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Monday, April 24, 2017
Barco Silex and Intrinsic ID to Integrate Security Technology
IHS公布2016年全球TOP10半导体厂排名
Arm发布Mali-C71图像信号处理器,推动下一代汽车图像处理
SoC安全性耐力测试
Imagination以前所未有的价格供应SoC嵌入式软件工具
Synopsys Extends Portfolio of ASIL Ready ISO 26262 Certified DesignWare IP
Fraunhofer IIS Joins GLOBALFOUNDRIES FDXcelerator Program to Enable Dynamic Biasing IPs
eASIC and Mobiveil Announce Flash Reliability Platform
Neurala Patents "Whole Brain" Approach to AI, the Basis of the Next Generation of AI
AMD Expands Technology Portfolio to Drive Immersive Computing Vision with Acquisition of Wireless Virtual Reality IP from Nitero
Wave Computing and Sonics to Present on Deep Learning Technology At ML DevCon
IoT Security: What We Need Next
Inside Secure releases latest True Random Number Generator providing continuous protection against security threats in IoT and Datacenters
Mentor announces Nucleus RTOS support for i.MX6UltraLite SoC
发改委:禁止新建燃油汽车项目 新能源车产业将迎大变革
Monday, April 24, 2017
Imagination shatters price barriers to SoC embedded software development
Monday, April 24, 2017
Village Island, in partnership with NHK, simplifies 8K video transport and SDI cabling using TICO technology
Monday, April 24, 2017
GUC Appoints System CTO
Monday, April 24, 2017
Inside Secure Announces First Quarter 2017 Revenue
Sunday, April 23, 2017
Cadence Reports First Quarter 2017 Financial Results
GUC 任命系統首席技術長
The Linux Foundation launches EdgeX Foundry to unify IoT market
Mentor collaborates with Microsoft to accelerate Internet of Things solutions
半导体巨头借重金收购竞逐汽车电子市场
Xilinx Partial Reconfiguration enables dynamic field updates
亚马逊EC2 F1实例已广泛采用 Virtex UltraScale+ FPGA
Rambus Reports First Quarter 2017 Financial Results
Picture perfect: Driving next-generation image processing for automotive
Friday, April 21, 2017
intoPIX Releases New TICO Encoder and Decoder Cores Supporting UHDTV2 and 8K up to 60fps.
Friday, April 21, 2017
Synopsys Enhances ARC Data Fusion Subsystem with New Audio and High-Performance Sensor Support for Always-On IoT Applications
Friday, April 21, 2017
Xilinx Delivers Broad Deployment of Dynamic Reconfiguration Technology
Thursday, April 20, 2017
用在Always-on IoT领域的新型音频和高性能传感器助Synopsys ARC Data Fusion subsystem更加强大
Xilinx广泛部署动态重配置技术
从Arm到三星,苹果是如何走向自研芯片的?
Taiwan Eyes Automotive Market
Thursday, April 20, 2017
Mentor Announces 64-bit ARMv8-A support for the Nucleus Real-Time Operating System
Thursday, April 20, 2017
Mentor Graphics expands formal verification's reach with new cross-platform GUI and apps for sequential logic equivalence checking and CDC gate-level analysis
Thursday, April 20, 2017
Accelize Integrates Amazon EC2 F1 Instance into its QuickPlay/QuickStore Framework
Thursday, April 20, 2017
Princeton finds bugs in RISC-V architecture
Wednesday, April 19, 2017
联发科采用Cadence 7nm工艺实现流
Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process
Wednesday, April 19, 2017
CEVA, Inc. Appoints Ran Soffer as Vice President of Marketing and Corporate Development
Tuesday, April 18, 2017
Faraday Delivers V-by-One HS PHY & Controller IP on UMC 28HPCU Process
IP-Maker to release new NVMe host IP
Arastu Systems Ethernet 10G Digital Switch IP Soft Core for Time-Critical Applications
Apple to cut Imagination royalty to a third, says UBS
NXP Sells Stake in China Foundry ASMC
Samsung Completes Qualification of its 2nd Generation 10nm Process Technology
Xilinx Announces General Availability of Virtex UltraScale+ FPGAs in Amazon EC2 F1 Instances
NXP Sells Stake in China Foundry ASMC
Monday, April 17, 2017
低成本快速定制SoC:智能硬件和IoT初创公司的差异化成功之路
ADAS准备好被"重新定义"了吗?
唯"开放"的自动驾驶平台才能与Mobileye们竞争
DDR4将首度超越DDR3 2017年占整体DRAM58%
三股力量推动定制SoC增长,内核授权亟需轻量级的商业模式
恩智浦首个FD-SOI芯片意味着什么?
內嵌力旺電子NeoEE矽智財之量產晶圓累積出貨突破十萬片
Ncore 2.0缓存一致性互连和Resilience套件助力机器学习SoC设计
Dolphin Integration announces the availability of the new generation 28 nm SpRAM generator
Cadence发布7纳米工艺Virtuoso先进工艺节点扩展平台
CAST Becomes Member of ESD Alliance
Inside Secure partners with ContentArmor to address Hollywood studios' higher security requirements for early-window and UHD movies delivered over-the-top (OTT)
Cambricon Licenses Arteris FlexNoC Interconnect IP for Machine Learning SoCs
Sunday, April 16, 2017
Lynx出品:基于Xilinx Zynq UltraScale+ MPSoC的内核分离技术LynxSecure
Rambus Expands Cryogenic Memory Collaboration with Microsoft
灿芯半导体喜获上海市浦东新区科学技术奖
Friday, April 14, 2017
TSMC Expects First-Half Smartphone Slump
Friday, April 14, 2017
NXP Shows First FD-SOI Chips
Friday, April 14, 2017
PT13: A compact 8-bit microprocessor IP core for just $1000
Friday, April 14, 2017
DDR4 Set to Account for Largest Share of DRAM Market by Architecture
Thursday, April 13, 2017
封裝/PCB重要性與日俱增 Cadence整合性方案全力部署
Cadence发布大规模并行物理签核解决方案Pegasus验证系统
Truechip announces first customer shipment of JESD204B Comprehensive Verification IP (CVIP)
CERN openlab Explores New CPU/FPGA Processing Solutions
Thursday, April 13, 2017
Dialog suffers on report of Apple in-sourcing
Thursday, April 13, 2017
Open-Silicon to Showcase its Spec2Chip IoT SoC Platform Solution Consisting of IoT Edge SoC Platform and IoT Gateway SoC Platform at IoT DevCon Santa Clara on April 26-27, 2017
Thursday, April 13, 2017
Synapse Design Acquires Asilicon to Address Customer Demand and Provide Increased Access to Off-Shore Design Centers
Wednesday, April 12, 2017
TowerJazz and Aisin Seiki Announce Mass Production of New Generation Automotive Body Products
Cadence takes chip verification in cloud to new level
Mouser signs Intel FPGA board firm ReFLEX CES
TSMC Reports First Quarter EPS of NT$3.38
Analog Devices and Renesas Electronics collaborate on automotive radar sensing
RFEL teams with Plextek for adaptive FPGA-based video processing
Gartner Says Worldwide Semiconductor Revenue Forecast to Increase 12.3 Percent in 2017
Toshiba Expands Line-up of Arm Cortex-M-Based Microcontrollers
Silicon Creations Selects Mentor Graphics Software for High-Performance Analog and Mixed-Signal IP Verification
恩智浦携手亚马逊,为智能家居带来更多Alexa体验
华虹宏力与华大九天再联手 国产EDA工具助力IP设计
台积电InFO封装技术升级优化,Cadence到底有啥妙招?
Cryptography in the age of AI and quantum computing
Arm and Intel part of IoT MCU benchmarking group
Wednesday, April 12, 2017
Moortec and UltraSoC collaborate to enable next-generation "smart" PVT sensors
Wednesday, April 12, 2017
ClioSoft, OneSpin and Truechip Sponsor the Ninth Annual I LOVE DAC Campaign at the 54th Design Automation Conference
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