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Monday, April 24, 2017

• Barco Silex and Intrinsic ID to Integrate Security Technology
• IHS公布2016年全球TOP10半导体厂排名
• Arm发布Mali-C71图像信号处理器，推动下一代汽车图像处理
• SoC安全性耐力测试
• Imagination以前所未有的价格供应SoC嵌入式软件工具
• Synopsys Extends Portfolio of ASIL Ready ISO 26262 Certified DesignWare IP
• Fraunhofer IIS Joins GLOBALFOUNDRIES FDXcelerator Program to Enable Dynamic Biasing IPs
• eASIC and Mobiveil Announce Flash Reliability Platform
• Neurala Patents "Whole Brain" Approach to AI, the Basis of the Next Generation of AI
• AMD Expands Technology Portfolio to Drive Immersive Computing Vision with Acquisition of Wireless Virtual Reality IP from Nitero
• Wave Computing and Sonics to Present on Deep Learning Technology At ML DevCon
• IoT Security: What We Need Next
• Inside Secure releases latest True Random Number Generator providing continuous protection against security threats in IoT and Datacenters
• Mentor announces Nucleus RTOS support for i.MX6UltraLite SoC
• 发改委：禁止新建燃油汽车项目 新能源车产业将迎大变革

Monday, April 24, 2017

• Imagination shatters price barriers to SoC embedded software development

Monday, April 24, 2017

• Village Island, in partnership with NHK, simplifies 8K video transport and SDI cabling using TICO technology

Monday, April 24, 2017

• GUC Appoints System CTO

Monday, April 24, 2017

• Inside Secure Announces First Quarter 2017 Revenue

Sunday, April 23, 2017

• Cadence Reports First Quarter 2017 Financial Results
• GUC 任命系統首席技術長
• The Linux Foundation launches EdgeX Foundry to unify IoT market
• Mentor collaborates with Microsoft to accelerate Internet of Things solutions
• 半导体巨头借重金收购竞逐汽车电子市场
• Xilinx Partial Reconfiguration enables dynamic field updates
• 亚马逊EC2 F1实例已广泛采用 Virtex UltraScale+ FPGA
• Rambus Reports First Quarter 2017 Financial Results
• Picture perfect: Driving next-generation image processing for automotive

Friday, April 21, 2017

• intoPIX Releases New TICO Encoder and Decoder Cores Supporting UHDTV2 and 8K up to 60fps.

Friday, April 21, 2017

• Synopsys Enhances ARC Data Fusion Subsystem with New Audio and High-Performance Sensor Support for Always-On IoT Applications

Friday, April 21, 2017

• Xilinx Delivers Broad Deployment of Dynamic Reconfiguration Technology

Thursday, April 20, 2017

• 用在Always-on IoT领域的新型音频和高性能传感器助Synopsys ARC Data Fusion subsystem更加强大
• Xilinx广泛部署动态重配置技术
• 从Arm到三星，苹果是如何走向自研芯片的？
• Taiwan Eyes Automotive Market

Thursday, April 20, 2017

• Mentor Announces 64-bit ARMv8-A support for the Nucleus Real-Time Operating System

Thursday, April 20, 2017

• Mentor Graphics expands formal verification's reach with new cross-platform GUI and apps for sequential logic equivalence checking and CDC gate-level analysis

Thursday, April 20, 2017

• Accelize Integrates Amazon EC2 F1 Instance into its QuickPlay/QuickStore Framework

Thursday, April 20, 2017

• Princeton finds bugs in RISC-V architecture

Wednesday, April 19, 2017

• 联发科采用Cadence 7nm工艺实现流
• Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process

Wednesday, April 19, 2017

• CEVA, Inc. Appoints Ran Soffer as Vice President of Marketing and Corporate Development

Tuesday, April 18, 2017

• Faraday Delivers V-by-One HS PHY & Controller IP on UMC 28HPCU Process
• IP-Maker to release new NVMe host IP
• Arastu Systems Ethernet 10G Digital Switch IP Soft Core for Time-Critical Applications
• Apple to cut Imagination royalty to a third, says UBS
• NXP Sells Stake in China Foundry ASMC
• Samsung Completes Qualification of its 2nd Generation 10nm Process Technology
• Xilinx Announces General Availability of Virtex UltraScale+ FPGAs in Amazon EC2 F1 Instances
• NXP Sells Stake in China Foundry ASMC

