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Thursday, March 9, 2017

• Arm flags latest CoreSight IP as 'future of debug and trace'
• 为您省钱，虚拟仪表盘、信息娱乐、汽车摄像一颗芯搞掂
• Arm处理器攻下微软Azure服务器 英特尔遭遇双重打击
• 台積公司2017年2月營收報告

Thursday, March 9, 2017

• Leti announces backside shield that protects microchip from physical attacks

Thursday, March 9, 2017

• ARM Servers 'Compelling' for Microsoft

Thursday, March 9, 2017

• UMC Reports Sales for February 2017

Thursday, March 9, 2017

• JEDEC Updates Standards for Low Power Memory Devices

Wednesday, March 8, 2017

• Safety Verification and Optimization of Automotive Ethernet Using Dedicated SoC FIT Rates
• An introduction to Arm Cortex-M0 DesignStart
• 将信息安全进行到底，华大三大产业领域参展慕尼黑电子展
• ReFLEX CES Introduces the 1st Arria 10 SoC System-On-Module, Named
• 惊艳！Imagination揭开全新PowerVR Furian GPU架构的神秘面纱
• ON Semiconductor 授予 Digi-Key 2016 全球高技术服务分销商奖
• InvenSense and GLOBALFOUNDRIES Collaborate on Industry-Leading Ultrasonic Fingerprint Imaging Technology

Wednesday, March 8, 2017

• Achronix Semiconductor Corporation joins the OpenCAPI Consortium

Wednesday, March 8, 2017

• NEC and AIST Develop LSI with NanoBridge Technology Featuring High Radiation Tolerance for use in Space

Tuesday, March 7, 2017

• eMemory's NeoFuse Implemented in HV Process for OLED Application
• Imagination's new PowerVR Furian GPU architecture will deliver captivating and engaging visual and vision experiences
• Arteris Announces PIANO 2.0 Automated Interconnect Timing Closure Technology
• M31 Deploys a Full Range of IP for TSMC 16nm FFC Process
• STMicroelectronics and Prove & Run Provide Scalable Security Platform for IoT Devices
• Synopsys Advances Virtual Prototyping to Enable System and Semiconductor Supply Chain Collaboration for Next-Generation SoCs
• Sidense Exhibiting at TSMC 2017 North American Technology Symposiums
• SoftBank to sell 25% of Arm to Saudi-backed fund
• 力旺电子跨足OLED应用领域 NeoFuse硅智财高压制程全都布
• 円星科技积极布局台积电16纳米FFC制程的IP解决方案
• 巴西的Unitec公司获得Imagination MIPS CPU授权， 用来开发瞄准智慧城市应用的芯片
• Synopsys rolls ASIL-certified processor IP to ADAS designers

Tuesday, March 7, 2017

• Daliworks Inc. joins ARM mbed partnership to expand its Thing+ IoT ecosystem.

Monday, March 6, 2017

• Cadence免费软件开发工具包试用申请
• 首款支持数千兆级调制解调器的通信DSP内核
• 全球芯片销售创六年来最佳 中国销售增速第一
• 中低密度FPGA再演双雄会，"洪荒之力"都往哪儿使？
• 使用超低功耗处理器防止侧信道攻击
• 基于多核Arm的低成本，低功耗影音播放器
• 使用Tensilica IP构建基于汽车以太网的音频流解决方案
• Imagination shows latest technologies for IoT, automotive and security at Embedded World 2017
• Everspin Expands MRAM Ecosystem with Xilinx FPGAs
• Aldec Introduces End-to-end HW/SW Co-verification for Xilinx Zynq SoC FPGAs at Embedded World 2017
• Synopsys Announces Industry's First ASIL D Ready Dual-Core Lockstep Processor IP with Integrated Safety Monitor
• Faraday Monthly Consolidated Sales Report - February 2017
• Record Spending for Fab Equipment Expected in 2017 and 2018

Monday, March 6, 2017

• January Semiconductor Sales Up 14 Percent Compared to Last Year

Monday, March 6, 2017

• Eleven Companies Forecast to Account for 78% of Semi Capex in 2017

Monday, March 6, 2017

• Cypress Closes Sale of Minnesota Wafer Fabrication Facility

Monday, March 6, 2017

• Linaro Announces Fujitsu's Collaboration to Accelerate High Performance Computing on ARM

Monday, March 6, 2017

• Additional unlicensed spectrum needed to deliver future Wi-Fi connectivity

Monday, March 6, 2017

• HXT Semiconductor Joins Linaro to Accelerate Advanced Server Development on ARM

