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Friday, October 7, 2016
Startup Digs Deep Learning, Snags Big Backers
Friday, October 7, 2016
GUC Monthly Sales Report - September 2016
Friday, October 7, 2016
UMC Reports Sales for September 2016
Friday, October 7, 2016
TSMC September 2016 Revenue Report
Thursday, October 6, 2016
Google Does Consumer Electronics
Thursday, October 6, 2016
EE Slashes CPU Design Cost
Thursday, October 6, 2016
Ethernet Flexes Network Muscles
Thursday, October 6, 2016
Ethernet Alliance Applauds Successful Completion of IEEE 802.3bz
Thursday, October 6, 2016
Sony-Inside Huami Watch: Is It Time for FD-SOI?
Thursday, October 6, 2016
OmniPhy Announces 1000Base-T1 "Gigabit" Automotive Ethernet Silicon IP Development
Wednesday, October 5, 2016
SureCore SRAMs design-ready, says CEO
INSIDE Secure and 6WIND partner to bring high-performance and scalability to the Cloud
Open-Silicon Extends Long-Term Collaboration with Mentor Graphics Technologies for Custom SoC Design Success
Tuesday, October 4, 2016
Nokia bolsters its base station power efficiency by acquiring Eta Devices
NXP Pushes Hardware Isolation in i.MX8
Accelerate SHA-3 Cryptographic Hash Processing with New Hardware IP Core
Qualcomm Snapdragon 600E and 410E embedded/IoT processors available through distributors
NXP Extends Secure Car Access Portfolio to Offer New Complete Passive Keyless Entry System
NXP Doubles Its Portfolio of MagniV Microcontrollers Serving the Growing Global Automotive Motor Control Market
VIA Labs VL716 USB 3.1 Gen 2 to SATA Bridge with Native USB-C Support Achieves USB-IF Certification
Mentor Graphics, Northwest Logic, and Krivi Semiconductor Announce Availability of Complete DDR4 SDRAM IP Design and Verification Solution
Tuesday, October 4, 2016
Asiczen Releases its CAN Verification IP
Monday, October 3, 2016
Khronos Launches Dual Neural Network Standard Initiatives
Mentor Graphics Announces 64-bit Armv8-A Support for the Nucleus Real-Time Operating System
HMicro and STMicroelectronics Announce Wearable Wireless Biosensor Platform that Frees Patients from Cables
TSMC Staffing R&D for 3nm Process
STMicroelectronics Announces Timing for 3rd Quarter 2016 Earnings Release and Conference Call
Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics
HDL Design House Opens New Office in Thessaloniki, Greece
Monday, October 3, 2016
Kilopass Appoints Sue Kim Vice President of Corporate Marketing
Monday, October 3, 2016
Intrinsic-ID and Guardtime Announce Alliance on IOT Blockchain
Monday, October 3, 2016
MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology
Monday, October 3, 2016
Qualcomm, NXP Discuss Merger, Say Reports
Monday, October 3, 2016
Open-Silicon to showcase ARM Cortex-M based IoT Custom SoC Platform at ARM TechCon
Monday, October 3, 2016
CAST Introduces Low-Power, Ultra-HD Capable Video Compression Cores
Sunday, October 2, 2016
Do Chip Designers Worry About the Impact of Power Consumption on Sustainability?
IBM Invests to Lead Global Internet of Things Market -- Shows Accelerated Client Adoption
Silicon Labs Acquires Leading RTOS Company Micrium for IoT
Rambus Signs License Agreement With Xilinx
Friday, September 30, 2016
INVECAS to Enable ASIC Designs for Tomorrow's Intelligent Systems on GLOBALFOUNDRIES' FDX Technology
Friday, September 30, 2016
INSIDE Secure and Marvell Deliver Open Source Open Data Plane Security VPN Solution
Thursday, September 29, 2016
NetSpeed Releases Gemini 3.0 Cache-Coherent NoC IP to Supercharge Heterogeneous SoC Designs
Thursday, September 29, 2016
Arrow and Electric Imp spot big industrial IoT opportunity
Altium Announces Major Update for TASKING VX-toolset for TriCore(tm) with Latest AURIX(tm) Technology
X-FAB to Acquire Assets of Altis Semiconductor
Thursday, September 29, 2016
Open-Silicon Tapes Out Industry's First High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in 16nm FF+
Thursday, September 29, 2016
ESD Alliance Reports EDA Industry Revenue Increase For Q2 2016
Thursday, September 29, 2016
INVECAS and GLOBALFOUNDRIES Announce Availability of Advanced 14nm FinFET Design IP Library for High-Performance Computing, Networking, and High-End Mobile Applications
Wednesday, September 28, 2016
Via Expands LTE Patent Pool License Coverage to Include LTE-Advanced
Wednesday, September 28, 2016
Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab
Tuesday, September 27, 2016
Leading-Edge Leads the Way in Pure-Play Foundry Growth
<40nm processing drives foundry sales
STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables
Qualcomm Mobilizes in Embedded Processors
Arm open source group address IoT software confusion
Samsung Calls for New CPU Design
Mesh Networking Module from Silicon Labs Simplifies Thread and ZigBee Connectivity
Moortec Receives 2016 TSMC Open Innovation Platform Partner of the Year New IP Award
Tuesday, September 27, 2016
Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum
Tuesday, September 27, 2016
Analog Bits to deliver two presentations on 16nm IP at TSMC Open Innovation Platform Ecosystem Forum
Tuesday, September 27, 2016
Kalray Works with Automobile Giants to put its MPPA Manycore Processor into Self-Driving Vehicles
Monday, September 26, 2016
CEVA refines its Vision DSP
iPhone 7, No Headphone Jack Creates a Recipe for e-Waste
Arm System IP boosts SoC performance from edge to cloud
Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT
AMD Takes Embedded Applications to the Next Level With New GPUs
Fifth-Generation CEVA Imaging & Vision Technology Simplifies Delivery of Powerful Deep Learning Solutions on Low-Power Embedded Devices
Intrinsic-ID overall winner of EU 2016 Innovation Radar Prize
Arteris FlexNoC Physical and FlexNoC Resilience Packages Licensed by Mobileye for Next-Generation Advanced Driver Assistance Systems (ADAS)
Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs
USB-IF Announces USB Audio Device Class 3.0 Specification
Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle
TSMC Recognizes Synopsys with Three Partner Awards for Interface IP and Joint Development of 7-nm Mobile and HPC Design Platforms
Cadence Recognized with Four TSMC Partner of the Year Awards
Monday, September 26, 2016
NetSpeed systems featured in EE TIMES' Silicon 60: Emerging Companies to Watch
Monday, September 26, 2016
Imagination 2.0 Update Ships
Monday, September 26, 2016
Asiczen Releases its APB Verification IP
Monday, September 26, 2016
Chip IP Biz & IC Industry M&As
Sunday, September 25, 2016
Eurotech announces ESF Release 4.0, featuring support for the new ReliaGATE 20-25 and connectivity to multiple Clouds
Chip Market to Go Down, says Future Horizons
Linaro Announces LITE - Collaborative Software Engineering for the Internet of Things (IoT)
Linaro Announces First Development Board Compliant with 96Boards IoT Edition Specification
NXP Introduces Industry's Lowest Power Arm Cortex-A7 Based Processor to Fuel Growth of the Internet of Things
Amazing improvement of power and density for RFID chips with standard cell libraries at 180 nm from Dolphin Integration
DCAN FD, A Configurable CAN Bus Controller with Flexible Data-Rate Targets Autonomous Cars & ADAS Systems
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