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Friday, May 19, 2017

• Moortec to exhibit at DAC 2017 in Austin

Friday, May 19, 2017

• First Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels

Thursday, May 18, 2017

• 拓墣产业研究院：2017年Q1全球前十大IC设计公司营收排名
• 从技术到应用对比LoRa、NB-IoT，企业如何正确打开物联网大门？

Thursday, May 18, 2017

• Qualcomm Takes on the World, in Court

Thursday, May 18, 2017

• ASIX Adopts Synopsys' USB Type-C Subsystem Verification Solution

Thursday, May 18, 2017

• Acacia Communications Reduces Simulation Regression Turnaround Time by 2X Using Synopsys VCS Fine-Grained Parallelism Technology for High-Speed Optical Interconnect SoCs

Wednesday, May 17, 2017

• Intel's Flash Gambit Evolving Into 3-Pronged Strategy
• Sondrel agrees to buy Imagination SoC design group
• Cadence and MathWorks Announce New Integration to Accelerate Data Mining and Analytics
• Xilinx和IBM采用最新PCI Express标准， 率先将加速云计算的互联性能提升一倍
• 蓝牙5.0抢占物联网风口
• STMicroelectronics in Chinese collaboration on electric vehicle battery management

Wednesday, May 17, 2017

• Alma Technologies Introduces an Online Tool for Comparison of Image Compression Standards

Tuesday, May 16, 2017

• Rambus, PLDA and Avery Design Announce Comprehensive PCIe 4.0 Solution
• NVIDIA Corp.'s Relationship With TSMC Is Deepening
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2017
• Xilinx Announces Integration of 56G PAM4 Transceiver Technology into its Virtex UltraScale+ FPGAs

Tuesday, May 16, 2017

• eMemory Taps into IoT Markets with its Game-Changing Security IP

Tuesday, May 16, 2017

• C-SKY Microsystems selects Dolphin Integration's energy management offering for smart voice-interacted devices

Monday, May 15, 2017

• 智原科技推出UrLib+™附加单元库于联电40LP工艺
• 意法半导体(ST)、中国科学院微电子所(IMECAS)和中科芯时代(EPOCH)合作开发电动汽车
• 赛灵思FPGA人工智能领域技术及应用问答
• Arm and CSNE from the University of Washington partner to develop brain-implantable chips
• 杭州中天微系统选择法国海豚科技为智能语音交互设备提供功耗管理方案
• Novatek Reduces TV Boot Time with Data Decompression IP Core from CAST
• 东芝半导体竞购案只是个缩影，全球资本已盯上日本优质科技资产
• Cadence Expands JasperGold Platform for Advanced Formal-Based RTL Signoff
• Foundry ecosystem extends from ASIC design to testing and fabrication
• Samsung Spinoff Likely to Grab Foundry Share
• Faraday Introduces UrLib+ Add-on Library on UMC 40LP Process
• Mocana Raises $11 Million in New Funding to Revolutionize IoT Security and Enable IoT Devices to Defend Themselves Against Cyber Attacks
• Rambus to Demonstrate CryptoManager IoT Device Management with STMicroelectronics
• Delphi joins autonomous driving project of BMW, Intel and Mobileye
• Cypress' NOR Flash into Bosch's next-gen ADAS
• Xilinx and IBM First to Double Interconnect Performance for Accelerated Cloud Computing with New PCI Express Standard

Monday, May 15, 2017

• Magnachip starts mass production of AMOLED Smart Phone Driver with TITC Compression IP

Monday, May 15, 2017

• Microsoft Outlines Hardware Architecture for Deep Learning on Intel FPGAs

Monday, May 15, 2017

• Dolphin Integration offers a live webinar on how to get an SoC power consumption under 0.5 uA in sleep mode

Monday, May 15, 2017

• Xilinx Debuts Industry-First P4_16 to FPGA Compilation and Introduces New P4-NetFPGA Workflow for Networking Researchers at P4 Industry Events

Monday, May 15, 2017

• Sondrel Agrees to Acquire IMG Works Division of Imagination Technologies

Sunday, May 14, 2017

• Rambus Launches Turnkey Secure Connectivity with CryptoManager IoT Device Management
• 力旺最新安全IP為客戶創造強大競爭優勢 強攻物聯網市場
• South Korean to create world's largest test-bed for autonomous driving
• China to invest heavily into European and US tech startups, reports Bloomberg
• 安森美半导体在2017 IoT World重点展示多样化的关键技术
• Rambus Tips IoT Security Service

