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Tuesday, October 25, 2016
Rambus Reports Third Quarter Financial Results
Tuesday, October 25, 2016
Faraday Presents High-Performance IP and Ultra-Low-Power SoC Solutions at SEDEX 2016
Monday, October 24, 2016
Chipus Microelectronics becomes an official Silterra's design partner
EnSilica opens specialist Design Centre for RF and low power sensing applications based near Oxford
PRO DESIGN Expands FPGA Prototyping Portfolio with High-Speed proFPGA Virtex UltraScale based FPGA Modules
Intel, Arm Battle over IoT
Synopsys Tools Enable Secure, Efficient IoT Designs Based On New Arm Cortex-M23 and Cortex-M33 Processors
Cadence Enables Accelerated Implementation and Signoff of New Arm Cortex-M23 and Cortex-M33 Processors
Allegro DVT Enriches its Video Decoder Verification Packages With The Release of Multi-Codec Coverage Tool
Arteris Adds Support for Arm AMBA 5 AHB5 Protocol
Monday, October 24, 2016
New NEMA|GFX Graphics API Enhances Rapid High Quality GUI Development for Embedded and Wearable Devices
Monday, October 24, 2016
Rambus Licenses its DPA Countermeasures to NVIDIA
Monday, October 24, 2016
Hisense selects their SoC Fabric for IoT from Dolphin Integration
Monday, October 24, 2016
Synopsys Custom Compiler Certified for Samsung's 10-nm Process Technology
Monday, October 24, 2016
North American Semiconductor Equipment Industry Posts September 2016 Book-to-Bill Ratio of 1.05
Monday, October 24, 2016
Aquantia Announces Breakthrough 100G Technology for Hyperscale Data Centers and Cloud Computing Environments
Monday, October 24, 2016
TSMC, GF/Samsung Battle at 7nm
Sunday, October 23, 2016
Cadence Reports Third Quarter 2016 Financial Results
FPGA module has 16Gbit/s I/O
IDT Announces Wireless 5G Technology Solutions for Xilinx Devices
Zebra Technologies, Bosch Connected Devices and Solutions and Arm Collaborate on Enterprise-Class Food Safety Solution to Better Protect Consumers
Intrinsic-ID collaborates with Wind River to offer robust PUF-Based security library integrated with VxWorks
海信为其IoT应用选择法国海豚科技的SoC架构IP系列
SoC Solutions joins asicNorth's IoT Design Ecosystem
Moortec to exhibit at the TSMC 2016 China OIP Ecosystem Forum in Beijing
Xilinx Zynq SoCs and MPSoCs Power Embedded Vision and IIoT Applications at Arm TechCon 2016
Fujitsu Adopts Cadence Palladium Z1 Enterprise Emulation Platform for Post-K Supercomputer Development
Cadence Reference Flow with Digital and Signoff Tools Certified on Samsung's 10nm Process Technology
Synopsys' Galaxy Design Platform Enables Superior Low-Power Designs on Samsung's 10-nm Process Technology
Thursday, October 20, 2016
Chips&Media, Inc. Joins the Alliance for Open Media
Wednesday, October 19, 2016
Mentor Graphics Integrates its Questa Verification Solution with Jenkins Ecosystem Enabling Maximum Regression Speed
Allegro DVT Introduces New Lightweight Multi-Format Video Encoder IP
Mentor for sale
China plans 3D NAND production next year
2016 IC Market Forecast Raised from -2% to +1%
Intel launches Stratix 10: Altera FPGA combined with Arm CPU, 14nm manufacturing
Xilinx Announces Second Quarter 2017 Results; Advanced Products Repeat 60% Year-Over-Year Growth
S2C's Latest Prodigy Interface Module For Juno Arm Development Platform Speeds FPGA Prototyping And Increases Scalability
IoT Hears LTE Calling
HMicro Licenses and Deploys CEVA Wi-Fi IP for Healthcare and IoT Devices
asicNorth announces a Development Ecosystem to streamline the creation of mixed-signal IoT SoC's
Return to sequential growth at Taiwan foundries
7nm processes at IEDM
Wednesday, October 19, 2016
Oxygen Layer May Extend Moore's Law
Wednesday, October 19, 2016
Appeals Court Affirms Finding of Patent Invalidity in Suit Against Mentor in California
Tuesday, October 18, 2016
Protocols For The Wide-Area IoT
Faraday Unveils Uranus SoC Development Platform for Ultra-Low-Power IoT
Arm Moves to Fill Industry's Engineering Education Gap
Chongqing Yubei District fuels mass entrepreneurship and innovation through a new Arm IP Pool
CAST Expands Streaming Video IP Line with Motion JPEG Subsystem
Monday, October 17, 2016
eMemory Receives SMIC Best IP Partner Award for 4th Year in a Row
Cadence Enables Customer Innovation with Arm-Optimized Solutions from Chips to Boards to Systems at Arm
Monday, October 17, 2016
Neural computing technology leader BrainChip appoints T2M for global marketing, representation and business development
Monday, October 17, 2016
Q&A: Embedded FPGA Facilitates Reconfigurable SoC/MCU RTL Blocks
Monday, October 17, 2016
Mentor Graphics working with Bank of America to explore sale-sources
Monday, October 17, 2016
DUSB2-ULPI, USB 2.0 device controller with ULPI interface
Sunday, October 16, 2016
SMIC TianJin Launches Capacity Expansion Project; Expected to Become the World's Largest Integrated 8-Inch IC Production Line
Qualcomm Tips 28 GHz 5G Chip
Imagination and Actions strengthen partnership on MIPS CPUs
Newracom Announces Availability of Ultra-Low Power Arm Core Based Wi-Fi 802.11 b/g/n MAC/PHY/Subsystem and RFIC IP for Internet of Things Applications
Baidu Adopts Xilinx to Accelerate Machine Learning Applications in the Data Center
Canonical and Arm collaborate to offer commercial availability of Ubuntu OpenStack and Ceph for 64-bit Arm-based servers
Saturday, October 15, 2016
Samsung Starts Industry's First Mass Production of System-on-Chip with 10-Nanometer FinFET Technology
Friday, October 14, 2016
Smartlogic Announces PCI Express Multichannel DMA IP Core optimized for Video Streaming
Thursday, October 13, 2016
TSMC Grows Share of Foundry Business
Wednesday, October 12, 2016
TSMC Reports Third Quarter EPS of NT$3.73
SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
TTTech Acquires Chip IP Specialist Flexibilis to Strengthen Position in Industrial Domain and to Expand Towards Smart Grid Market
Linear, Advantech add internet protocol to M2.COM IoT options
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