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Monday, March 27, 2017

• How to make analog smart - does building a custom SoC have to be hard?
• Synopsys接连斩获半导体行业权威大奖
• 意法半导体携手DSP Concepts为STM32开发者提供进阶音讯设计工具
• Matrix Voice ：一个内嵌FPGA硬件加速器的低价语音识别平台
• 理解汽车DDR DRAM
• Synopsys' IC Validator Used for Physical Sign-Off on More Than 100 FinFET Production Tapeouts
• Data Center Duel Deux -- Intel and Xilinx Take More Turf
• ISRAEL'S BAR-ILAN UNIVERSITY PRODUCES COMPLEX SOC USING SonicsGN NoC AS INTEGRATION FABRIC
• Intel Unveils 10, 22nm Processes
• Patent Trolls Plague Chip Vendors
• Open Connectivity Foundation and Singapore Semiconductor Industry Association Announce Collaboration Framework in Singapore

Monday, March 27, 2017

• SMIC 2016 Annual Results Announcement

Monday, March 27, 2017

• Aura Semiconductor Announces Partnership with Mindtree to Deliver Advanced Wireless Personal Area Network (WPAN) Solutions for IoT Devices

Monday, March 27, 2017

• EEMBC Benchmark Reveals True Energy Cost of Using Bluetooth LE for the Internet of Things

Monday, March 27, 2017

• ESD Alliance Reports EDA Industry Sees Highest Quarterly Revenue Increase in Five Years

Monday, March 27, 2017

• PLDA Announces Multiple Corporate-Wide Licenses for their XpressSWITCH PCIe 4.0 Switch IP

Monday, March 27, 2017

• RC Module Licenses OmniPHY's Gigabit Ethernet Technology

Sunday, March 26, 2017

• Cadence获封最受认可称号
• STMicroelectronics Making Everything Smarter at IoT Asia 2017
• 汽车电子推动SSD接口朝PCI-e方向升级
• ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform
• Synopsys' RSoft Photonic Component Design Suite Version 2017.03 Accelerates Optoelectronic Device Analysis
• Arm launches embedded Linux education kit
• EDA Sales Jump Most in Five Years
• Study: China increases lead in electromobility, Europe lags

Friday, March 24, 2017

• Roadmap Says CMOS Ends ~2024

Thursday, March 23, 2017

• 恩智浦携手Auto-ISAC共同应对互联汽车的安全挑战
• BitSim's IP, Bit-MIPI CSI-2 used in Flir's new generation of thermal cameras, the Exx-series
• Moortec to exhibit at the 2017 TSMC China Technology Symposium in Shanghai
• NXP holds pole position in automotive semiconductor ranking

Thursday, March 23, 2017

• Mythic Launches AI Platform and Announces $9M Funding Round to Enable Datacenter-Scale Local AI in the Smallest Form Factor on Any Device

Wednesday, March 22, 2017

• GlobalSign Joins Arm mbed IoT Device Platform Partnership Program

Wednesday, March 22, 2017

• Cadence Achieves Certification for TSMC's 7nm Process Technology

Wednesday, March 22, 2017

• Samsung Electronics on Track for 10nm FinFET Process Technology Production Ramp-up

Tuesday, March 21, 2017

• Samsung and eSilicon Taped Out 14nm Network Processor with Rambus 28G SerDes Solution
• Arrow launches FPGA-based IoT maker board
• Ubuntu Core ported to NXP quad-core Arm Cortex-A53 SoC
• Arteris FlexNoC Interconnect IP is Licensed by Samsung for its Foundry Customers
• High-performance, high-bandwidth IP platform for Samsung 14LPP process technology
• Samsung Edges TSMC in 10 nm
• Renesas Accelerates IoT Design Using the Cadence Perspec System Verifier
• Renesas benefits from Japan's edge in electromobility
• Cadence获得TSMC 7nm工艺技术认证
• 从端到端，英特尔让汽车和工厂拥有聪明的
• Democratizing IoT design with open source development boards and communities

Tuesday, March 21, 2017

• New embedded chip from Socionext features PowerVR Series8XE GPU from Imagination

Tuesday, March 21, 2017

• MIPS, execution culture and getting into AI

Tuesday, March 21, 2017

• Village Island releases world-wide the VICO-4, the "4K over single 3G-SDI" appliance empowered by TICO

Tuesday, March 21, 2017

• BrainChip Advances its Position as a Leading Artificial Intelligence Provider with an Exclusive License for Next-Generation Neural Network Technology

Tuesday, March 21, 2017

• Synopsys' New High-Performance Secure Module with Cryptography Acceleration Speeds Security Functions by 100x

Monday, March 20, 2017

• The Role and Benefits of FPGA Prototyping in the ASIC Design Cycle
• Arm to boost processor performance by 50x with new AI instructions
• Arm DynamIQ: Expanding the possibilities for artificial intelligence
• 苹果宣布在苏州、上海再建研发中心
• China's Gamble on Industrial IoT
• 为物联网SoC整合低功耗蓝牙IP技术
• The Functional Safety Imperative in Automotive Design
• 含有密码加速功能的Synopsys高性能新安全模块使安全功能加速了100倍
• PTV Group and IPG Automotive Offer New Interface for Virtual Test Driving
• Can FPGAs Beat GPUs in Accelerating Next-Generation Deep Learning?
• Space Codesign to Announce SpaceStudio V3 to Facilitate Functional Verification and Validation of Embedded Systems
• Inside Secure delivers Application Protection to defend against malicious attacks on Android Java devices
• Synopsys Announces Availability of Comprehensive Low Power Reference Kit for Design and Verification
• ST's SPAD Imager Likely Linked to iPhone 8
• Apple hires group of UK GPU engineers
• Arm announces multicore processor architecture targeting automated driving
• Synopsys' RSoft System Tools Advance Simulation of Optical Communications for Automotive, Ethernet and PIC Applications
• Cadence与TSMC合作12FFC工艺技术，驱动IC设计创新
• Cadence（Tensilica）的可定制处理器
• Arm推出全新DynamIQ技术，为人工智能开启无限可能

Monday, March 20, 2017

• Peregrine Semiconductor, A Murata Company, Acquires Arctic Sand Technologies

Sunday, March 19, 2017

• Xilinx一系列"业界第一"解决方案亮相OFC 2017 进一步扩展其高速数据中心互联产品
• Fraunhofer to open Dublin Lab-on-Chip center
• Is ADAS Ready for a Little 'Disruption?'

Friday, March 17, 2017

• SEMI Reports 2016 Global Semiconductor Equipment Sales of $41.2 Billion

Friday, March 17, 2017

• North American Semiconductor Equipment Industry Posts February 2017 Billings

Friday, March 17, 2017

• U.S. Companies Still Hold Largest Share of Fabless Company IC Sales

Friday, March 17, 2017

• Appeals Court Reverses Dismissal of Patents in Oregon Proceeding

Thursday, March 16, 2017

• TSMC Tips 7+, 12, 22nm Nodes

Thursday, March 16, 2017

• Moortec to exhibit at the 2017 TSMC Technology Workshop in Austin

Thursday, March 16, 2017

• Comcores announces commercial availability of a complete Radio-Over-Ethernet and L1 offload solution for fronthaul enabling easy bring up of Ethernet based connectivity in radio systems

Thursday, March 16, 2017

• ICE-G3 EPU Adds Cluster Controller to Save More Energy For Complex Chip Power Architectures

Wednesday, March 15, 2017

• Kanazawa Uni and Hitachi develop aging sensor for autonomous vehicles
• Industry's first dual-port CSI-2 quad deserializer hub, Enabling faster and more flexible ADAS applications
• Arm 推出 CoreSight SoC-600，实现下一代调试和跟踪
• Why Arm wants to do more
• China Fab Boom Fuels Equipment Spending Revival
• New Arm Physical IP customized for advanced automotive systems
• reVISION simplifies FPGA-based vision system development