Thursday, May 11, 2017

• 车用半导体标准将出炉，车企们准备好了吗？
• Imagination发布首款PowerVR Series8XT IP内核

Thursday, May 11, 2017

• ST opts for phase-change memory on 28nm FDSOI

Wednesday, May 10, 2017

• Toyota Selects Nvidia, Intel Feels Heat
• Xilinx Spartan-7 FPGA 进入量产，开放订购
• 神经网络处理器将提升雷达、视觉应用的性能
• 可配置混合信号IC和异步状态机优化嵌入式设计

Tuesday, May 9, 2017

• SMIC Transitions CEO Responsibility to Dr. Haijun Zhao While Dr. Tzu-Yin Chiu Stays as Vice Chairman and Non-Executive Director
• SMIC Reports 2017 First Quarter Results
• TSMC April 2017 Revenue Report
• NXP Introduces RAIN RFID Solutions with Higher Security for Emerging Inventory Management and Smart City Applications
• Algo-Logic Systems Launches Third Generation FPGA Accelerated CME Tick-To-Trade System
• Synopsys Announces PowerReplay Solution for Early and Fast Gate-Level Power Analysis with PrimeTime PX
• Rambus Joins Microsemi's SoC Partner Program
• Imagination announces first PowerVR Series8XT IP core based on new Furian GPU architecture
• Cloud service takes IP to the foundry
• X-Fab, Exagan make GaN-on-Si on 200mm wafers
• Racyics Launches "makeChip" Design Service Platform for GLOBALFOUNDRIES' 22FDX Technology
• 验证时代已来 Cadence开启SoC设计仿真验证新纪元
• Cadence发业界首款独立完整神经网络DSP核
• Nordic Semiconductor的nRF52832 SoC為虛擬實境體感控制器帶來先進的運動追蹤功能

Tuesday, May 9, 2017

• VESA Forms Special Interest Group Focused on Emergent Virtual and Augmented Reality Markets

Monday, May 8, 2017

• Infineon Rides Automotive Wave into Top-10 Semi Supplier Ranking
• 市值超英特尔，主攻7纳米的台积电正站起来反击三星
• 海豚集成邀您参加网络研讨会，与您探讨如何使睡眠模式下的SoC功耗低于0.5
• UL、MIPI联盟为物联网安全做了这些事
• 意法半导体新推出高连接性的STM32L4 物联网探索套件(B-L475E-IOT01A)
• 针对汽车大屏幕人机界面的最新maXTouch触摸屏控制器
• Xilinx Spartan-7 FPGAs Now in Production
• UMC Reports Sales for April 2017
• Flex Logix Raises $5 Million In Series B Funding
• 物联网领域研究的切入点--物联网平台
• AI and cognitive cloud computing to drive autonomous vehicles
• Enea Adds Support for Xilinx Zynq UltraScale+ MPSoC Devices
• Sonics And Northwest Logic Partner On High Throughput Memory Subsytem Solutions
• Logic Fruit and Accelize Announce Strategic Partnership to deliver Next Gen IP cores
• Andes, First Mainstream CPU IP Provider to Adopt RISC-V, Expands Product Line with New 64bit Processor IP
• Bosch rounds up components for automated driving

Monday, May 8, 2017

• Credo Unveils Robust Portfolio of 56G and 112G PAM-4 PHY Connectivity Solutions

Monday, May 8, 2017

• SiFive Secures $8.5 Million Series B Funding to Advance RISC-V Based Semiconductors

Monday, May 8, 2017

• Moortec to exhibit at ChipEx 2017 in Israel

Sunday, May 7, 2017

• 中芯、台积电的好日子将到头？看日本"迷你"晶圆厂如何改变市场格局
• InfoSec Global和Synopsys携手交付完整的硬件/软件可信根解决方案
• Synopsys和jNet ThingX针对Synopsys的ARC SEM处理器优化了JavaCard操作系统
• 英飞凌（Infineon）推出面向Xilinx Zynq UltraScale+ MPSoC的电源参考设计
• MIPI addresses security concerns of IoT chip interfaces
• Automotive Growth Pushes Infineon Into Top 10