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Thursday, January 26, 2017

• Toshiba Confirms Memory Chip Selloff

Thursday, January 26, 2017

• Mn_nH release 360 degree image stitching IP for VR camera SoC.

Thursday, January 26, 2017

• Xilinx Announces Third Quarter 2017 Results

Wednesday, January 25, 2017

• Starblaze Achieves First-Pass Silicon Success for Storage SoC with Synopsys ARC Processor and Interface IP
• Memory compressor IP can save time, energy

Wednesday, January 25, 2017

• Spin Transfer Technologies Samples Fully Functional ST-MRAM Devices

Tuesday, January 24, 2017

• Patent Suits Hit Q'comm Profits
• Ex-Elpida CEO's China Fab Plan Dropped?
• Is Semiconductor M&A Wave Dissipating?
• Cypress Offers Enhanced Security, Reliability and Performance for Automotive, Industrial and IoT Applications with New FL-L NOR Flash Memories
• Peregrine Semiconductor Introduces Next-Generation Technology Platform with Industry's Best RonCoff Performance
• Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX Process by SoC Designers
• Synopsys' ARC SEM Security Processors Win Linley Group's 2016 Analysts' Choice Award for Best Processor IP

Monday, January 23, 2017

• Nordic Semiconductor nRF52 Series-based Bluetooth low energy and NFC module offers ultra-compact wireless solution for smart cards and wearables
• ZTE Wireless Institute Achieves Performance Breakthrough for Deep Learning with Intel FPGAs
• UMC's 28nm Ramp to Slip This Year
• Cadence Virtuoso ADE Product Suite Named Product of the Year by Electronic Products Magazine

Monday, January 23, 2017

• Qualcomm Feels Smartphone Squeeze

Monday, January 23, 2017

• TI Reorgs Analog Group

Sunday, January 22, 2017

• Silicon Labs Acquires Wi-Fi Innovator Zentri
• Silicon Labs Expands IoT Portfolio
• From Hardware Emulation to High-Frequency Trading Riding the FPGA Wave
• X-Fab is Fastest Growing Foundry
• Concept Engineering's RTLVision Debugger and Viewer to Power Real Intent's Verification Solutions
• Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.2 Percent in 2017
• Dolphin Integration Receives Open-Silicon's Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem
• Flex Logix Works With DARPA To Develop Flex Logix's Embedded FPGA IP For Government Projects

Friday, January 20, 2017

• Aldec provides Finite State Machine Coverage for verification of safety-critical FPGAs

Friday, January 20, 2017

• Neurala Announces $14 Million Series A to Bring Deep Learning Neural Network AI Software to Drones, Self-Driving Cars, Toys and Cameras

Friday, January 20, 2017

• Market for Power Semiconductors in Automotive to Rev Up by $3 Billion by 2022, IHS Markit Says

Thursday, January 19, 2017

• Advantech is Microsoft Global Internet of Things (IoT) Valued Partner
• Tsinghua to Build $30 Billion Memory Fab in China

Thursday, January 19, 2017

• ARM Holdings plc Reports Results for the First Quarter Ended 31 March 2010

Thursday, January 19, 2017

• Blue Pearl Software Appoints John Molyneux President After Record Year

Thursday, January 19, 2017

• NRAM's Day Is Finally Here: Report

Thursday, January 19, 2017

• WiLAN Provides Litigation Update

Wednesday, January 18, 2017

• SMIC Reaffirms Fourth Quarter 2016 Guidance
• 2015-2016 Deals Dominate Semiconductor M&A Ranking
• Synopsys Releases New Version of Coverity Static Analysis Tool with Enhanced Security for Mobile and Web Applications
• 智原科技：全球第一家获颁ISO 26262证书的ASIC设计服务厂商
• Global semiconductor revenue topped $339.7 billion in 2016
• Future of Chip Research Group Questioned
• Faraday: World's First ISO 26262 Certified ASIC Service Company
• VIA launches Custom IoT Platform Design Service

Tuesday, January 17, 2017

• WiLAN Provides Litigation Update
• Gartner Says Worldwide Semiconductor Revenue Grew 1.5 Percent in 2016
• Nordic-powered Bluetooth low energy sensors provide wireless solution for detecting water leaks and monitoring changes in temperature and humidity
• Automotive safety hypervisor announced for Arm Cortex-R52
• MIPI Alliance Introduces MIPI Discovery and Configuration (DisCo) Base Architecture and Class Specifications
• New Video Compressor and Camera Processor Cores Expand CAST's IP Line
• Design and Reuse adds advanced IP Customer Reporting Features to its IP intranet Management Provider Station (IPMS) and delivers a next generation Audit Support Engine
• Automotive Ethernet for ADAS

Tuesday, January 17, 2017

• NVM Express, Inc. Elects Facebook and Toshiba to Board

Monday, January 16, 2017

• Tech body welcomes May's Brexit plan
• Toshiba Mulls Chip Business Spinoff
• Dialog Semiconductor Plc.: Dialog Semiconductor Powers Next-Generation Connected Cars
• Mantaro Introduces an Advanced Development Platform for the Altera Arria 10 SoC
• Arteris announces 9 new licensees, multiple interconnect IP product releases and profitable operation in 2016
• Imagination's new PowerVR GPUs deliver leading performance in lowest area for mid-range markets
• Beyond Semiconductor partners with Rubicon Labs to deliver full stack solution for cryptographically secure execution processor
• Three Tips to Maximize your SoC performance

Monday, January 16, 2017

• ATopTech, Inc. Initiates Voluntary Chapter 11 Bankruptcy Protection Proceeding

Monday, January 16, 2017

• No Sign of 450mm on the Horizon

Sunday, January 15, 2017

• Hardware agnostic IoT solution takes customization to the next level
• Nordic Bluetooth low energy-powered scalable design platform for wearables supports AirFuel-compliant wireless charging
• Scalable ECU platform to accomplish level 3 autonomous driving
• Turning cars into mobile devices: MIPI
• Hundreds of Xilinx Space Grade FPGAs Deployed in Launch of Iridium NEXT Satellites
• Socionext Accelerates Test Generation and Lowers Test Cost Using Synopsys TetraMAX II
• Rambus Signs Patent License Agreement with Winbond
• Sidense Receives Coveted ISO 9001:2015 Quality Management System Certification
• Moortec Announce Embedded Temperature Sensor on TSMC 16FF+ & FFC