Monday, March 6, 2017

• GUC Monthly Sales Report - February 2017

Sunday, March 5, 2017

• AMPHION releases 2 extended performance variants of its highly successful HEVC/H.265 'Malone' video decoder IP core
• Ultra-low power memory generators silicon proven at TSMC 55 nm uLP and uLP eFlash
• 中芯国际与中科院微电子所共同开发28纳米RRAM技术并取得显著进展
• Globalfoundries成都建厂的三点思考
• Rambus Signs License Agreement with Western Digital
• 将低功耗蓝牙IP整合进SoC中的好处
• Brazil's Unitec licenses MIPS CPU from Imagination Technologies for chip targeting smart cities
• Optimizing compilers for ADAS applications
• Startup Taps TSMC to Attack Broadcom
• Bounce for wearables
• 意法半导体提升STM32生态系统灵活性，推出最新的STM32F722 Nucleo开发板和STM32F723探索套件

Friday, March 3, 2017

• FD-SOI：芯片制造工艺向10nm技术节点发展的最佳选择

Friday, March 3, 2017

• Socionext Develops World's First Graphics Display Controller with OpenVX Compliant Hardware Accelerator

Thursday, March 2, 2017

• Digital Media Professionals Uses Cadence Palladium XP Verification Computing Platform and Hosted Design Solutions to Speed Time to Market

Thursday, March 2, 2017

• High-Performance Computing gets more energy-efficient data transfer

Wednesday, March 1, 2017

• D'Crypt to include Barco Silex IP for public key cryptography in cutting-edge communication chip
• Texas Multicore Technologies Announces Full Support for Arm Processors
• China's Xiaomi Develops First In-House Smartphone Processor in co-operation with Arm
• Daliworks Inc. joins Arm mbed partnership to expand its Thing+ IoT ecosystem

Tuesday, February 28, 2017

• Intel, Spreadtrum Demo Brainchild
• Arm's soft launch for machine learning library
• Chip boosts embedded security for IoT
• NetSpeed Gains ISO 26262 Certification, ASIL-D Ready, for Its Interconnect IP
• Autotalks Turns to Athena for its Truly Secure V2X Solution
• D&R delivers a new version of its Software License Manager with Real-Time License Management and Matlab-specific support
• Imagination 的 PowerVR 图形技术为联发科的新款 Helio X30 芯片组带来显著的性能提升与功耗节
• 安森美推出新型模块化汽车成像平台

Tuesday, February 28, 2017

• Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

Tuesday, February 28, 2017

• Microsemi Announces Open Source Switchtec PCIe Switch Linux Drivers Enabling Rapid, Open Development of High Reliability PCIe Switching Solutions

Monday, February 27, 2017

• TSMC Joins Semiconductor Research Corporation
• Merger Agreement Approved by Shareholders of Lattice Semiconductor
• Masayoshi Son, Softbank Founder Betting on Arm, Preaches Security
• BLE modules simplify IoT design
• CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
• ON Semiconductor Unveils Innovative Modular Automotive Imaging Platform
• Dream Chip Technologies Demonstrates Automotive ADAS SoC using Arteris FlexNoC IP at Mobile World Congress
• Spreadtrum Standardizes on Synopsys ZeBu Server Emulation System for Advanced Mobile SoCs
• Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML
• Aldec unveils Xilinx UltraScale FPGA-based prototyping board enabling Simulation Acceleration and Emulation with the latest release of HES-DVM
• 使用DesignWare逻辑库和嵌入式存储器以获得16FFC SOC最佳PPA

Monday, February 27, 2017

• ZTE Sued for AVC Patent Infringement

Monday, February 27, 2017

• Qualcomm, Samsung, Mediatek Offer Hints on iPhone 8

Monday, February 27, 2017

• Nigel Toon Appointed as Advisor to Moortec Board

Monday, February 27, 2017

• Spreadtrum Launches 14nm 8-core 64-bit Mid- and High-end LTE SoC Platform

Monday, February 27, 2017

• DSR launches its ZBOSS 3.0, LightLink, GreenPower on CSEM RF

Sunday, February 26, 2017

• SecureRF and BaySand Collaborate to Provide Quantum-resistant Security for ASIC-powered IoT Devices
• Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset
• Terminus Circuits and Truechip partner for comprehensive verification of High Speed Serial Protocols, viz.: PCIe Gen4 and USB 3.1
• Avery Design Systems Focuses on Ultra HD Display VIP Portfolio
• Dream Chip shows ADAS processor on FDSOI
• CEVA and ASTRI Unveil Dragonfly NB1, a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT Devices
• Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development
• Cadence Launches Xcelium Parallel Simulator, the Industry's First Production-Proven Parallel Simulator
• Synopsys Announces Expansion of Liberty Modeling Standard, Paving Way for Ultra Low-Power IC Design
• Imagination's PowerVR graphics provide huge performance boost and power savings in MediaTek's new Helio X30 chipset
• Truechip announces first customer shipment of 25G/ 50G Ethernet Comprehensive Verification IP (CVIP)
• Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC