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Thursday, August 8, 2024

• Raspberry Pi Launch New RP2350 Microcontroller and Pico 2 Development Board with RISC-V Support
• The Uberization of Engineering
• Scaling sustainability impact
• Simplifying AI Deployment from the Cloud to Edge and Endpoint

Wednesday, August 7, 2024

• Femtosense Combines AI Chiplet with MCU for Audio SiP
• Why Transceiver-Rich FPGAs Are Suitable for Vehicle Infotainment System Designs
• ZeroPoint Technologies introduces zstd Decompression Hardware IP
• Ceva, Inc. Announces Second Quarter 2024 Financial Results
• UMC Reports Sales for July 2024
• QuickLogic Announces Partnership with CTG to Strengthen Aerospace & Defense Supply Chain
• Imec demonstrates logic and DRAM structures using High NA EUV Lithography
• NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage

Tuesday, August 6, 2024

• Consult Red Announces Strategic Partnership with CAST, Inc.
• AI, 3D printing, electrification drive automotive supply chain
• NVM Express Releases NVM Express Specifications to Unify AI, Cloud, Client, and Enterprise Storage
• Silvaco To Present at the Rosenblatt 4th Annual Technology Summit
• Samsung Electronics Begins Mass Production of Industry's Thinnest LPDDR5X DRAM Packages for On-Device AI
• Intel Foundry Achieves Major Milestones

Monday, August 5, 2024

• ZeroPoint Technologies introduces LZ4 Compression and Decompression Hardware IP
• Imec: Getting High-Precision Sensors to Market
• Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5%
• NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks
• Worldwide Silicon Wafer Shipments Increase 7% in Q2 2024, SEMI Reports
• Arteris Announces Financial Results for the Second Quarter 2024 and Third Quarter and Full Year 2024 Guidance
• Alphawave Semi Appoints Chief Accounting Officer, Sameer Ladiwala
• Crypto Quantique appoints ITEC to sell its IoT device security technology in Israel
• T2M-IP Unveils MIPI D-PHY v2.5 Tx and DSI Tx Controller v1.2: Silicon-Proven, Low-Power, Cost-Effective IP Core Solutions for Advanced SoCs
• GUC Monthly Sales Report - July 2024

Friday, August 2, 2024

• DDR5 Gains Enhanced Security, Reliability, and Power Management Features
• Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly

Thursday, August 1, 2024

• HCLTech recognized as Microsoft Partner of the Year for Dynamics 365 Service
• Renesas Completes Acquisition of Altium
• M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform
• Chip index collapses 7% as Arm punctures AI optimism
• Arm's calendar Q2 revenues up 39% y-o-y
• Scaling sustainability impact

Wednesday, July 31, 2024

• Samsung Sees Solid Demand for 3nm in 2H24, Aiming a Ninefold Increase in AI/HPC Sales by 2028
• Samsung set to ship HBM3E chips in H2 after strong H1
• Europe launches 'AI Factories'
• QuickLogic Signs Distribution Agreement with Astute Electronics to Expand Global Reach
• Weebit Nano and DB HiTek tape-out ReRAM module in DB HiTek's 130nm BCD process
• Sondrel's SFA 100 is ideal for AI at the Edge
• FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs
• Weebit Nano moves closer to availability at DB HiTek; tapes out first chip

Tuesday, July 30, 2024

• Faraday Reports Second Quarter 2024 Results
• BAE Systems Partners with Siemens for Industry 4.0 Revolution
• Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
• Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver
• Rambus Reports Second Quarter 2024 Financial Results

Monday, July 29, 2024

• RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution

Monday, July 29, 2024

• Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024

Monday, July 29, 2024

• It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026
• Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC
• Weebit Nano to present test results of ReRAM performance on GlobalFoundries 22FDX® wafers at FMS 2024
• RAAAM Memory Technologies Secures 5.25M€ from the European Innovation Council for its Groundbreaking On-Chip Memory Solution
• Raaam signs lead licensee for SRAM replacement technology
• Release of Post-Quantum Cryptographic Standards Is Imminent
• Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP Core with Time-Interleaved Pipeline Architecture Now Available for Whitebox Licensing with No Royalty Fees