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Thursday, December 29, 2016

• ASolid Adopts AndesCore N9 for its AS2726 eMMC Controller to Deliver Competitive Market Advantage

Thursday, December 29, 2016

• Korea Fines Qualcomm Nearly $1B

Wednesday, December 28, 2016

• 重庆高新区雅特力发布首款自主研发集成电路芯片

Wednesday, December 28, 2016

• IPrium releases 40G I.3 Encoder/Decoder for DWDM systems

Wednesday, December 28, 2016

• TSMC Says 10nm on Track, Countering Reports

Friday, December 23, 2016

• Total Memory Market Forecast to Increase 10% in 2017

Friday, December 23, 2016

• Arastu System's LPDDR3 Controller Core for Extended Battery Life

Friday, December 23, 2016

• Synopsys Obtains Injunction in Copyright Suit Against ATopTech

Thursday, December 22, 2016

• ESD Alliance Reports EDA Industry Revenue Increase for Q3 2016

Thursday, December 22, 2016

• First VESA Display Stream Compression (DSC) Decoder IP Announced by Hardent

Wednesday, December 21, 2016

• TDK to Acquire InvenSense

Wednesday, December 21, 2016

• CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES

Wednesday, December 21, 2016

• Chips Execs See Maturing Industry

Wednesday, December 21, 2016

• FotoNation and VeriSilicon Collaborate on Next Generation, Advanced Computer Vision and Computational Imaging Platform (IPU2.0)

Wednesday, December 21, 2016

• HDL Design House Selected as ARM Approved Design Partner

Monday, December 19, 2016

• HDL Design House Selected as Arm Approved Design Partner

Monday, December 19, 2016

• Celeno and NGCodec demonstrate sub-frame latency 5GHz Wi-Fi Wireless Virtual Reality Solutions

Monday, December 19, 2016

• Cypress Commences Volume Shipments of MCUs Based on eCT Embedded Flash Memory Manufactured at UMC

Monday, December 19, 2016

• Inside Secure appoints Catherine Blanchet to its Supervisory Board

Sunday, December 18, 2016

• CEVA-X1 DSP Core Targets Cellular IoT Opportunities