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Monday, January 16, 2017

• Tech body welcomes May's Brexit plan
• Toshiba Mulls Chip Business Spinoff
• Dialog Semiconductor Plc.: Dialog Semiconductor Powers Next-Generation Connected Cars
• Mantaro Introduces an Advanced Development Platform for the Altera Arria 10 SoC
• Arteris announces 9 new licensees, multiple interconnect IP product releases and profitable operation in 2016
• Imagination's new PowerVR GPUs deliver leading performance in lowest area for mid-range markets
• Beyond Semiconductor partners with Rubicon Labs to deliver full stack solution for cryptographically secure execution processor
• Three Tips to Maximize your SoC performance

Monday, January 16, 2017

• ATopTech, Inc. Initiates Voluntary Chapter 11 Bankruptcy Protection Proceeding

Monday, January 16, 2017

• No Sign of 450mm on the Horizon

Sunday, January 15, 2017

• Hardware agnostic IoT solution takes customization to the next level
• Nordic Bluetooth low energy-powered scalable design platform for wearables supports AirFuel-compliant wireless charging
• Scalable ECU platform to accomplish level 3 autonomous driving
• Turning cars into mobile devices: MIPI
• Hundreds of Xilinx Space Grade FPGAs Deployed in Launch of Iridium NEXT Satellites
• Socionext Accelerates Test Generation and Lowers Test Cost Using Synopsys TetraMAX II
• Rambus Signs Patent License Agreement with Winbond
• Sidense Receives Coveted ISO 9001:2015 Quality Management System Certification
• Moortec Announce Embedded Temperature Sensor on TSMC 16FF+ & FFC

Friday, January 13, 2017

• Born Secure: Could ARMv8-M Become the Leading Microcontroller Architecture for the Industrial IoT?

Friday, January 13, 2017

• Magma Adopts Legend's MSIM Circuit Simulator for Cell Characterization and Delay Correlation

Friday, January 13, 2017

• Rambus Outlines Roadmap to Bring XDR to Main Memory

Thursday, January 12, 2017

• Pure-Play Foundry Market Surges 11% in 2016 to Reach $50 Billion!
• TSMC Expects Flat Year for Foundry
• Trilinear Technologies Adds Display Stream Compression (DSC) Encode and Decode Solutions to IP Portfolio

Thursday, January 12, 2017

• IFI CLAIMS Announces Top Recipients of U.S. Patents in 2016

Wednesday, January 11, 2017

• 从Xtensa可配置处理器架构出发 了解可配置处理器开发原理
• Cadence宣布推出业界首款蓝牙5验证IP
• TSMC Reports Fourth Quarter EPS of NT$3.86
• BaySand enhanced MetalCopy Program to Support 14nm FPGA Transition to ASIC
• Crossbar ReRAM in production at SMIC
• Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 2.9 Percent in 2017
• 9 Hottest Embedded Electronics Trends in 2016
• Mentor Graphics Expands Comprehensive ISO 26262 Qualification Program
• China Expected to Poach More Taiwan Chip Execs
• Google Searches for Better Silicon

Tuesday, January 10, 2017

• AltaSens Adopts Cadence Modus Test Solution for Mixed-Signal Image Sensor Designs
• China Company Receives Working First Silicon for SingMai's Analogue Video Decoder

Monday, January 9, 2017

• Arasan Announces Total IP Solution for MIPI I3C Standard
• Mediatek Licenses Sonics' NoC and Memory Scheduler IP
• Synopsys Extends Software Integrity Platform with Acquisition of Forcheck
• Sequans Extends Collaboration with TSMC to Develop World's first LTE-M chip for IoT
• OmniPHY Joins TSMC IP Alliance Program
• TSMC December 2016 Revenue Report
• Securing chips for the IoT

Monday, January 9, 2017

• MIPI Alliance Releases MIPI I3C Sensor Interface Specification

Monday, January 9, 2017

• Creonic Announces FMC Board with L-Band RF Input for Satellite Applications

Sunday, January 8, 2017

• Arm trusted cores get Lauterbach debug support
• UMC Reports Sales for December 2016
• CEVA Announces Record Revenues for the Fourth Quarter
• Cadence Announces Availability of Industry-First Bluetooth 5 Verification IP

Friday, January 6, 2017

• Bosch Dev Kit to Ease IoT
• Arm Exec Dizzy for Open-Source Twizy

Thursday, January 5, 2017

• Process Makes Smaller, Cheaper Chips
• Faraday Monthly Consolidated Sales Report - December 2016
• Open Source Reaches Processor Core

Thursday, January 5, 2017

• Imagination appoints industry expert to lead PowerVR business unit

Thursday, January 5, 2017

• VESA Rolls Out Early Certification Program for Video Source and Display Products Using HBR3 High-Bandwidth Link Rate

Thursday, January 5, 2017

• Wi-Fi CERTIFIED TimeSync brings precise synchronization to Wi-Fi devices

Thursday, January 5, 2017

• Waves Nx Now Available on ARM-Based Platforms

Wednesday, January 4, 2017

• AMD Describes Vega GPU
• GUC Monthly Sales Report - December 2016
• Imagination collaborates with Socionext on advanced video and display technologies
• Almalence Video SuperSensor Software Now Improves Video Image Quality Powered by Cadence Tensilica Vision DSP
• Fortemedia Licenses Tensilica Fusion F1 DSP for Use in Always-On Smart Microphone Processor
• Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices
• MIPS I6500 CPU sub-system with NetSpeed's Gemini IP provides highly efficient processing for vision applications
• DeepGlint Harness the Power of CEVA-XM4 Imaging and Vision Platform for Intelligent Video Analytic and ADAS Solutions
• Faraday Extends SoC Design Services to Include Virtual Prototyping Solution Using Synopsys Virtualizer
• Telink Semiconductor's RF system on chip (SoC) passes ZigBee 3.0 certification tests using DSR's wireless software stack