Search News

Monday, June 5, 2017

• Lattice Semiconductor's ECP5 FPGA Enables Energy-Efficient Embedded Vision Systems at the Edge

Monday, June 5, 2017

• Rambus and Synopsys Collaborate to Deliver Provisioning Services for Hardware Secure Modules

Monday, June 5, 2017

• 5nm nanosheet transistors cut power by 75%

Monday, June 5, 2017

• GUC Monthly Sales Report - May 2017

Monday, June 5, 2017

• EnSilica develops sureCore's new, Ultra-Low Power IoT reference platform

Monday, June 5, 2017

• Nvidia CEO Says Moore's Law Is Dead

Monday, June 5, 2017

• Qualcomm-NXP Deal Faces EU Snag

Sunday, June 4, 2017

• Apple, Amazon to Join Foxconn's Toshiba Bid
• 十年首次！2017年15家半导体厂商资本支出超10亿美元
• 想把存储器件卖给车厂？记住下面几个要点
• Harvard Researchers Select Flex Logix's Embedded FPGA Technology To Design Deep Learning SoCs
• 惊人！Python+FPGA 实现FPGA开发大提速？！！
• 莱迪思ECP5™ FPGA助力实现低功耗网络边缘嵌入式视觉系统
• Cadence扩展JasperGold平台用于高级形式化RTL签核
• 人工智能应用需要一种专用的处理器IP
• 彻底碾压Intel！三星8/7/6/5/4nm工艺齐登场
• SEMI Reports First Quarter 2017 Worldwide Semiconductor Equipment Figures; Record Quarterly Billings of $13.1 Billion

Thursday, June 1, 2017

• Cadence数字、签核与定制／模拟工具助力实现三星7LPP和8LPP工艺技术

Thursday, June 1, 2017

• EDA pioneer Alberto Sangiovanni-Vincentelli joins UltraSoC advisory board

Thursday, June 1, 2017

• Cortus joins RISC-V fan club

Wednesday, May 31, 2017

• Chips&Media announced Image Signal Processing (ISP) IP family targeting surveillance and automotive products
• Socionext adds to Milbeaut line-up
• Apple, Intel Attack Rivals
• Faraday Announces the World's First Automotive ASIC Qualified for AEC-Q100 and AEC-Q006
• CAST Adds DO-254 Avionics Interface Cores though New Partnership with Nolam
• PLDA at the Epicenter of PCIe 4.0 Wave of Adoption with Recent PCIe Design Conference Achievements and Testing Success for PLDA's Gen4SWITCH
• Microsemi and Intrinsic ID Collaboration Delivers SRAM-PUF in PolarFire FPGAs, Providing Advanced Security
• 高通恩智浦并购案生变，大股东欲坐地起价
• Gartner公布2016年全球收入TOP10半导体厂商排行
• 智原科技ASIC车用芯片领先通过AEC-Q100及AEC-Q006可靠性验证标准
• FPGA 在加速下一代深度学习方面能击败GPU吗？
• 不是纸上谈兵，FD-SOI将凭借这几点进入主流市场
• Collaborative Linux development project picks Renesas R-car as reference platform
• China's Arm twist underlines strategic nature of tech

Tuesday, May 30, 2017

• QuickLogic Establishes eFPGA Support Center to Accelerate IP Licensing Model
• Flex Logix Delivers High-Performance, High-Density Embedded FPGA for Deep Learning, Data Center and Base Station Chips
• Cadence Announces VirtualBridge Adapter for Palladium Z1 Emulator to Accelerate Software Bring-Up Time by Up to Three Months
• Synopsys Integrates VESA Display Stream Compression into DesignWare MIPI DSI IP to Enable 4K Ultra HD and Higher Resolution Displays
• "Billion Dollar Capex Club" Forecast to Swell to 15 Companies in 2017
• OneSpin Solutions Unveils its Comprehensive Safety Critical Solution for Automotive, Other Mission-Critical Applications

Tuesday, May 30, 2017

• Atomic Rules announces DPDK-aware FPGA/GPP data mover

Tuesday, May 30, 2017

• Synopsys ZeBu Server Emulation System Selected by Konica Minolta

Tuesday, May 30, 2017

• S2C Prodigy Player Pro New Configuration Cockpit Streamlines FPGA Prototyping And Debug Setup

Tuesday, May 30, 2017

• Moortec to exhibit at the 2017 TSMC Europe OIP Ecosystem Forum and Technology Symposium in Amsterdam

