Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
System on Chip design resources
Catalog of SIP Cores
System on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Monday, March 27, 2017
How to make analog smart - does building a custom SoC have to be hard?
Synopsys接连斩获半导体行业权威大奖
意法半导体携手DSP Concepts为STM32开发者提供进阶音讯设计工具
Matrix Voice :一个内嵌FPGA硬件加速器的低价语音识别平台
理解汽车DDR DRAM
Synopsys' IC Validator Used for Physical Sign-Off on More Than 100 FinFET Production Tapeouts
Data Center Duel Deux -- Intel and Xilinx Take More Turf
ISRAEL'S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC
Intel Unveils 10, 22nm Processes
Patent Trolls Plague Chip Vendors
Open Connectivity Foundation and Singapore Semiconductor Industry Association Announce Collaboration Framework in Singapore
Monday, March 27, 2017
SMIC 2016 Annual Results Announcement
Monday, March 27, 2017
Aura Semiconductor Announces Partnership with Mindtree to Deliver Advanced Wireless Personal Area Network (WPAN) Solutions for IoT Devices
Monday, March 27, 2017
EEMBC Benchmark Reveals True Energy Cost of Using Bluetooth LE for the Internet of Things
Monday, March 27, 2017
ESD Alliance Reports EDA Industry Sees Highest Quarterly Revenue Increase in Five Years
Monday, March 27, 2017
PLDA Announces Multiple Corporate-Wide Licenses for their XpressSWITCH PCIe 4.0 Switch IP
Monday, March 27, 2017
RC Module Licenses OmniPHY's Gigabit Ethernet Technology
Sunday, March 26, 2017
Cadence获封最受认可称号
STMicroelectronics Making Everything Smarter at IoT Asia 2017
汽车电子推动SSD接口朝PCI-e方向升级
ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform
Synopsys' RSoft Photonic Component Design Suite Version 2017.03 Accelerates Optoelectronic Device Analysis
Arm launches embedded Linux education kit
EDA Sales Jump Most in Five Years
Study: China increases lead in electromobility, Europe lags
Friday, March 24, 2017
Roadmap Says CMOS Ends ~2024
Thursday, March 23, 2017
恩智浦携手Auto-ISAC共同应对互联汽车的安全挑战
BitSim's IP, Bit-MIPI CSI-2 used in Flir's new generation of thermal cameras, the Exx-series
Moortec to exhibit at the 2017 TSMC China Technology Symposium in Shanghai
NXP holds pole position in automotive semiconductor ranking
Thursday, March 23, 2017
Mythic Launches AI Platform and Announces $9M Funding Round to Enable Datacenter-Scale Local AI in the Smallest Form Factor on Any Device
Wednesday, March 22, 2017
GlobalSign Joins Arm mbed IoT Device Platform Partnership Program
Wednesday, March 22, 2017
Cadence Achieves Certification for TSMC's 7nm Process Technology
Wednesday, March 22, 2017
Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up
Tuesday, March 21, 2017
Samsung and eSilicon Taped Out 14nm Network Processor with Rambus 28G SerDes Solution
Arrow launches FPGA-based IoT maker board
Ubuntu Core ported to NXP quad-core Arm Cortex-A53 SoC
Arteris FlexNoC Interconnect IP is Licensed by Samsung for its Foundry Customers
High-performance, high-bandwidth IP platform for Samsung 14LPP process technology
Samsung Edges TSMC in 10 nm
Renesas Accelerates IoT Design Using the Cadence Perspec System Verifier
Renesas benefits from Japan's edge in electromobility
Cadence获得TSMC 7nm工艺技术认证
从端到端,英特尔让汽车和工厂拥有聪明的
Democratizing IoT design with open source development boards and communities
Tuesday, March 21, 2017
New embedded chip from Socionext features PowerVR Series8XE GPU from Imagination
Tuesday, March 21, 2017
MIPS, execution culture and getting into AI
Tuesday, March 21, 2017
Village Island releases world-wide the VICO-4, the "4K over single 3G-SDI" appliance empowered by TICO
Tuesday, March 21, 2017
BrainChip Advances its Position as a Leading Artificial Intelligence Provider with an Exclusive License for Next-Generation Neural Network Technology
Tuesday, March 21, 2017
Synopsys' New High-Performance Secure Module with Cryptography Acceleration Speeds Security Functions by 100x
Monday, March 20, 2017
The Role and Benefits of FPGA Prototyping in the ASIC Design Cycle
Arm to boost processor performance by 50x with new AI instructions
Arm DynamIQ: Expanding the possibilities for artificial intelligence
苹果宣布在苏州、上海再建研发中心
China's Gamble on Industrial IoT
为物联网SoC整合低功耗蓝牙IP技术
The Functional Safety Imperative in Automotive Design
含有密码加速功能的Synopsys高性能新安全模块使安全功能加速了100倍
PTV Group and IPG Automotive Offer New Interface for Virtual Test Driving
Can FPGAs Beat GPUs in Accelerating Next-Generation Deep Learning?
Space Codesign to Announce SpaceStudio V3 to Facilitate Functional Verification and Validation of Embedded Systems
Inside Secure delivers Application Protection to defend against malicious attacks on Android Java devices
Synopsys Announces Availability of Comprehensive Low Power Reference Kit for Design and Verification
ST's SPAD Imager Likely Linked to iPhone 8
Apple hires group of UK GPU engineers
Arm announces multicore processor architecture targeting automated driving
Synopsys' RSoft System Tools Advance Simulation of Optical Communications for Automotive, Ethernet and PIC Applications
Cadence与TSMC合作12FFC工艺技术,驱动IC设计创新
Cadence(Tensilica)的可定制处理器
Arm推出全新DynamIQ技术,为人工智能开启无限可能
Monday, March 20, 2017
Peregrine Semiconductor, A Murata Company, Acquires Arctic Sand Technologies
Sunday, March 19, 2017
Xilinx一系列"业界第一"解决方案亮相OFC 2017 进一步扩展其高速数据中心互联产品
Fraunhofer to open Dublin Lab-on-Chip center
Is ADAS Ready for a Little 'Disruption?'
Friday, March 17, 2017
SEMI Reports 2016 Global Semiconductor Equipment Sales of $41.2 Billion
Friday, March 17, 2017
North American Semiconductor Equipment Industry Posts February 2017 Billings
Friday, March 17, 2017
U.S. Companies Still Hold Largest Share of Fabless Company IC Sales
Friday, March 17, 2017
Appeals Court Reverses Dismissal of Patents in Oregon Proceeding
Thursday, March 16, 2017
TSMC Tips 7+, 12, 22nm Nodes
Thursday, March 16, 2017
Moortec to exhibit at the 2017 TSMC Technology Workshop in Austin
Thursday, March 16, 2017
Comcores announces commercial availability of a complete Radio-Over-Ethernet and L1 offload solution for fronthaul enabling easy bring up of Ethernet based connectivity in radio systems
Thursday, March 16, 2017
ICE-G3 EPU Adds Cluster Controller to Save More Energy For Complex Chip Power Architectures
Wednesday, March 15, 2017
Kanazawa Uni and Hitachi develop aging sensor for autonomous vehicles
Industry's first dual-port CSI-2 quad deserializer hub, Enabling faster and more flexible ADAS applications
Arm 推出 CoreSight SoC-600,实现下一代调试和跟踪
Why Arm wants to do more
China Fab Boom Fuels Equipment Spending Revival
New Arm Physical IP customized for advanced automotive systems
reVISION simplifies FPGA-based vision system development
Previous
|
Next
Did you miss last D&R News Alerts ?