Search News

Thursday, October 20, 2016

• Chips&Media, Inc. Joins the Alliance for Open Media

Wednesday, October 19, 2016

• Mentor Graphics Integrates its Questa Verification Solution with Jenkins Ecosystem Enabling Maximum Regression Speed
• Allegro DVT Introduces New Lightweight Multi-Format Video Encoder IP
• Mentor for sale
• China plans 3D NAND production next year
• 2016 IC Market Forecast Raised from -2% to +1%
• Intel launches Stratix 10: Altera FPGA combined with Arm CPU, 14nm manufacturing
• Xilinx Announces Second Quarter 2017 Results; Advanced Products Repeat 60% Year-Over-Year Growth
• S2C's Latest Prodigy Interface Module For Juno Arm Development Platform Speeds FPGA Prototyping And Increases Scalability
• IoT Hears LTE Calling
• HMicro Licenses and Deploys CEVA Wi-Fi IP for Healthcare and IoT Devices
• asicNorth announces a Development Ecosystem to streamline the creation of mixed-signal IoT SoC's
• Return to sequential growth at Taiwan foundries
• 7nm processes at IEDM

Wednesday, October 19, 2016

• Oxygen Layer May Extend Moore's Law

Wednesday, October 19, 2016

• Appeals Court Affirms Finding of Patent Invalidity in Suit Against Mentor in California

Tuesday, October 18, 2016

• Protocols For The Wide-Area IoT
• Faraday Unveils Uranus SoC Development Platform for Ultra-Low-Power IoT
• Arm Moves to Fill Industry's Engineering Education Gap
• Chongqing Yubei District fuels mass entrepreneurship and innovation through a new Arm IP Pool
• CAST Expands Streaming Video IP Line with Motion JPEG Subsystem

Monday, October 17, 2016

• eMemory Receives SMIC Best IP Partner Award for 4th Year in a Row
• Cadence Enables Customer Innovation with Arm-Optimized Solutions from Chips to Boards to Systems at Arm

Monday, October 17, 2016

• Neural computing technology leader BrainChip appoints T2M for global marketing, representation and business development

Monday, October 17, 2016

• Q&A: Embedded FPGA Facilitates Reconfigurable SoC/MCU RTL Blocks

Monday, October 17, 2016

• Mentor Graphics working with Bank of America to explore sale-sources

Monday, October 17, 2016

• DUSB2-ULPI, USB 2.0 device controller with ULPI interface

Sunday, October 16, 2016

• SMIC TianJin Launches Capacity Expansion Project; Expected to Become the World's Largest Integrated 8-Inch IC Production Line
• Qualcomm Tips 28 GHz 5G Chip
• Imagination and Actions strengthen partnership on MIPS CPUs
• Newracom Announces Availability of Ultra-Low Power Arm Core Based Wi-Fi 802.11 b/g/n MAC/PHY/Subsystem and RFIC IP for Internet of Things Applications
• Baidu Adopts Xilinx to Accelerate Machine Learning Applications in the Data Center
• Canonical and Arm collaborate to offer commercial availability of Ubuntu OpenStack and Ceph for 64-bit Arm-based servers

Saturday, October 15, 2016

• Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology

Friday, October 14, 2016

• Smartlogic Announces PCI Express Multichannel DMA IP Core optimized for Video Streaming

Thursday, October 13, 2016

• TSMC Grows Share of Foundry Business

Wednesday, October 12, 2016

• TSMC Reports Third Quarter EPS of NT$3.73
• SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
• TTTech Acquires Chip IP Specialist Flexibilis to Strengthen Position in Industrial Domain and to Expand Towards Smart Grid Market
• Linear, Advantech add internet protocol to M2.COM IoT options

Wednesday, October 12, 2016

• Fast JPEG Encoder Core from CAST Used in Fastec TS3 High-Speed Camera

Tuesday, October 11, 2016

• 智原发表PowerSlash™硅智财于联电55奈米超低功耗工艺 支持物联网应用开发
• Did Processor Cause Samsung Note 7 Blowup?
• Free IoT wireless network offered in London
• Faraday's PowerSlash IP Now Available on UMC's 55nm Ultra-Low-Power IoT Platform
• Xilinx Announces Production Milestone for 16nm UltraScale+ Portfolio Ahead of Schedule
• Gartner Says Worldwide Semiconductor Capital Spending to Decline 0.3 Percent in 2016
• Moortec to exhibit at the Arm TechCon Expo in Santa Clara
• Imagination rolls out new 'Heterogeneous Inside & Out' MIPS CPU

Tuesday, October 11, 2016

• Silicon Labs Acquires Leading RTOS Company Micrium

Tuesday, October 11, 2016

• Kilopass Delivers 'Refresh' on DRAM Technology

Tuesday, October 11, 2016

• Aldec to Highlight ASIC Pre-Silicon Verification Spectrum with Network-On-Chip (NoC) Demonstration at DVCon Europe

Tuesday, October 11, 2016

• CCIX Consortium Triples Number of Member Companies and Announces Availability of Specification

Monday, October 10, 2016

• Infineon Acquires LidarExpertise Through Innoluce Takeover
• Silicon Labs reckons mesh networks are right for the home
• Ceva processor tackles IoT wireless standards
• Achronix announces immediate availability of Speedcore embedded FPGA IP for SoC acceleration
• BaySand Introduces Enhanced FPGA to ASIC Conversion Program With IP Partners and Supporting Tools
• Arteris Joins CCIX Consortium to Support Heterogeneous Cache Coherency Deployment
• CSEM licenses IcyTRX Bluetooth Low Energy silicon RF IP to Oticon for use in advanced hearing aids.
• Kilopass Reveals New VLT DRAM Technology This Week at MemCon, CSIA-ICCAD
• Cortus Launches High Performance Dual-Issue IP Core for Embedded Applications
• Chips&Media and Goke Microelectronics partner to provide video codec IP

Monday, October 10, 2016

• Sonics to conduct "Energy Processing Units for Power-Sensitive Chip Designs" Seminar in Israel on Tuesday, November 8th

Monday, October 10, 2016

• Faraday Monthly Consolidated Sales Report - September 2016

Monday, October 10, 2016

• Innosilicon A4 Dominator, World 1st 14nm Litecoin Miner in Mass Production

Monday, October 10, 2016

• Companies Maximizing 300mm, 200mm Wafer Capacity

Sunday, October 9, 2016

• Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology
• Mentor Graphics Acquires Galaxy Semiconductor
• CEVA Introduces Lightweight Multi-Purpose Processor for the Massive Internet of Things
• Cadence Delivers 10 New VIP Solutions to Accelerate Time to Market for Applications Based on Critical New Standards