Monday, May 29, 2017

• 智能手机之后，车联网将撑起半导体产业一片天
• Cloud Security Alliance details connected vehicle security
• Mentor Automotive 扩展 Automotive Audio Bus 测试平台产品组合下一代系统支持最新款 A2B 收发器
• 一圖看懂 Arm DynamIQ運作原理
• New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board
• Nvidia Pitching AI to ODMs in Taiwan
• Altair Semiconductor Employs Sonics' NoC to Integrate Baseband IC of ALT1250 IoT LTE Chipset
• Driverless car security in a safety-critical world
• 艾睿电子与Libelium签订协议加强物联网方案组合
• Qualcomm推出网状网络平台和参考设计，开启家庭整体连接新时代

Monday, May 29, 2017

• 2017 Automotive IC Market on Pace for Record Year

Monday, May 29, 2017

• Sankalp Semiconductor to Exhibit at DAC 2017

Monday, May 29, 2017

• ARM launches flagship cores in 'DynamIQ' style

Sunday, May 28, 2017

• Synopsys Design and Verification Tools Enable Successful Tape-outs by Early Adopters of New Arm Cortex-A75, Cortex-A55 and Mali-G72 Cores
• GIGABYTE Technology Announces Expansion of their Arm Server Portfolio based on Cavium's ThunderX2 Workload Optimized Processor Family
• Programmable Battery Charger IPs For SoC Applications
• Arm's next Mali GPU tweaks Bifrost
• Arm Cores Target AI-powered Future
• Bosch partners with Sony for automotive HDR cameras

Saturday, May 27, 2017

• Keysight and Spreadtrum tie strategic partnership with Shanghai Innovation Center

Friday, May 26, 2017

• Cadence与台积电携手开发N7制程工艺
• Arm推出基于DynamIQ技术的处理器，从端到云加速人工智能体验
• 车载芯片增速将达22%，但车载MCU与DSP增长均不到两位数

Friday, May 26, 2017

• Kalray Announces the Release of its Third-Generation MPPA Processor "Coolidge"

Friday, May 26, 2017

• UltraSoC attracts fresh investment as technology industry recognizes huge potential for embedded intelligence

Thursday, May 25, 2017

• UltraSoC attracts $6.4m investment to develop embedded intelligence
• 三星计划2020年推出4nm工艺和第二代FD-SOI
• 麦肯锡：实现全自动驾驶可能需10年以上的时间
• Debug IP firm draws investors, raises 5m pounds

Wednesday, May 24, 2017

• Intrinsic ID Announces SPARTAN Authentication Family for IoT Device Security
• Sensory and Arm Processors Enabling AI at the Edge
• Perceptia Joins GlobalFoundries FDXcelerator Program to Bring PLL Technology to Portable Devices
• FD-SOI能否逆天改命，就看中国了？
• Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
• Reports: Arm agrees to create Chinese IP firm
• Intrinsic ID Announces SPARTAN Authentication Family for IoT Device Security
• Sensory and Arm Processors Enabling AI at the Edge

Tuesday, May 23, 2017

• Synopsys Enables the Next Wave of Design Innovation on Samsung's Latest Foundry Processes, 8LPP and 7LPP
• Samsung Set to Lead the Future of Foundry with Comprehensive Process Roadmap Down to 4nm
• New SHA-3 hashing IP from Barco Silex helps customers implement future-proof security
• New Open Virtual Platforms Processor Models for Arm, Imagination Technologies, RISC-V and Renesas Accelerate Software Development
• Israel's Vayyar Imaging Licenses Sonics NoC For Use in 3D Sensor Chips
• Cadence Custom/Analog, Digital and Signoff Tools Achieve Certification on Samsung 28FDS Process Technology
• Cadence Digital, Signoff and Custom/Analog Tools Enabled on Samsung's 7LPP and 8LPP Process Technologies
• Synopsys Custom Compiler Certified by Samsung for 28FDS Process Technology
• Mentor Announces Availability of Tools and Flows for Samsung 8LPP and 7LPP Process Technologies
• Synopsys IC Validator Certified by Samsung for 10LPP Process Technology Physical Signoff
• SST Announces Qualification of Smartbit OTP NVM Technology for ON Semiconductor's 110 nm CMOS Process
• Synopsys Announces Availability of DesignWare IP on Samsung 14LPP and 10LPP Process Technologies
• Rambus talks IoT Device Management at IoT World 2017
• Qualcomm在物联网发展中扮演这样的角色：每天提供超过一百万颗芯片
• 高通、中移动及摩拜单车共同开展中国首个LTE IoT多模外场测试
• 基于Xilinx Zynq的一款人脸识别开发板来了