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Monday, June 19, 2017

• Runtime Accelerates Time to Market with New License Allocation Management Solution

Monday, June 19, 2017

• Rambus Launches JEDEC-Standard DDR4 NVRCD for Emerging NVDIMM Applications

Monday, June 19, 2017

• UltraSoC announces industry's first processor trace support for RISC-V

Monday, June 19, 2017

• ANSYS And Synopsys To Partner In Accelerating Robust Design Optimization For Next Generation High-Performance Computing, Mobile And Automotive Products

Monday, June 19, 2017

• Truechip Announces First Customer Shipment of Ethernet 400G/200G VIP

Monday, June 19, 2017

• Truechip Collaborates with OmniPhy for Verification of PCIe Gen4 IP solution

Monday, June 19, 2017

• Sankalp Semiconductor Announces Availability of 16nm IO Libraries

Monday, June 19, 2017

• North American Semiconductor Equipment Industry Posts May 2017 Billings

Monday, June 19, 2017

• Silvaco to Acquire SoC Solutions

Monday, June 19, 2017

• GUC Successfully Rolls out HBM2 Total Solution

Sunday, June 18, 2017

• Synopsys Delivers Verification IP and Test Suite for Arm AMBA 5 CHI Issue B Specification
• GLOBALFOUNDRIES, ON Semiconductor Deliver the Industry's Lowest Power Bluetooth Low Energy SoC Family
• TSMC to offer embedded ReRAM in 2019
• Arm DesignStart 帮助您构建定制型 SoC 的 6 种方式
• Andes Technology Provides System Control Processor IP for Wave Computing's Revolutionary Dataflow Processing Unit Design
• GUC成功推出 HBM2 全方位解決方案
• 探讨自主驾驶汽车面临的五大未解之题
• Shanghai Frequen Licenses and Deploys CEVA Bluetooth Low Energy IP in New IoT Product Line
• Menta Offers Validation Board for Embedded FPGA Supporting TSMC's 28nm HPC+ Process
• Cadence针对Palladium Z1仿真平台发布VirtualBridge适配器，软件初启时间最高可缩短三个月
• Cadence Expands Online Tool Access for Arm DesignStart Customers to Accelerate SoC Design Delivery
• 通过高效的功耗睡眠模式改善电池供电的设备运行时间

Friday, June 16, 2017

• MediaTek Chooses TSMC for 7nm

Friday, June 16, 2017

• The new release of SoC-e IEEE 1588 IP Core supports 10 Gigabit Ethernet

Friday, June 16, 2017

• Barco Silex extends crypto offering with Chacha20/Poly1305 authenticated encryption

Friday, June 16, 2017

• Avery Design Systems Unveils MIPI I3C VIP Targeting Sensors in Smartphone, IoT, Automotive Designs

Thursday, June 15, 2017

• 2017年人工智能研究报告
• SoC新玩法：嵌入式FPGA来了

Thursday, June 15, 2017

• Mentor Verification Is First to Deliver Portable Stimulus Technology Across the Full Enterprise Verification Platform

Thursday, June 15, 2017

• Toshiba Selects Synopsys VC Formal Verification Solution

Thursday, June 15, 2017

• Mobiveil to Exhibit at DAC in Avery Design Systems' Booth, Showcasing Portfolio of IP, Platforms, Solutions for Storage, IoT, Networking, Enterprise Markets

Wednesday, June 14, 2017

• Andes Technology and M31 Technology Collaborated on Optimal Power Efficiency CPU Implementation for IoT SoC Market
• Avery Design Systems Unveils DDR5 VIP Solution Targeting DDR5 Design Ecosystem
• Noesis Technologies releases its XTS mode AES processor IP Core
• 円星科技和晶心科技合作实现CPU最佳功效化解决方案-抢占物联网芯片市场
• Microsemi Announces SoftConsole v5.1, the World's First Freely Available Windows-Hosted Eclipse Integrated Development Environment Supporting RISC-V Open Instruction Set Architecture
• Arm模型助力Cortex-A75和Cortex-A55的软件开发及性能分析
• 7 of the Top 10 Smartphone Suppliers Headquartered in China

Wednesday, June 14, 2017

• Imagination launches the MIPS I6500-F, CPU IP designed for safety-critical systems in an autonomous age

Wednesday, June 14, 2017

• Achronix Revenues to Grow 700% YoY and Exceed $100M in 2017

Wednesday, June 14, 2017

• Mentor Achieves ISO 26262 Qualification for Oasys-RTL, Nitro-SoC and FormalPro Tool Reports

