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Thursday, April 20, 2017

• Mentor Announces 64-bit ARMv8-A support for the Nucleus Real-Time Operating System

Thursday, April 20, 2017

• Mentor Graphics expands formal verification's reach with new cross-platform GUI and apps for sequential logic equivalence checking and CDC gate-level analysis

Thursday, April 20, 2017

• Accelize Integrates Amazon EC2 F1 Instance into its QuickPlay/QuickStore Framework

Thursday, April 20, 2017

• Princeton finds bugs in RISC-V architecture

Wednesday, April 19, 2017

• 联发科采用Cadence 7nm工艺实现流
• Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process

Wednesday, April 19, 2017

• CEVA, Inc. Appoints Ran Soffer as Vice President of Marketing and Corporate Development

Tuesday, April 18, 2017

• Faraday Delivers V-by-One HS PHY & Controller IP on UMC 28HPCU Process
• IP-Maker to release new NVMe host IP
• Arastu Systems Ethernet 10G Digital Switch IP Soft Core for Time-Critical Applications
• Apple to cut Imagination royalty to a third, says UBS
• NXP Sells Stake in China Foundry ASMC
• Samsung Completes Qualification of its 2nd Generation 10nm Process Technology
• Xilinx Announces General Availability of Virtex UltraScale+ FPGAs in Amazon EC2 F1 Instances
• NXP Sells Stake in China Foundry ASMC

Monday, April 17, 2017

• 低成本快速定制SoC：智能硬件和IoT初创公司的差异化成功之路
• ADAS准备好被"重新定义"了吗？
• 唯"开放"的自动驾驶平台才能与Mobileye们竞争
• DDR4将首度超越DDR3　2017年占整体DRAM58%
• 三股力量推动定制SoC增长，内核授权亟需轻量级的商业模式
• 恩智浦首个FD-SOI芯片意味着什么？
• 內嵌力旺電子NeoEE矽智財之量產晶圓累積出貨突破十萬片
• Ncore 2.0缓存一致性互连和Resilience套件助力机器学习SoC设计
• Dolphin Integration announces the availability of the new generation 28 nm SpRAM generator
• Cadence发布7纳米工艺Virtuoso先进工艺节点扩展平台
• CAST Becomes Member of ESD Alliance
• Inside Secure partners with ContentArmor to address Hollywood studios' higher security requirements for early-window and UHD movies delivered over-the-top (OTT)
• Cambricon Licenses Arteris FlexNoC Interconnect IP for Machine Learning SoCs

Sunday, April 16, 2017

• Lynx出品：基于Xilinx Zynq UltraScale+ MPSoC的内核分离技术LynxSecure
• Rambus Expands Cryogenic Memory Collaboration with Microsoft
• 灿芯半导体喜获上海市浦东新区科学技术奖

Friday, April 14, 2017

• TSMC Expects First-Half Smartphone Slump

Friday, April 14, 2017

• NXP Shows First FD-SOI Chips

Friday, April 14, 2017

• PT13: A compact 8-bit microprocessor IP core for just $1000

Friday, April 14, 2017

• DDR4 Set to Account for Largest Share of DRAM Market by Architecture

Thursday, April 13, 2017

• 封裝/PCB重要性與日俱增 Cadence整合性方案全力部署
• Cadence发布大规模并行物理签核解决方案Pegasus验证系统
• Truechip announces first customer shipment of JESD204B Comprehensive Verification IP (CVIP)
• CERN openlab Explores New CPU/FPGA Processing Solutions

Thursday, April 13, 2017

• Dialog suffers on report of Apple in-sourcing

Thursday, April 13, 2017

• Open-Silicon to Showcase its Spec2Chip IoT SoC Platform Solution Consisting of IoT Edge SoC Platform and IoT Gateway SoC Platform at IoT DevCon Santa Clara on April 26-27, 2017

Thursday, April 13, 2017

• Synapse Design Acquires Asilicon to Address Customer Demand and Provide Increased Access to Off-Shore Design Centers

