Search News

Monday, February 27, 2017

• TSMC Joins Semiconductor Research Corporation
• Merger Agreement Approved by Shareholders of Lattice Semiconductor
• Masayoshi Son, Softbank Founder Betting on Arm, Preaches Security
• BLE modules simplify IoT design
• CEVA's Bluetooth 5 Low Energy IP Powers ON Semiconductor's Ultra-Low-Power Radio SoC for IoT and Connected Health and Wellness Devices
• ON Semiconductor Unveils Innovative Modular Automotive Imaging Platform
• Dream Chip Technologies Demonstrates Automotive ADAS SoC using Arteris FlexNoC IP at Mobile World Congress
• Spreadtrum Standardizes on Synopsys ZeBu Server Emulation System for Advanced Mobile SoCs
• Cadence Delivers Foundry-Enabled In-Design and Signoff Lithography Simulation Integration with ASML
• Aldec unveils Xilinx UltraScale FPGA-based prototyping board enabling Simulation Acceleration and Emulation with the latest release of HES-DVM
• 使用DesignWare逻辑库和嵌入式存储器以获得16FFC SOC最佳PPA

Monday, February 27, 2017

• ZTE Sued for AVC Patent Infringement

Monday, February 27, 2017

• Qualcomm, Samsung, Mediatek Offer Hints on iPhone 8

Monday, February 27, 2017

• Nigel Toon Appointed as Advisor to Moortec Board

Monday, February 27, 2017

• Spreadtrum Launches 14nm 8-core 64-bit Mid- and High-end LTE SoC Platform

Monday, February 27, 2017

• DSR launches its ZBOSS 3.0, LightLink, GreenPower on CSEM RF

Sunday, February 26, 2017

• SecureRF and BaySand Collaborate to Provide Quantum-resistant Security for ASIC-powered IoT Devices
• Waves Audio Announces Its First Chip To Bring Virtual Reality Audio Capabilities To Any Headphone and Headset
• Terminus Circuits and Truechip partner for comprehensive verification of High Speed Serial Protocols, viz.: PCIe Gen4 and USB 3.1
• Avery Design Systems Focuses on Ultra HD Display VIP Portfolio
• Dream Chip shows ADAS processor on FDSOI
• CEVA and ASTRI Unveil Dragonfly NB1, a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT Devices
• Cadence Launches Protium S1 FPGA-Based Prototyping Platform for Early Software Development
• Cadence Launches Xcelium Parallel Simulator, the Industry's First Production-Proven Parallel Simulator
• Synopsys Announces Expansion of Liberty Modeling Standard, Paving Way for Ultra Low-Power IC Design
• Imagination's PowerVR graphics provide huge performance boost and power savings in MediaTek's new Helio X30 chipset
• Truechip announces first customer shipment of 25G/ 50G Ethernet Comprehensive Verification IP (CVIP)
• Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC

Friday, February 24, 2017

• CommSolid and Rohde & Schwarz Collaborate on NarrowBand IoT and its Evolution

Thursday, February 23, 2017

• CommSolid Unveils Market's First Integration-Ready NarrowBand-IoT Modem IP Solution
• NXP Joins Auto-ISAC to Collaborate on Security Challenges of Connected Cars

Wednesday, February 22, 2017

• Sequans Integrates Think Silicon GPU Technology in New LTE for IoT System-on-Chip
• Alango Voice Communication and Voice Enhancement Packages Now Available for Cadence Tensilica HiFi DSP
• Waves Nx VR Audio Technology Now Available for Cadence Tensilica HiFi Audio DSPs
• Cobham Gaisler LEON3FT Processor Technology Launch Aboard Iridium NEXT
• EU Privacy Rules Can Cloud Your IoT Future
• Neowine selects Barco Silex public key cryptography IP as most efficient hardware block
• Taiwan leads in fab capacity
• UMC Enters Mass Production for 14nm Customer ICs
• CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

Wednesday, February 22, 2017

• Faraday's High Margin Products Delivered Positive Results, IP Revenues Reached a 9-Year High of NT$830 Million in 2016

Tuesday, February 21, 2017

• NXP Launches Multi-Standard Programmable Family of System on Chip Solutions
• Silab Tech wins the "SME of the Year" Award at the Small Enterprise Business Awards 2016.
• Blu Wireless Technology secures backing from Arm
• ip.access to Develop Next Generation IoT Small Cells on the Path to 5G in Collaboration with Intel
• zigbee evolution continues with wireless IoT security updates
• Sengled Element LED Bulbs Connect to the IoT with Silicon Labs Zigbee Technology
• Able Device and EMnify Launch SIMbae™ Key Exchange Manager to Provide Enhanced IoT Security for Enterprises
• Faraday's High Margin Products Delivered Positive Results, IP Revenues Reached a 9-Year High of NT$830 Million in 2016
• Oski Technology Launches Formal Verification IP Portfolio for Arm AMBA Interface Protocols
• Flexlogic: Power and Performance Optimization for Embedded FPGA's

Monday, February 20, 2017

• Cadence Collaborates with CommSolid to Address the Cellular IoT Market with New NB-IoT Baseband IP
• Synopsys IC Compiler II Sets the Bar in Quality-of-Results
• First Scalable Wi-Fi HaLow MAC from Methods2Business Built with Cadence Tensilica DSP
• Goke Licenses SonicsGN and MemMax Products for STB SoC Platform
• Look Sharp: The IoT is Watching
• Cyberon and Andes Collaborate on Voice Interface Solutions for IoT Devices
• GLOBALFOUNDRIES Announces Availability of 45nm RF SOI to Advance 5G Mobile Communications
• Waves Audio and CEVA Partner for Far-Field Voice Pick Up and Psychoacoustic Sound Enhancement Solutions targeting Mobile, Smart Home and Wireless Audio Markets
• Xilinx Unveils Disruptive Integration and Architectural Breakthrough for 5G Wireless with RF-Class Analog Technology
• Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions
• Anyka Microelectronics Selects Allegro DVT's Multi-format Video Encoder IP

Sunday, February 19, 2017

• Inside Secure announces strong 2016 results following completion of strategic transformation
• Intel Continues to Drive Semiconductor Industry R&D Spending
• Save time during the evaluation of silicon IPs thanks to MyDolphin

Thursday, February 16, 2017

• Microsemi Collaborates with Silicon Creations to Enable Industry's Lowest Power FPGA 12.7G Transceivers With PHYs for Microsemi's PolarFire FPGAs

Wednesday, February 15, 2017

• Globalfoundries to build FDSOI fab in China
• A Roadmap to Emulation of 15 Billion Gate ICs
• Mentor Graphics Announces Veloce Strato Platform Scales Up to 15BG
• Truechip Partners with SoAR Solution Inc. to Market Verification IP Products in Korea
• Nvidia, and AMD Increase GPU Attach Rates While Total GPU Shipments Remain Flat Quarter to Quarter
• Trillium raises Series A for driverless car security
• Renesas Electronics Becomes First Semiconductor Supplier to Join Civil Infrastructure Platform Project to Accelerate Smart Industrial Devices
• Ex-Leadcore Team Crafts SoC for Xiaomi