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Thursday, June 20, 2024

• Andes Technology Showcases Leadership in AI and Automotive Applications at RISC-V Summit Europe 2024
• Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
• Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions

Wednesday, June 19, 2024

• Breker Verification Systems Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
• PQShield raises $37m in Series B funding to deliver the widespread commercial adoption of quantum resistant cryptography
• System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
• Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform
• lowRISC and Microsoft Collaborate to Help Bring the Revolutionary CHERIoT-Ibex Core to Production Grade
• Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
• Dovetail Electric Aviation adopts Siemens Xcelerator to pioneer sustainable aviation

Wednesday, June 19, 2024

• Movellus Introduces Aeonic Powerâ„¢ Product Family for On-Die Voltage Regulation

Tuesday, June 18, 2024

• OPENEDGES to Premiere PHY Vision 2.0 at Design Automation Conference 2024
• Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation
• Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024
• M31 Announces the Launch of Advanced LPDDR Memory IP to Support HPC Applications
• YorChip announces Low Latency 200G Chiplet for edge AI
• Alphawave Reveals Multiprotocol I/O Chiplet Tapeout, Collabs with Arm, Samsung
• Global partnership unveils quantum-safe hardware root-of-trust for cellular IoT
• Why do defects occur in battery production? Explainable AI supports process optimization.
• EU proposes budget cuts to tech programmes in 2025
• Rapidus Set to Open 2-nm Pilot Fab, CEO Says
• Intel 3 '3nm-class' process technology is in high-volume production
• Slide Shows Samsung May be Developing a RISC-V CPU for In-memory AI Chip
• onsemi selects Czech Republic for SiC production for advanced power semiconductors

Monday, June 17, 2024

• Sequans Announces a New $15 Million Licensing Agreement
• Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024
• QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs
• Intel 3 Represents an Intel Foundry Milestone
• Samsung Foundry Struggles with Yield and Power Efficiency Issues
• Are We Prepared for Cyberthreats in The New Era of Transportation?

Sunday, June 16, 2024

• EU is mandating Digital Product Passports
• Initial members join CHERI Alliance to drive adoption of memory safety and scalable software compartmentalization
• Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency

Friday, June 14, 2024

• Codasip Claims 'Best-in-Class' RISC-V Core for Power-Conscious Designs
• Japan to send 200 engineers to U.S. for AI chip training at Tenstorrent

Wednesday, June 12, 2024

• Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process
• ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024
• Sondrel secures major funding today
• Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
• Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
• Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin
• Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
• Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any CPU Architecture
• Axiomise Heads to RISC-V Summit Europe June 25-27 in Munich
• Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications

Tuesday, June 11, 2024

• SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform
• Rambus Unveils PCIe 7.0 IP Portfolio for High-Performance Data Center and AI SoCs
• Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024
• SureCore Balances Power and Cooling Costs With Cryogenic Memory
• Silvaco Announces Initiatives to Enhance Workforce Development in Semiconductor Industry
• SEMIFIVE Collaborates with OPENEDGES on Chiplet Development

Monday, June 10, 2024

• Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions
• Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes
• Siemens and KU Leuven collaborate to research Digital Twin for Smart and Sustainable Products

Monday, June 10, 2024

• HCLTech and Arm Collaborate on Custom Silicon Chips Optimized for AI Workloads

Sunday, June 9, 2024

• OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology
• Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
• intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency
• Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs with Industry's First PCIe 7.0 IP Solution
• eXpreso eFPGA Compiler Achieves 98.6% Packing Density
• Global Semiconductor Sales Increase 15.8% Year-to-Year in April; New Industry Forecast Projects Market Growth of 16.0% in 2024
• Sondrel offers leading edge chip design teams