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Friday, September 9, 2016

• AMD Partner Globalfoundries Begins 12nm FD-SOI Rollout-Product Tape Out Expected In 2019

Friday, September 9, 2016

• Argon Design releases Argon Streams ARIB

Friday, September 9, 2016

• TSMC August 2016 Revenue Report

Friday, September 9, 2016

• UMC Reports Sales for August 2016

Wednesday, September 7, 2016

• Icon Labs and Renesas Share Design Expertise in New IIoT Security Guide White Paper
• Synopsys Expands Collaboration with Arm to Deliver Artisan Physical Libraries and POP IP Support for IC Compiler II
• Technology Momentum Extends Synopsys IC Compiler II Deployments Past 100 Customers
• IAR Systems expands Arm tools for developers focused on the Internet of Things
• Synopsys Joins GLOBALFOUNDRIES' FDXcelerator Partner Program to Enable Innovative Designs Using the FD-SOI Process
• GLOBALFOUNDRIES Extends FDX Roadmap with 12nm FD-SOI Technology
• GLOBALFOUNDRIES Unveils Ecosystem Partner Program to Accelerate Innovation for Tomorrow's Connected Systems
• Leti lines up with Weebit Nano for ReRAM development

Wednesday, September 7, 2016

• Intrinsic-ID nominated as one of the 16 most dynamic digital innovators in Europe

Wednesday, September 7, 2016

• Faraday Monthly Consolidated Sales Report - August 2016

Tuesday, September 6, 2016

• Ashling and Synopsys Collaborate to Accelerate Development and Debugging of Software for ARC-Based Embedded Systems
• Imagination teams with SaberTek and Mymo Wireless to deliver end-to-end licensable IP for LTE CAT1/0
• $18bn IoT IC sales in 2016, says IC Insights
• Boost Valley Announces its first FPGA proven IP - HDMI-CEC 2.0 Controller IP
• Apple Debuts Three Custom Chips
• Intel Spins out Security Group
• Intrinsic-ID nominated as one of the 16 most dynamic digital innovators in Europe
• Artificial Intelligence in Autonomous Driving
• Synopsys' New Virtualizer Studio Integrated Development Environment Accelerates Virtual Prototyping Productivity
• Updated Semiconductor Outlook for Internet of Things
• Newracom and Aviacomm Announce Availability of High-performance 802.11ah Reference Design for IoT Applications using Sub-1GHz ISM Frequency Bands
• NGCodec and PathPartner Technology jointly demonstrate H.265/HEVC codecs running on Xilinx FPGA's at the IBC Show
• PathPartner Technology Returns to IBC 2016 with Low Latency HEVC Streaming Solutions and Improved Quality for Broadcast Workflows
• Allegro DVT Unveils Industry's First ATSC3.0 System Compliance Test Suite at IBC 2016
• Mixel MIPI D-PHY IP Integrated into Lattice's CrossLink Low Power pASSP
• Ridgetop Group and BaySand Partner to Expand Mixed-Signal IP Portfolio and Services into Silicon Valley, Asia

Tuesday, September 6, 2016

• Aperi and Barco Silex partner to provide native IP live remote production in 4K

Tuesday, September 6, 2016

• HDMI Releases Alternate Mode for USB Type-C Connector

Tuesday, September 6, 2016

• Socionext Introduces High Image Quality, H.264 Full-HD Multi-Channel Codec

Monday, September 5, 2016

• Global Semiconductor Sales Rebound in July
• Qualcomm and Verizon Double Down on the Internet of Things
• Intel targets IoT machine vision firm Movidius
• Intel to Acquire Movidius: Accelerating Computer Vision through RealSense for the Next Wave of Computing
• Synopsys Announces Standards Board Ratification of Its New Parasitic Models for Latest FinFET Process Nodes
• Arteris FlexNoC IP Licensed by Octasic for Industrial/Tactical Systems
• INSIDE Secure Delivers Secure Content Distribution and Monetization Software for the HTC Vive Ecosystem

Monday, September 5, 2016

• GUC Monthly Sales Report - August 2016

Sunday, September 4, 2016

• UMC Forges Strategic Partnership with APM to Enhance MEMS Service Capabilities
• Allegro DVT's AVS2 Compliance Streams Selected by MediaTek Inc.

Thursday, September 1, 2016

• Moortec Announce Embedded Process Monitor on TSMC 16FF+

Wednesday, August 31, 2016

• Nordic Semiconductor smart remote control reference design marries unparalleled voice input performance with ultra-low power consumption
• Nordic-powered Bluetooth low energy development kit offers complete turnkey solution for rapid Internet of Things product development
• Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles

Wednesday, August 31, 2016

• World's first Chinese AVS2 decoder IP release by Chips&Media

Tuesday, August 30, 2016

• Moortec Announce Embedded Process Monitor on TSMC 16FF+LL
• IC Industry M&A: Who's Left to Buy?
• Samsung in volume production of 14nm Exynos processors
• Lockheed Martin Selects Microsemi's Master Reference Oscillators for the U.S. Air Force's Space Based Infrared System Satellite Program
• Fujitsu Semiconductor and Mie Fujitsu Semiconductor License Nantero's NRAM And Have Begun Developing Breakthrough Memory Products for Multiple Markets
• Argon Design Licenses Argon Streams HEVC to Socionext

Tuesday, August 30, 2016

• Linaro Announces First Development Board Compliant with 96Boards TV Platform Specification

Monday, August 29, 2016

• ON Semi to Sell Automotive IGBT Biz to Littelfuse
• MCU Market Forecast to Reach Record High Revenues Through 2020
• Arm Investors Nod to Its Sale to SoftBank
• Intel Debuts 14nm+ Processors
• Microsemi Announces LiteFast Serial Communication Protocol to Reduce Customers' Design-In Efforts and Time to Market
• Flex Logix Reconfigurable, Low-Power IP Cores Now Available for TSMC 40ULP
• eMemory Unveils EcoBit Technology for RFID and NFC Applications
• Sidense Demonstrates Successful 1T-OTP Operation in TSMC 16nm FinFET Process
• Eminent Reached 10 Millions of Successful Production Chips Incorporating Attopsemi's I-Fuse OTP
• Mobile Sensor Technology Company Acconeer AB Closes $7M Investment Round

Sunday, August 28, 2016

• Maxim's Industrial IoT Reference Design Speeds Development of Authenticated Data Chains