Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Thursday, February 9, 2017
TSMC January 2017 Revenue Report
Ford Invests in Argo AI, a New Artificial Intelligence Company, in Drive for Autonomous Vehicle Leadership
Thursday, February 9, 2017
Data Center Calls for 800GE Spec
Thursday, February 9, 2017
IC Market Growth Limited by Narrow Window of Global GDP Expansion
Thursday, February 9, 2017
UMC Reports Sales for January 2017
Wednesday, February 8, 2017
G'foundries Revamps China Deal
Faraday Monthly Consolidated Sales Report - January 2017
GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand
Thread Group Takes Leap Forward with Availability of First Certified Software Stacks from Arm, NXP, OpenThread and Silicon Labs; Launches Product Certification Program
力旺电子NeoFuse硅智财率先于台积公司16奈米FFC制程完成可靠度验证
HOPU-Arm Innovation Fund officially launched
SATO deploys Acuitas Digital IoT platform for Thomas Pink
Wednesday, February 8, 2017
CAST Releases Fastest 8051 IP Core
Wednesday, February 8, 2017
CAST Introduces Platform IP and JumpStart Evaluation Program for ARM Cortex-M0 Processor
Wednesday, February 8, 2017
Full-Hardware Real-Time H.265 HEVC Video Decoder Core Coming from CAST
Tuesday, February 7, 2017
MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones
Intel to Spend $7 Billion on Arizona Fab
iPhone Share Drops in China for First Time
Crestron Moves to Intel FPGAs to Improve Video Quality, Connections
TSMC, Samsung Diverge at 7nm
eMemory Qualified NeoFuse in TSMC 16FFC Process
MediaTek Launches New Helio SoC
Tuesday, February 7, 2017
Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
Tuesday, February 7, 2017
TSMC Calls for New EDA Paradigm
Monday, February 6, 2017
Micron, Hynix Reportedly Seek Stake in Toshiba
Intel Shows 2.5D FPGA at ISSCC
Crestron Leverages intoPIX Ultra-Low Latency JPEG 2000 Technology in New DigitalMedia NVX Series
Valens and Lattice Semiconductor Partner to Deliver HDBaseT Reference Design to Support 4K 60Hz 4:4:4 Resolutions
Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14 ASIC Platform using 14nm LPP Process Technology
Significant IP-core Announcements for Omnitek
SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor
Arteris FlexNoC Interconnect IP is Licensed by Nextchip for Automotive Advanced Driver Assistance Systems (ADAS)
ICU tech GmbH Selects VectorCAST to Shorten IEC 62304 Compliance
PCI Express 4.0通路裕量和其优点
Monday, February 6, 2017
AI Attracts Embedded Chip Veteran
Monday, February 6, 2017
IntoPIX and Icron co-host at ISE Conferences 2017
Monday, February 6, 2017
AI Tapped to Improve Design
Monday, February 6, 2017
StarChip's Secure IC for Bank Cards Enabled by SST's SuperFlash Technology
Sunday, February 5, 2017
Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
Object-Detection Becomes Wearable
Aquantia and AptoVision Unveil First Software-Defined Video over Ethernet (SDVoE) Solution for Pro-AV Market utilizing Aquantia's FPGA Programmable PHY
GUC Monthly Sales Report - January 2017
Flex Logix Qualifies Serial I/O IP From CAST And SOC Solutions For EFLX Embedded FPGA
R-Stratus-LP silicon IP reduces significantly power consumption of flash memories
Saturday, February 4, 2017
Swatch Group and CSEM are developing a Swiss made ecosystem for connected objects
Friday, February 3, 2017
Global Semiconductor Sales Reach $339 Billion in 2016
Friday, February 3, 2017
UMC to Start 14nm Shipments in Q1
Thursday, February 2, 2017
Virtual Reality Market To Grow When Hardware & Content Cost Less
Thursday, February 2, 2017
Aldec delivers DO-254 Compliant Templates and Checklists with the latest release of Spec-TRACER
Wednesday, February 1, 2017
Apple to add Arm processor to Mac computers
Panasonic and UMC Partner for 40nm ReRAM Process Platform
Rambus Selects Synopsys' ARC EM Processors for Embedded Security Platform
GUC Unveils Solid State Drive ASIC Capabilities
GUC 推出固態硬碟 ASIC解決方案 整體解決方案涵蓋TSMC 28 奈米front-end設計至封裝技術
Tuesday, January 31, 2017
Comment: Five steps to enabling a data-driven, smart factory
Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results
Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach
CEVA, Inc. Announces Fourth Quarter and Year End 2016 Financial Results
Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016
WiLAN Subsidiary Enters into Agreement with Microsemi
Barco Silex demonstrates Viper OEM solution for real-time 4K Video networking at ISE 2017
Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology
Monday, January 30, 2017
Nokia IoT solution targets smart cities
Slow India may lose Cricket wafer fab
2017 embedded processor report: At the edge of Moore's Law and IoT
IoT Secure Systems Summit expands speaker lineup
Nokia Applies IMPACT to IoT Fragmentation
IoT Contest Shows Security Gaps
Industrial IoT Nets Blossom
Xilinx Displays Pro AV Solutions with Any-to-Any Connectivity at ISE 2017
Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform
Monday, January 30, 2017
Persistent Memory Platform Support Will Take Time
Sunday, January 29, 2017
Rambus Reports Fourth Quarter and Fiscal Year 2016 Financial Results
Bosch joins MIPI Alliance as new member
Aquantia Announces the Industrys First FPGA-Programmable Multi-Gigabit Ethernet PHY Device
Synopsys Extends Verification FastForward Program, Enabling Cadence Incisive and Mentor Graphics Questa Users to Adopt VCS Simulation with Fine-Grained Parallelism Technology
Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
25 Gigabit Ethernet Consortium Members Validate Multi-Vendor Interoperability
Credo Demonstrates 112G PAM4 SR, 56G PAM4 LR, and 56G NRZ SerDes Technology at DesignCon
Previous
|
Next
Did you miss last D&R News Alerts ?