Monday, April 17, 2017

• 低成本快速定制SoC：智能硬件和IoT初创公司的差异化成功之路
• ADAS准备好被"重新定义"了吗？
• 唯"开放"的自动驾驶平台才能与Mobileye们竞争
• DDR4将首度超越DDR3　2017年占整体DRAM58%
• 三股力量推动定制SoC增长，内核授权亟需轻量级的商业模式
• 恩智浦首个FD-SOI芯片意味着什么？
• 內嵌力旺電子NeoEE矽智財之量產晶圓累積出貨突破十萬片
• Ncore 2.0缓存一致性互连和Resilience套件助力机器学习SoC设计
• Dolphin Integration announces the availability of the new generation 28 nm SpRAM generator
• Cadence发布7纳米工艺Virtuoso先进工艺节点扩展平台
• CAST Becomes Member of ESD Alliance
• Inside Secure partners with ContentArmor to address Hollywood studios' higher security requirements for early-window and UHD movies delivered over-the-top (OTT)
• Cambricon Licenses Arteris FlexNoC Interconnect IP for Machine Learning SoCs

Sunday, April 16, 2017

• Lynx出品：基于Xilinx Zynq UltraScale+ MPSoC的内核分离技术LynxSecure
• Rambus Expands Cryogenic Memory Collaboration with Microsoft
• 灿芯半导体喜获上海市浦东新区科学技术奖

Friday, April 14, 2017

• TSMC Expects First-Half Smartphone Slump

Friday, April 14, 2017

• NXP Shows First FD-SOI Chips

Friday, April 14, 2017

• PT13: A compact 8-bit microprocessor IP core for just $1000

Friday, April 14, 2017

• DDR4 Set to Account for Largest Share of DRAM Market by Architecture

Thursday, April 13, 2017

• 封裝/PCB重要性與日俱增 Cadence整合性方案全力部署
• Cadence发布大规模并行物理签核解决方案Pegasus验证系统
• Truechip announces first customer shipment of JESD204B Comprehensive Verification IP (CVIP)
• CERN openlab Explores New CPU/FPGA Processing Solutions

Thursday, April 13, 2017

• Dialog suffers on report of Apple in-sourcing

Thursday, April 13, 2017

• Open-Silicon to Showcase its Spec2Chip IoT SoC Platform Solution Consisting of IoT Edge SoC Platform and IoT Gateway SoC Platform at IoT DevCon Santa Clara on April 26-27, 2017

Thursday, April 13, 2017

• Synapse Design Acquires Asilicon to Address Customer Demand and Provide Increased Access to Off-Shore Design Centers

Wednesday, April 12, 2017

• TowerJazz and Aisin Seiki Announce Mass Production of New Generation Automotive Body Products
• Cadence takes chip verification in cloud to new level
• Mouser signs Intel FPGA board firm ReFLEX CES
• TSMC Reports First Quarter EPS of NT$3.38
• Analog Devices and Renesas Electronics collaborate on automotive radar sensing
• RFEL teams with Plextek for adaptive FPGA-based video processing
• Gartner Says Worldwide Semiconductor Revenue Forecast to Increase 12.3 Percent in 2017
• Toshiba Expands Line-up of Arm Cortex-M-Based Microcontrollers
• Silicon Creations Selects Mentor Graphics Software for High-Performance Analog and Mixed-Signal IP Verification
• 恩智浦携手亚马逊，为智能家居带来更多Alexa体验
• 华虹宏力与华大九天再联手 国产EDA工具助力IP设计
• 台积电InFO封装技术升级优化，Cadence到底有啥妙招？
• Cryptography in the age of AI and quantum computing
• Arm and Intel part of IoT MCU benchmarking group

Wednesday, April 12, 2017

• Moortec and UltraSoC collaborate to enable next-generation "smart" PVT sensors

Wednesday, April 12, 2017

• ClioSoft, OneSpin and Truechip Sponsor the Ninth Annual I LOVE DAC Campaign at the 54th Design Automation Conference