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Thursday, December 15, 2016

• Arm extends HPC offering with acquisition of software tools provider Allinea Software
• Imagination's PowerVR GPU is first to pass OpenVX 1.1 conformance with Khronos

Thursday, December 15, 2016

• Hardent to Demo Visually Lossless 4K Display Stream Compression at CES 2017

Wednesday, December 14, 2016

• 智原55纳米eFlash方案推动MCU ASIC技术演进
• China Dominates Planned Chip Fabs
• GUC Opens New Netherlands Office
• PLDA Group Spins Off its QuickPlay FPGA Accelerator Activities into the Newly Formed Accelize
• Microsemi Adds IP for Resolver Sensors to FPGA-Based Multi-Axis Motor Control Solution Targeting Aerospace and Defense, Automotive and Industrial Applications
• Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution
• Imagination's Ensigma wireless communications IP now Wi-Fi CERTIFIED on chip that powers Creator Ci40 board
• GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX Solutions
• Silicon-proven HBM Gen2 Hardened PHY from eSilicon
• Mechatronics aids in embedded system design
• Faraday Readies MCU ASIC Migration Path with 55nm eFlash

Tuesday, December 13, 2016

• European tech M&A deals double in 2016
• Chip Market Brightens in 2017
• Samsung Reportedly Mulls Foundry Spinoff
• IoT design kit is ZigBee certified for the home
• Himax, emza and CEVA Partner to Create Ultra-Low Power, Always-On Vision Sensor for IoT
• 62 new fabs coming on-line in 2017-20

Tuesday, December 13, 2016

• Alizem Releases its New DC Motor Control Embedded Software IP for Intel MAX 10 FPGAs

Monday, December 12, 2016

• Lurking Behind Every M&A Is China
• Qualcomm Falters at Top Of Fabless Ranking
• WiLAN Subsidiary Acquires Patent Portfolio from GLOBALFOUNDRIES
• Rambus Renews License Agreement with Thales
• How to Protect Connected Home Devices and Appliances from Cyber Attacks
• Smart Home Reference Designs from Silicon Labs Accelerate Development of IoT Connected Devices
• NXP and Google Advance IoT Development on New Android Things Platform
• GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology
• SRT Group License CEVA Signal Processing IP
• Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC
• 最小化电源域漏电功耗以及设计余量进而缩短上市时间

Monday, December 12, 2016

• Lawmakers Urge Rejection of Lattice Semi Takeover

Monday, December 12, 2016

• CEVA Appoints Maria Marced, President of TSMC Europe, to Board of Directors

Sunday, December 11, 2016

• Robotics of things - the next big thing in embedded
• Lattice gives iCE40 more power, I/O and memory
• TSMC Plans New Fab for 3nm
• Moortec Announce Embedded Voltage Monitor on TSMC 16FF+ and FFC Processes

Thursday, December 8, 2016

• UMC Reports Sales for November 2016
• TSMC November 2016 Revenue Report

Wednesday, December 7, 2016

• Nantero Secures More Than $21M in Additional Funding
• Arasan Chip Sytems Announces Xilinx Alliance Program Membership
• Arm Offers Support For TSMC 7nm Manufacturing
• Synopsys Announces Industry's First DisplayPort 1.4 with DSC 1.2 Verification IP and Test Suites
• What Siemens' Mentor Buy Means to IC Designers
• ACE Awards: AMD Wins Company of Year
• CEVA creates new value by enhancing IoT and machine learning applications
• UNH-IOL Shines Spotlight on Internet of Things Interoperability
• Alliance between prpl Foundation and IoTSF puts 'security by design' at the heart of embedded computing
• Nexell's release of new AP supporting 4K 60fps with Chips&Media' HEVC/H.265 and VP9
• Smartlogic PCI Express DMA IP Cores now available for Intel FPGAs

Tuesday, December 6, 2016

• Comcores demonstrates Radio-Over-Ethernet and L1 offload solution live at ITU FG IMT-2020 Workshop and Demo Day: Wireline Technology Enablers for 5G
• Xilinx FPGAs to be Deployed in New Amazon EC2 F1 Instances - Accelerating Genomics, Financial Analytics, Video Processing, Big Data, Security, and Machine Learning Inference
• ams releases 0.30 um process for ultra-low noise sensing and analog ICs
• Synopsys Takes Hierarchical Timing Signoff Mainstream
• Qualcomm Begins Commercial Sampling of World's First 10nm Server Processor and Reshapes the Future of Datacenter Computing
• HiSilicon Divison of Huawei licenses UltraSoC's SoC monitoring and analytics solutions
• CEVA Leads the Bluetooth 5 IP Wave

Tuesday, December 6, 2016

• BaySand, Codasip, Codeplay and UltraSoC accelerate IoT development with "silicon-to-intelligence" RISC-V platform

Monday, December 5, 2016

• Cadence推出Tensilica Fusion G3 DSP
• Five Suppliers Hold 41% of Global Semiconductor Marketshare in 2016
• Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
• Securing legacy embedded systems in the IoT
• Bluetooth 5 ready SoC from Nordic redefines scope for smart home, IoT, and wearables by delivering 4x range, 2x bandwidth, and enhanced security with on-chip Arm CryptoCell cryptographic accelerator
• STMicroelectronics releases multi-sensor module for IoT and wearable designs
• TSMC, IBM Detail 7-nm Work

Monday, December 5, 2016

• GUC Monthly Sales Report - November 2016

Monday, December 5, 2016

• Is Mobileye-Intel New 'Wintel' of Auto?

Sunday, December 4, 2016

• Global Semiconductor Sales Increase 5 Percent Year-over-Year in October; Industry Forecast Revised Upward
• D32PRO, a 32-bit CPU from DCD named the Product of the Future by Polish Agency for Enterprise Development

Saturday, December 3, 2016

• Vanguard International Completed Qualifying Attopsemi's OTP in several CMOS nodes