Search News

Thursday, January 12, 2017

• Pure-Play Foundry Market Surges 11% in 2016 to Reach $50 Billion!
• TSMC Expects Flat Year for Foundry
• Trilinear Technologies Adds Display Stream Compression (DSC) Encode and Decode Solutions to IP Portfolio

Thursday, January 12, 2017

• IFI CLAIMS Announces Top Recipients of U.S. Patents in 2016

Wednesday, January 11, 2017

• 从Xtensa可配置处理器架构出发 了解可配置处理器开发原理
• Cadence宣布推出业界首款蓝牙5验证IP
• TSMC Reports Fourth Quarter EPS of NT$3.86
• BaySand enhanced MetalCopy Program to Support 14nm FPGA Transition to ASIC
• Crossbar ReRAM in production at SMIC
• Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 2.9 Percent in 2017
• 9 Hottest Embedded Electronics Trends in 2016
• Mentor Graphics Expands Comprehensive ISO 26262 Qualification Program
• China Expected to Poach More Taiwan Chip Execs
• Google Searches for Better Silicon

Tuesday, January 10, 2017

• AltaSens Adopts Cadence Modus Test Solution for Mixed-Signal Image Sensor Designs
• China Company Receives Working First Silicon for SingMai's Analogue Video Decoder

Monday, January 9, 2017

• Arasan Announces Total IP Solution for MIPI I3C Standard
• Mediatek Licenses Sonics' NoC and Memory Scheduler IP
• Synopsys Extends Software Integrity Platform with Acquisition of Forcheck
• Sequans Extends Collaboration with TSMC to Develop World's first LTE-M chip for IoT
• OmniPHY Joins TSMC IP Alliance Program
• TSMC December 2016 Revenue Report
• Securing chips for the IoT

Monday, January 9, 2017

• MIPI Alliance Releases MIPI I3C Sensor Interface Specification

Monday, January 9, 2017

• Creonic Announces FMC Board with L-Band RF Input for Satellite Applications

Sunday, January 8, 2017

• Arm trusted cores get Lauterbach debug support
• UMC Reports Sales for December 2016
• CEVA Announces Record Revenues for the Fourth Quarter
• Cadence Announces Availability of Industry-First Bluetooth 5 Verification IP

Friday, January 6, 2017

• Bosch Dev Kit to Ease IoT
• Arm Exec Dizzy for Open-Source Twizy

Thursday, January 5, 2017

• Process Makes Smaller, Cheaper Chips
• Faraday Monthly Consolidated Sales Report - December 2016
• Open Source Reaches Processor Core

Thursday, January 5, 2017

• Imagination appoints industry expert to lead PowerVR business unit

Thursday, January 5, 2017

• VESA Rolls Out Early Certification Program for Video Source and Display Products Using HBR3 High-Bandwidth Link Rate

Thursday, January 5, 2017

• Wi-Fi CERTIFIED TimeSync brings precise synchronization to Wi-Fi devices

Thursday, January 5, 2017

• Waves Nx Now Available on ARM-Based Platforms

Wednesday, January 4, 2017

• AMD Describes Vega GPU
• GUC Monthly Sales Report - December 2016
• Imagination collaborates with Socionext on advanced video and display technologies
• Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP
• Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor
• Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices
• MIPS I6500 CPU sub-system with NetSpeed's Gemini IP provides highly efficient processing for vision applications
• DeepGlint Harness the Power of CEVA-XM4 Imaging and Vision Platform for Intelligent Video Analytic and ADAS Solutions
• Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer
• Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack

Tuesday, January 3, 2017

• AndesCore Ultra Low-Power, High Performance N705 CPU Core Wins Design Socket In Sino Wealth Electronic's New Bluetooth Low Energy Chip Design
• Intel Tips Plans for 5G Modem
• Apple joins SoftBank's Vision Fund with $1 billion investment
• Cadence and Dolby Collaborate to Enable the World's First TVs Featuring Dolby Atmos Technology
• HDMI Forum Announces Version 2.1 of the HDMI Specification
• ZigBee Alliance Offers Universal Language for IoT
• ON Semiconductor License CEVA Imaging and Vision Platform for Automotive ADAS
• Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
• CSEM announces Bluetooth 5-ready silicon RF IP
• SingMai's aCVi decoder successfully tapes out in China
• Socionext Develops New Large Scale, High Efficiency Distributed Processing Server, Fully Utilizing Multi-Core Processors

Tuesday, January 3, 2017

• Fraunhofer Announces MPEG-H Trademark to Identify Interoperable Products

Tuesday, January 3, 2017

• ARM Adds DSR Corporation ZBOSS ZigBee 3.0 Stack to Its Cordio Radio IP

Tuesday, January 3, 2017

• Genesys Logic Announces USB3.1 Gen 2 Hub Controller with Multiple Upstream Port Support and USB-C Integrated

Tuesday, January 3, 2017

• Shenzhen Micro & Nano Institute License CEVA Audio/Voice DSP for 8 Microphone Far-Field Voice Pickup Applications

Tuesday, January 3, 2017

• Trilinear Technologies Advances Industry Leading DisplayPort Transmitter and Receiver Link Controllers

Tuesday, January 3, 2017

• Wi-Fi Expands with .11ax at CES

Monday, January 2, 2017

• IoT design needs system focus
• Global Semiconductor Sales Up 7 Percent Year-to-Year
• Rambus to Demonstrate IoT Security Technology in Qualcomm Booth at CES