Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Login
Catalog of SIP Cores
System on Chip design resources
Catalog of SIP Cores
System on Chip design resources
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
Design Platform and Service
Processor
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
eFPGA / FPGA
Business
Monday, January 30, 2017
Nokia IoT solution targets smart cities
Slow India may lose Cricket wafer fab
2017 embedded processor report: At the edge of Moore's Law and IoT
IoT Secure Systems Summit expands speaker lineup
Nokia Applies IMPACT to IoT Fragmentation
IoT Contest Shows Security Gaps
Industrial IoT Nets Blossom
Xilinx Displays Pro AV Solutions with Any-to-Any Connectivity at ISE 2017
Cavium Deploys the Cadence Palladium Z1 Enterprise Emulation Platform
Monday, January 30, 2017
Persistent Memory Platform Support Will Take Time
Sunday, January 29, 2017
Rambus Reports Fourth Quarter and Fiscal Year 2016 Financial Results
Bosch joins MIPI Alliance as new member
Aquantia Announces the Industrys First FPGA-Programmable Multi-Gigabit Ethernet PHY Device
Synopsys Extends Verification FastForward Program, Enabling Cadence Incisive and Mentor Graphics Questa Users to Adopt VCS Simulation with Fine-Grained Parallelism Technology
Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack
25 Gigabit Ethernet Consortium Members Validate Multi-Vendor Interoperability
Credo Demonstrates 112G PAM4 SR, 56G PAM4 LR, and 56G NRZ SerDes Technology at DesignCon
Thursday, January 26, 2017
Toshiba Confirms Memory Chip Selloff
Thursday, January 26, 2017
Mn_nH release 360 degree image stitching IP for VR camera SoC.
Thursday, January 26, 2017
Xilinx Announces Third Quarter 2017 Results
Wednesday, January 25, 2017
Starblaze Achieves First-Pass Silicon Success for Storage SoC with Synopsys ARC Processor and Interface IP
Memory compressor IP can save time, energy
Wednesday, January 25, 2017
Spin Transfer Technologies Samples Fully Functional ST-MRAM Devices
Tuesday, January 24, 2017
Patent Suits Hit Q'comm Profits
Ex-Elpida CEO's China Fab Plan Dropped?
Is Semiconductor M&A Wave Dissipating?
Cypress Offers Enhanced Security, Reliability and Performance for Automotive, Industrial and IoT Applications with New FL-L NOR Flash Memories
Peregrine Semiconductor Introduces Next-Generation Technology Platform with Industry's Best RonCoff Performance
Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX Process by SoC Designers
Synopsys' ARC SEM Security Processors Win Linley Group's 2016 Analysts' Choice Award for Best Processor IP
Monday, January 23, 2017
Nordic Semiconductor nRF52 Series-based Bluetooth low energy and NFC module offers ultra-compact wireless solution for smart cards and wearables
ZTE Wireless Institute Achieves Performance Breakthrough for Deep Learning with Intel FPGAs
UMC's 28nm Ramp to Slip This Year
Cadence Virtuoso ADE Product Suite Named Product of the Year by Electronic Products Magazine
Monday, January 23, 2017
Qualcomm Feels Smartphone Squeeze
Monday, January 23, 2017
TI Reorgs Analog Group
Sunday, January 22, 2017
Silicon Labs Acquires Wi-Fi Innovator Zentri
Silicon Labs Expands IoT Portfolio
From Hardware Emulation to High-Frequency Trading Riding the FPGA Wave
X-Fab is Fastest Growing Foundry
Concept Engineering's RTLVision Debugger and Viewer to Power Real Intent's Verification Solutions
Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.2 Percent in 2017
Dolphin Integration Receives Open-Silicon's Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem
Flex Logix Works With DARPA To Develop Flex Logix's Embedded FPGA IP For Government Projects
Friday, January 20, 2017
Aldec provides Finite State Machine Coverage for verification of safety-critical FPGAs
Friday, January 20, 2017
Neurala Announces $14 Million Series A to Bring Deep Learning Neural Network AI Software to Drones, Self-Driving Cars, Toys and Cameras
Friday, January 20, 2017
Market for Power Semiconductors in Automotive to Rev Up by $3 Billion by 2022, IHS Markit Says
Thursday, January 19, 2017
Advantech is Microsoft Global Internet of Things (IoT) Valued Partner
Tsinghua to Build $30 Billion Memory Fab in China
Thursday, January 19, 2017
ARM Holdings plc Reports Results for the First Quarter Ended 31 March 2010
Thursday, January 19, 2017
Blue Pearl Software Appoints John Molyneux President After Record Year
Thursday, January 19, 2017
NRAM's Day Is Finally Here: Report
Thursday, January 19, 2017
WiLAN Provides Litigation Update
Wednesday, January 18, 2017
SMIC Reaffirms Fourth Quarter 2016 Guidance
2015-2016 Deals Dominate Semiconductor M&A Ranking
Synopsys Releases New Version of Coverity Static Analysis Tool with Enhanced Security for Mobile and Web Applications
智原科技:全球第一家获颁ISO 26262证书的ASIC设计服务厂商
Global semiconductor revenue topped $339.7 billion in 2016
Future of Chip Research Group Questioned
Faraday: World's First ISO 26262 Certified ASIC Service Company
VIA launches Custom IoT Platform Design Service
Previous
|
Next
Did you miss last D&R News Alerts ?