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Monday, December 19, 2016

• HDL Design House Selected as Arm Approved Design Partner

Monday, December 19, 2016

• Celeno and NGCodec demonstrate sub-frame latency 5GHz Wi-Fi Wireless Virtual Reality Solutions

Monday, December 19, 2016

• Cypress Commences Volume Shipments of MCUs Based on eCT Embedded Flash Memory Manufactured at UMC

Monday, December 19, 2016

• Inside Secure appoints Catherine Blanchet to its Supervisory Board

Sunday, December 18, 2016

• CEVA-X1 DSP Core Targets Cellular IoT Opportunities

Friday, December 16, 2016

• Number of IC Manufacturers Using 300mm Wafers Less than Half Using 200mm Wafers

Friday, December 16, 2016

• Jury Awards Core Wireless $7.3 Million in Patent Litigation Against Apple

Thursday, December 15, 2016

• Arm extends HPC offering with acquisition of software tools provider Allinea Software
• Imagination's PowerVR GPU is first to pass OpenVX 1.1 conformance with Khronos

Thursday, December 15, 2016

• Hardent to Demo Visually Lossless 4K Display Stream Compression at CES 2017

Wednesday, December 14, 2016

• 智原55纳米eFlash方案推动MCU ASIC技术演进
• China Dominates Planned Chip Fabs
• GUC Opens New Netherlands Office
• PLDA Group Spins Off its QuickPlay FPGA Accelerator Activities into the Newly Formed Accelize
• Microsemi Adds IP for Resolver Sensors to FPGA-Based Multi-Axis Motor Control Solution Targeting Aerospace and Defense, Automotive and Industrial Applications
• Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution
• Imagination's Ensigma wireless communications IP now Wi-Fi CERTIFIED on chip that powers Creator Ci40 board
• GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX Solutions
• Silicon-proven HBM Gen2 Hardened PHY from eSilicon
• Mechatronics aids in embedded system design
• Faraday Readies MCU ASIC Migration Path with 55nm eFlash

Tuesday, December 13, 2016

• European tech M&A deals double in 2016
• Chip Market Brightens in 2017
• Samsung Reportedly Mulls Foundry Spinoff
• IoT design kit is ZigBee certified for the home
• Himax, emza and CEVA Partner to Create Ultra-Low Power, Always-On Vision Sensor for IoT
• 62 new fabs coming on-line in 2017-20

Tuesday, December 13, 2016

• Alizem Releases its New DC Motor Control Embedded Software IP for Intel MAX 10 FPGAs

Monday, December 12, 2016

• Lurking Behind Every M&A Is China
• Qualcomm Falters at Top Of Fabless Ranking
• WiLAN Subsidiary Acquires Patent Portfolio from GLOBALFOUNDRIES
• Rambus Renews License Agreement with Thales
• How to Protect Connected Home Devices and Appliances from Cyber Attacks
• Smart Home Reference Designs from Silicon Labs Accelerate Development of IoT Connected Devices
• NXP and Google Advance IoT Development on New Android Things Platform
• GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology
• SRT Group License CEVA Signal Processing IP
• Flex Logix High-Performance Embedded FPGA IP Core Now Available for TSMC 16FF+ and 16FFC
• 最小化电源域漏电功耗以及设计余量进而缩短上市时间

Monday, December 12, 2016

• Lawmakers Urge Rejection of Lattice Semi Takeover

Monday, December 12, 2016

• CEVA Appoints Maria Marced, President of TSMC Europe, to Board of Directors

Sunday, December 11, 2016

• Robotics of things - the next big thing in embedded
• Lattice gives iCE40 more power, I/O and memory
• TSMC Plans New Fab for 3nm
• Moortec Announce Embedded Voltage Monitor on TSMC 16FF+ and FFC Processes

Thursday, December 8, 2016

• UMC Reports Sales for November 2016
• TSMC November 2016 Revenue Report

Wednesday, December 7, 2016

• Nantero Secures More Than $21M in Additional Funding
• Arasan Chip Sytems Announces Xilinx Alliance Program Membership
• Arm Offers Support For TSMC 7nm Manufacturing
• Synopsys Announces Industry's First DisplayPort 1.4 with DSC 1.2 Verification IP and Test Suites
• What Siemens' Mentor Buy Means to IC Designers
• ACE Awards: AMD Wins Company of Year
• CEVA creates new value by enhancing IoT and machine learning applications
• UNH-IOL Shines Spotlight on Internet of Things Interoperability
• Alliance between prpl Foundation and IoTSF puts 'security by design' at the heart of embedded computing
• Nexell's release of new AP supporting 4K 60fps with Chips&Media' HEVC/H.265 and VP9
• Smartlogic PCI Express DMA IP Cores now available for Intel FPGAs