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Thursday, August 11, 2016

• 14 Views from the Flash Summit

Thursday, August 11, 2016

• SMIC Reports 2016 Second Quarter Results

Wednesday, August 10, 2016

• Orange Tree announces SuperSpeed USB 3.0 FPGA module

Wednesday, August 10, 2016

• MPEG LA Expands DisplayPort License Coverage

Wednesday, August 10, 2016

• TSMC July 2016 Revenue Report

Wednesday, August 10, 2016

• GUC President Jim Lai Announces Retirement

Tuesday, August 9, 2016

• Artosyn selects Chips&Media Lossy&Lossless Compression IP for Drone, Robots, AR, and VR SoCs
• Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP
• Chelsio Demonstrates NVMe Over Fabrics With 40GbE iWARP RDMA At Flash Memory Summit 2016
• IP-Maker to showcase OLTP SQL acceleration
• IC Insights Bulletin: DRAM on Track to Be Worst-Performing Market in 2016
• SMIC Raises Target for 2016 Sales
• Intel to Acquire Deep Learning Nervana

Tuesday, August 9, 2016

• Kalray Launches Krypto128 Accelerator Card

Tuesday, August 9, 2016

• UMC Reports Sales for July 2016

Monday, August 8, 2016

• CAST and PLDA GROUP Demonstrate x86-Compliant High Compression Ratio GZIP Acceleration on FPGA, Accessible to non-FPGA Experts Using the QuickPlay Software Defined FPGA Development Tool
• Discovering the world of IoT with the Connected MCU Lab
• WeEn Semiconductors Selects Silvaco's TCAD Products for Advanced Bipolar Power Device Design
• New Semiconductor Processes Offer Power Efficiency Opportunities for Apple Watch
• Rambus Signs License Agreement with Idaho Scientific
• Avery Design Systems Scale-Out With NVMe over Fabrics Verification Solutions

Monday, August 8, 2016

• Flex Logix Appoints Tony Kozaczuk as Director of Solutions Architecture

Monday, August 8, 2016

• Faraday Monthly Consolidated Sales Report - July 2016

Sunday, August 7, 2016

• Samsung to License Patent Portfolio From Tela Innovations
• Big Three Chipmakers Likely to Boost Capex
• Rambus Completes Acquisition of Snowbush IP Assets
• Semtech Completes Divestiture of Its Snowbush IP Business

Saturday, August 6, 2016

• Qualcomm Signs 3G/4G China Patent License Agreement with vivo

Friday, August 5, 2016

• GUC Monthly Sales Report - July 2016

Friday, August 5, 2016

• Arastu Systems announces highly flexible and compact DDR3/4 single controller

Thursday, August 4, 2016

• Next-Gen IoT Consortium Launches
• Arastu Systems announces highly flexible and compact DDR3/4 single controller
• IntelliProp Announces NVMe Host Accelerator IP Core With User-Friendly Hardware Interface

Thursday, August 4, 2016

• Huge 2H16 Spending Surge Expected From Samsung, TSMC, and Intel

Wednesday, August 3, 2016

• China IIoT efforts will dominate global market: Economist
• RF design in the 21st century
• Fee-Fest For SoftBank-Arm Advisers
• Rambus Completes Acquisition of Inphi Memory Interconnect Business
• Think Big for Ultra-Low Power IoT SoCs
• INSIDE Secure signs a binding agreement to sell its semiconductor business to Swiss cybersecurity expert WISeKey
• Integrated IoT SoCs start with a variety of IP and the right core

Wednesday, August 3, 2016

• Everspin Readies Industry's First 256Mb Perpendicular Spin Torque MRAM for Production and is Now Sampling Customers

Wednesday, August 3, 2016

• CEVA, Inc. Announces Second Quarter 2016 Financial Results

Wednesday, August 3, 2016

• Faraday 12.5G SerDes PHY Debuts on UMC 28HPC(U) Process

Tuesday, August 2, 2016

• Three IoT lessons from the Softbank acquisition of Arm
• Powering the future Internet Of Things

Tuesday, August 2, 2016

• PLDA GROUP announces tighter collaboration with Xilinx on Vivado HLS to enhance software programmability of Xilinx FPGAs in QuickPlay.

Monday, August 1, 2016

• Intel SoC FPGA Developer Forum: ReFLEX CES Showcases Arria10 SoC FPGA Cards and OpenCL Solutions
• China's IC Industry: 'Don't Let World Bully Us
• PLDA GROUP announces tighter collaboration with Xilinx on Vivado HLS to enhance software programmability of Xilinx FPGAs in QuickPlay
• Global Semiconductor Sales Increase in Second Quarter
• SIGFOX and UnaBiz Anchor French and Taiwanese Collaboration on Global Internet of Things Testbed
• GainSpan Announces Low-Power, Apple HomeKit Reference Design for Wi-Fi-Enabled Smart Home Accessories
• Semtech LoRa® RF Technology for IoT Used in Compact Wireless Module from Murata
• What the 40nm node means for the instrument cluster
• MIPI Alliance Gives Members First Access to MIPI I3C Interface Specification for Sensor Applications
• Cadence Delivers Industry's First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions
• Socionext Bleeds Top Network SoC Talent to Acacia

Monday, August 1, 2016

• Pierre Lamond Joins Flex Logix's Board of Directors

Monday, August 1, 2016

• UMC Qualifies 0.18um BCD Process for Most Stringent AEC-Q100 Grade-0 Automotive ICs

Sunday, July 31, 2016

• PLDA and Epostar to Demonstrate New PCIe/NVMe Solution, Delivering the Increased Throughput and Decreased Latency Required for Today's PCIe SSD Storage Applications
• Arm expands IoT security team in Israel
• Faraday Receives ISO9001: 2015 Plus Award, Proving the High Quality of its Design Service for Customers
• Synopsys' New Model for Infineon's Next Generation TriCore Architecture Accelerates Early Automotive Software Development and Test