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Monday, January 2, 2017

• IoT design needs system focus
• Global Semiconductor Sales Up 7 Percent Year-to-Year
• Rambus to Demonstrate IoT Security Technology in Qualcomm Booth at CES

Friday, December 30, 2016

• ATopTech Responds to Recent Court Ruling in Copyright Case

Friday, December 30, 2016

• Nokia expands patent litigation against Apple in Asia, Europe and the US

Thursday, December 29, 2016

• ASolid Adopts AndesCore N9 for its AS2726 eMMC Controller to Deliver Competitive Market Advantage

Thursday, December 29, 2016

• Korea Fines Qualcomm Nearly $1B

Wednesday, December 28, 2016

• 重庆高新区雅特力发布首款自主研发集成电路芯片

Wednesday, December 28, 2016

• IPrium releases 40G I.3 Encoder/Decoder for DWDM systems

Wednesday, December 28, 2016

• TSMC Says 10nm on Track, Countering Reports

Friday, December 23, 2016

• Total Memory Market Forecast to Increase 10% in 2017

Friday, December 23, 2016

• Arastu System's LPDDR3 Controller Core for Extended Battery Life

Friday, December 23, 2016

• Synopsys Obtains Injunction in Copyright Suit Against ATopTech

Thursday, December 22, 2016

• ESD Alliance Reports EDA Industry Revenue Increase for Q3 2016

Thursday, December 22, 2016

• First VESA Display Stream Compression (DSC) Decoder IP Announced by Hardent

Wednesday, December 21, 2016

• TDK to Acquire InvenSense

Wednesday, December 21, 2016

• CEVA Brings its Leading-Edge Solutions for Smarter, Connected Devices to CES

Wednesday, December 21, 2016

• Chips Execs See Maturing Industry

Wednesday, December 21, 2016

• FotoNation and VeriSilicon Collaborate on Next Generation, Advanced Computer Vision and Computational Imaging Platform (IPU2.0)

Wednesday, December 21, 2016

• HDL Design House Selected as ARM Approved Design Partner