Wednesday, April 12, 2017

• TowerJazz and Aisin Seiki Announce Mass Production of New Generation Automotive Body Products
• Cadence takes chip verification in cloud to new level
• Mouser signs Intel FPGA board firm ReFLEX CES
• TSMC Reports First Quarter EPS of NT$3.38
• Analog Devices and Renesas Electronics collaborate on automotive radar sensing
• RFEL teams with Plextek for adaptive FPGA-based video processing
• Gartner Says Worldwide Semiconductor Revenue Forecast to Increase 12.3 Percent in 2017
• Toshiba Expands Line-up of Arm Cortex-M-Based Microcontrollers
• Silicon Creations Selects Mentor Graphics Software for High-Performance Analog and Mixed-Signal IP Verification
• 恩智浦携手亚马逊，为智能家居带来更多Alexa体验
• 华虹宏力与华大九天再联手 国产EDA工具助力IP设计
• 台积电InFO封装技术升级优化，Cadence到底有啥妙招？
• Cryptography in the age of AI and quantum computing
• Arm and Intel part of IoT MCU benchmarking group

Wednesday, April 12, 2017

• Moortec and UltraSoC collaborate to enable next-generation "smart" PVT sensors

Wednesday, April 12, 2017

• ClioSoft, OneSpin and Truechip Sponsor the Ninth Annual I LOVE DAC Campaign at the 54th Design Automation Conference

Tuesday, April 11, 2017

• Over 100,000 Wafers Embedded with eMemory's NeoEE IP Shipped
• Novatek Adopts Synopsys' Industry-First HDMI 2.1 with HDCP 2.2 Verification IP and Test Suite
• Mentor Announces Availability of Qualified Reference Flow to Help Designers Achieve Success with Samsung 14LPP Process Technology
• Moortec and UltraSoC collaborate to enable next-generation
• UK government sets connected vehicle security plan in motion
• MACOM Announces Reference Design Supporting All Requirements for Next Generation CoaXPress 2.0 Standard
• Xilinx Announces Multi-Year Succession Plan and New COO
• Image sensor honed for street viewing
• Malware targets IoT devices for data wipes

Tuesday, April 11, 2017

• Qualcomm Returns Fire in Apple Suit

Monday, April 10, 2017

• Microsemi Announces Libero SoC v11.8 Software Providing FPGA Designers Mixed Language Simulation and Best-in-Class Debugging Capabilities
• Eta Compute Debuts with World's Lowest Power Microcontroller IP Targeting Energy Harvesting Segment
• Socionext Develops Small, Low Power 4K/60p HEVC Codec
• Cadence Launches the Pegasus Verification System, a Massively Parallel Physical Signoff Solution
• Qualcomm Files Answer and Counterclaims to Apple Lawsuit
• Bluetooth low energy smart sportswatch tracks distance covered, steps taken, and calories burned via partner iOS and Android smartphone app
• 瑞萨电子为进一步强化对ADAS及自动驾驶的支持推出Renesas Autonomy™
• 西门子完成对Mentor Graphics的收购
• 低功耗蓝牙智能运动手表配合iOS和安卓智能手机App

Monday, April 10, 2017

• TSMC March 2017 Revenue Report

Monday, April 10, 2017

• PLDA Launches PLDA Design Day Event In Shanghai, China, a First-of-Its-Kind Event, 100% Focused on PCIe 4.0 Design

Monday, April 10, 2017

• UMC Reports Sales for March 2017

Sunday, April 9, 2017

• 台積公司2017年3月營收報告
• 山海资本完成对硅谷数模半导体的收购
• 物联网最低功耗解决方案究竟是由何种传感器实现的？
• Open-Silicon to Showcase IoT ASIC Platform and IoT Gateway SoC Platform along with Comprehensive HBM2 IP Sub-System Solution at The IoT DevCon Santa Clara on April 26-27, 2017
• 智能汽车传感器大融合，Mentor要跟芯片厂抢生意？
• 中国信息通信研究院与恩智浦签订智能网联汽车/车联网战略合作协议
• Kintex-7 FPGA展现卓越的全可编程性： Keysight 发布六个全新PXI AWG/数字转换器
• Xilinx机器视觉解决方案
• Foundries Need Clear Benchmarks
• Chinese Investment Firm Agrees to Buy Xcerra
• 全新物理设计时序优化与Silicon-aware Sign-off解决方案正式发布