is now available with our free discovery license!

Thursday, July 6, 2017

• Imagination Technologies -- Full Year Results 2017

Thursday, July 6, 2017

• GUC Monthly Sales Report - June 2017

Thursday, July 6, 2017

• Spectra7 Microsystems Inc. Announces Closing of $4.6 Million Bought Deal Financing and First Tranche of Private Placement of $1.3 Million

Thursday, July 6, 2017

• Imagination fades in 2016 semiconductor IP market

Thursday, July 6, 2017

• Synopsys Expands embARC Initiative to Include Additional ARC Processors and Open Source Projects to Accelerate Development of Embedded Systems

Wednesday, July 5, 2017

• China Makes Two IoT Calls
• AppoTech Ltd. Selects Andes Technology Corporation N968A CPU For Its Next Generation Audio Codec
• "智能嵌入式"变身"IoT"，试试采用DesignStart和Cordio来设计
• ESD Alliance Reports EDA Industry Revenue Increase For Q1 2017
• Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
• Panasonic IoT wireless modules pre-certified at Avnet Abacus

Tuesday, July 4, 2017

• Bosch invests in Artificial Intelligence
• Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services
• Samsung starts production at world's biggest fab
• Micron Fab Incident Disrupts DRAM Supply
• Imagination raises revenues as sale process continues
• NXP extends software solutions for MCUs based on the Power Architecture
• 强势来袭，百度在全新公有云加速服务上部署Xilinx FPGA