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Thursday, February 9, 2017

• TSMC January 2017 Revenue Report
• Ford Invests in Argo AI, a New Artificial Intelligence Company, in Drive for Autonomous Vehicle Leadership

Thursday, February 9, 2017

• Data Center Calls for 800GE Spec

Thursday, February 9, 2017

• IC Market Growth Limited by Narrow Window of Global GDP Expansion

Thursday, February 9, 2017

• UMC Reports Sales for January 2017

Wednesday, February 8, 2017

• G'foundries Revamps China Deal
• Faraday Monthly Consolidated Sales Report - January 2017
• GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand
• Thread Group Takes Leap Forward with Availability of First Certified Software Stacks from Arm, NXP, OpenThread and Silicon Labs; Launches Product Certification Program
• 力旺电子NeoFuse硅智财率先于台积公司16奈米FFC制程完成可靠度验证
• HOPU-Arm Innovation Fund officially launched
• SATO deploys Acuitas Digital IoT platform for Thomas Pink

Wednesday, February 8, 2017

• CAST Releases Fastest 8051 IP Core

Wednesday, February 8, 2017

• CAST Introduces Platform IP and JumpStart Evaluation Program for ARM Cortex-M0 Processor

Wednesday, February 8, 2017

• Full-Hardware Real-Time H.265 HEVC Video Decoder Core Coming from CAST

Tuesday, February 7, 2017

• MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones
• Intel to Spend $7 Billion on Arizona Fab
• iPhone Share Drops in China for First Time
• Crestron Moves to Intel FPGAs to Improve Video Quality, Connections
• TSMC, Samsung Diverge at 7nm
• eMemory Qualified NeoFuse in TSMC 16FFC Process
• MediaTek Launches New Helio SoC

Tuesday, February 7, 2017

• Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack

Tuesday, February 7, 2017

• TSMC Calls for New EDA Paradigm

Monday, February 6, 2017

• Micron, Hynix Reportedly Seek Stake in Toshiba
• Intel Shows 2.5D FPGA at ISSCC
• Crestron Leverages intoPIX Ultra-Low Latency JPEG 2000 Technology in New DigitalMedia NVX Series
• Valens and Lattice Semiconductor Partner to Deliver HDBaseT Reference Design to Support 4K 60Hz 4:4:4 Resolutions
• Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14 ASIC Platform using 14nm LPP Process Technology
• Significant IP-core Announcements for Omnitek
• SonicsGN Provides Integration Fabric for Nexell NXP5540 Application Processor
• Arteris FlexNoC Interconnect IP is Licensed by Nextchip for Automotive Advanced Driver Assistance Systems (ADAS)
• ICU tech GmbH Selects VectorCAST to Shorten IEC 62304 Compliance
• PCI Express 4.0通路裕量和其优点

Monday, February 6, 2017

• AI Attracts Embedded Chip Veteran

Monday, February 6, 2017

• IntoPIX and Icron co-host at ISE Conferences 2017

Monday, February 6, 2017

• AI Tapped to Improve Design

Monday, February 6, 2017

• StarChip's Secure IC for Bank Cards Enabled by SST's SuperFlash Technology

Sunday, February 5, 2017

• Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP
• Object-Detection Becomes Wearable
• Aquantia and AptoVision Unveil First Software-Defined Video over Ethernet (SDVoE) Solution for Pro-AV Market utilizing Aquantia's FPGA Programmable PHY
• GUC Monthly Sales Report - January 2017
• Flex Logix Qualifies Serial I/O IP From CAST And SOC Solutions For EFLX Embedded FPGA
• R-Stratus-LP silicon IP reduces significantly power consumption of flash memories

Saturday, February 4, 2017

• Swatch Group and CSEM are developing a Swiss made ecosystem for connected objects

Friday, February 3, 2017

• Global Semiconductor Sales Reach $339 Billion in 2016

Friday, February 3, 2017

• UMC to Start 14nm Shipments in Q1

Thursday, February 2, 2017

• Virtual Reality Market To Grow When Hardware & Content Cost Less

Thursday, February 2, 2017

• Aldec delivers DO-254 Compliant Templates and Checklists with the latest release of Spec-TRACER

Wednesday, February 1, 2017

• Apple to add Arm processor to Mac computers
• Panasonic and UMC Partner for 40nm ReRAM Process Platform
• Rambus Selects Synopsys' ARC EM Processors for Embedded Security Platform
• GUC Unveils Solid State Drive ASIC Capabilities
• GUC 推出固態硬碟 ASIC解決方案 整體解決方案涵蓋TSMC 28 奈米front-end設計至封裝技術

Tuesday, January 31, 2017

• Comment: Five steps to enabling a data-driven, smart factory
• Cadence Reports Fourth Quarter and Fiscal Year 2016 Financial Results
• Telit adds Wi-Fi and low-power solutions for IoT with acquisition of GainSpan to extend end-to-end IoT solutions reach
• CEVA, Inc. Announces Fourth Quarter and Year End 2016 Financial Results
• Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016
• WiLAN Subsidiary Enters into Agreement with Microsemi
• Barco Silex demonstrates Viper OEM solution for real-time 4K Video networking at ISE 2017
• Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology

Monday, January 30, 2017

• Nokia IoT solution targets smart cities
• Slow India may lose Cricket wafer fab
• 2017 embedded processor report: At the edge of Moore's Law and IoT
• IoT Secure Systems Summit expands speaker lineup
• Nokia Applies IMPACT to IoT Fragmentation
• IoT Contest Shows Security Gaps
• Industrial IoT Nets Blossom
• Xilinx Displays Pro AV Solutions with Any-to-Any Connectivity at ISE 2017
• Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform

Monday, January 30, 2017

• Persistent Memory Platform Support Will Take Time

Sunday, January 29, 2017

• Rambus Reports Fourth Quarter and Fiscal Year 2016 Financial Results
• Bosch joins MIPI Alliance as new member
• Aquantia Announces the Industrys First FPGA-Programmable Multi-Gigabit Ethernet PHY Device
• Synopsys Extends Verification FastForward Program, Enabling Cadence Incisive and Mentor Graphics Questa Users to Adopt VCS Simulation with Fine-Grained Parallelism Technology
• Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
• 25 Gigabit Ethernet Consortium Members Validate Multi-Vendor Interoperability
• Credo Demonstrates 112G PAM4 SR, 56G PAM4 LR, and 56G NRZ SerDes Technology at DesignCon