Wednesday, June 14, 2017

• True Circuits Attends Design Automation Conference

Wednesday, June 14, 2017

• UMC Restructures Executive Team

Tuesday, June 13, 2017

• Visible Light Communication Technology Shines in China Innovation and Entrepreneurship Fair 2017
• ReFLEX CES Partners with Orthogone Technologies to Provide Integrated Ethernet MAC/PCS IP Core Solutions on FPGA COTS Boards
• MIPS releases safety-critical processor core
• Google Ramps Mobile SoC Team
• Arasan Announces Advanced Process Nodes for High Performance SD Card UHS-II Physical Layer Interface
• UMC Restructures Executive Team

Monday, June 12, 2017

• Vidatronic to Exhibit at 54th Design Automation Conference (DAC) in Austin, TX

Monday, June 12, 2017

• CAST推动汽车电子IP更新，推出新的AVB / TSN以太网和SAE J2716传感器总线内核及CAN-FD时间戳
• 台积电7nm夺回高通骁龙845订单，三星傻眼
• GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology
• Arm, Enea, Marvell and PicoCluster announce world's most compact OPNFV Pharos Lab
• QuickLogic Taps Semiconductor Intellectual Property Veteran for Advisory Board
• CAST Drives Automotive IP Forward with New AVB/TSN Ethernet and SAE J2716 Sensor Bus Cores plus CAN-FD Time-Stamping
• HDL Design House to Exhibit at DAC as Arm Approved Design Partner
• Qualcomm Reportedly Taps TSMC's 7nm
• GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G Networks

Monday, June 12, 2017

• Magillem EDA solution selected by Renesas for design automation, IP packaging and content generation

Monday, June 12, 2017

• The European Commission opens in-depth investigation into Qualcomm's proposed acquisition of NXP

Monday, June 12, 2017

• EC Refs Whistle Qualcomm-NXP Deal

Monday, June 12, 2017

• BT, Intercede and Imagination collaborate on IoT security

Monday, June 12, 2017

• Silab Tech Announces Release of XGS-PON SERDES IP Core

Sunday, June 11, 2017

• 莱迪思新一代FPGA将采用FD-SOI工艺以强化差异化竞争
• 全新Cadence Virtuoso系统设计平台帮助实现IC、封装和电路板无缝集成的设计流程
• RISC-V想革Arm的命？先解决这几个障碍
• 雷诺高通联合推出动态无线充电技术

Friday, June 9, 2017

• DARPA Funds Development of New Type of Processor

Friday, June 9, 2017

• Intel hints that Microsoft, Qualcomm's Windows 10/ARM x86 emulation could infringe on its IP

Friday, June 9, 2017

• TSMC May 2017 Revenue Report

Friday, June 9, 2017

• UMC Reports Sales for May 2017

Thursday, June 8, 2017

• 日本一家公司用FPGA做了一个物联网海量分析工具
• Barco Silex更新了4K超过1Gb的OEM解决方案，具备Pro A / V应用的新功能
• Barco Silex updates its 4K over 1Gb OEM solutions with new features for Pro A/V applications.
• 台積公司2017年5月營收報告
• 物联网芯片成半导体巨头最新蛋糕，战鼓擂响，谁是最后胜利者？
• 人工智能芯片领域群雄崛起，谁能抢得下一轮新科技浪潮的话语权

Thursday, June 8, 2017

• Mentor Catapult HLS Enables Stream TV's R&D Group SeeCubic to Develop Glasses-Free 3D Digital Display IP

Wednesday, June 7, 2017

• Long-Term Internet of Things Semiconductor Forecast Reduced
• Greengrass Embeds Amazon in IoT
• PCI-SIG Fast Tracks Evolution to 32GT/s with PCI Express 5.0 Architecture
• Synopsys Expands embARC Initiative to Include Additional ARC Processors and Open Source Projects to Accelerate Development of Embedded Systems
• ELSYS Eastern Europe Selected as Arm Approved Design Partner
• 新式AI芯片为IoT赋予机器学习功能

Wednesday, June 7, 2017

• TSMC Promotes Dave Keller to President, TSMC North America

Tuesday, June 6, 2017

• 5nm only a few years away, say IBM Research scientists
• Bosch, TomTom tap radar sensors to create road maps
• STMicroelectronics Standardizes on Synopsys VC Formal for Faster Verification Closure of Leading Microcontroller Designs
• VeriSilicon's Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP's i.MX 8 Flagship Applications Processor
• PLDA Announces "Inspector" - An Evolution of the PCI Express 4.0 PDK That Enables PCIe 4.0 Technology Design Validation and Performance Optimization Today
• Uniquify's LPDDR4 Super Combo Interface IP in Volume Production at 28nm Low-power Node
• Faraday Monthly Consolidated Sales Report - May 2017
• 芯原人工智能引擎助恩智浦i.MX 8旗舰应用处理器实现多感官体验
• PCI-SIG Publishes PCI Express 4.0, Revision 0.9 Specification