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Tuesday, September 27, 2016

• Kalray Works with Automobile Giants to put its MPPA Manycore Processor into Self-Driving Vehicles

Monday, September 26, 2016

• CEVA refines its Vision DSP
• iPhone 7, No Headphone Jack Creates a Recipe for e-Waste
• Arm System IP boosts SoC performance from edge to cloud
• Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT
• AMD Takes Embedded Applications to the Next Level With New GPUs
• Fifth-Generation CEVA Imaging & Vision Technology Simplifies Delivery of Powerful Deep Learning Solutions on Low-Power Embedded Devices
• Intrinsic-ID overall winner of EU 2016 Innovation Radar Prize
• Arteris FlexNoC Physical and FlexNoC Resilience Packages Licensed by Mobileye for Next-Generation Advanced Driver Assistance Systems (ADAS)
• Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs
• USB-IF Announces USB Audio Device Class 3.0 Specification
• Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle
• TSMC Recognizes Synopsys with Three Partner Awards for Interface IP and Joint Development of 7-nm Mobile and HPC Design Platforms
• Cadence Recognized with Four TSMC Partner of the Year Awards

Monday, September 26, 2016

• NetSpeed systems featured in EE TIMES' Silicon 60: Emerging Companies to Watch

Monday, September 26, 2016

• Imagination 2.0 Update Ships

Monday, September 26, 2016

• Asiczen Releases its APB Verification IP

Monday, September 26, 2016

• Chip IP Biz & IC Industry M&As

Sunday, September 25, 2016

• Eurotech announces ESF Release 4.0, featuring support for the new ReliaGATE 20-25 and connectivity to multiple Clouds
• Chip Market to Go Down, says Future Horizons
• Linaro Announces LITE - Collaborative Software Engineering for the Internet of Things (IoT)
• Linaro Announces First Development Board Compliant with 96Boards IoT Edition Specification
• NXP Introduces Industry's Lowest Power Arm Cortex-A7 Based Processor to Fuel Growth of the Internet of Things
• Amazing improvement of power and density for RFID chips with standard cell libraries at 180 nm from Dolphin Integration
• DCAN FD, A Configurable CAN Bus Controller with Flexible Data-Rate Targets Autonomous Cars & ADAS Systems

Friday, September 23, 2016

• eMemory Receives TSMC IP Partner Award

Thursday, September 22, 2016

• eMemory Receives TSMC IP Partner Award

Thursday, September 22, 2016

• 2016 a Sequel to Last Year's M&A Mania

Thursday, September 22, 2016

• Acacia Subsidiary Acquires Additional Patents from Renesas Electronics Corporation

Thursday, September 22, 2016

• Cortus appoints Philippe Descamps as Director Worldwide Sales

Wednesday, September 21, 2016

• How to build an IoT irrigation system with MIPS based Creator Ci40 IoT-in-a-box
• TSMC Expands its 3D Menu
• Shanhai Capital to Acquire Analogix Semiconductor
• TSMC and Synopsys Collaboration Delivers Innovative Technologies for the High Performance Compute (HPC) Platform
• Cadence and TSMC Advance 7nm FinFET Designs for Mobile and HPC Platforms
• Analog Bits to deliver two presentations on 16nm IP at TSMC Open Innovation Platform Ecosystem Forum
• Brite Semiconductor Settled in Hefei to Jointly Build an IC Industrial Park
• Arm reveals R52 core for 'highest functional safety standards'
• PLDA Announces a Full Set of Solutions to Immediately Enable PCIe 4.0 Design Success

Tuesday, September 20, 2016

• Cadence Delivers Integrated System Design Solution for TSMC InFO Packaging Technology
• Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum
• Synopsys and TSMC Collaborate to Certify Custom Compiler for 16FFC Process
• Synopsys Foundation IP Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements for TSMC 16FFC and 28HPC+ Processes

Tuesday, September 20, 2016

• Lattice Semiconductor Expands Automotive Product Portfolio With Addition of ECP5 and CrossLink Programmable Devices

Tuesday, September 20, 2016

• UltraSoC supports RISC-V: "the Linux of the semiconductor industry"

Tuesday, September 20, 2016

• Rambus Announces New Chief Financial Officer

Monday, September 19, 2016

• Eurotech presents new products for Rolling Stock at Innotrans 2016
• Securing the Industrial Internet of Things
• iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
• INSIDE Secure completes the sale of its semiconductor business to Swiss cybersecurity expert WISeKey
• Intel teams with UK web company for industrial IoT
• Wind River integrates VxWorks with IBM?s Watson IoT service
• Real Intent Sets a New Benchmark in Early Verification of Digital Designs with Release 2016.A of Ascent Lint
• UltraSoC supports RISC-V: the Linux of the semiconductor industry
• Emerging Memories: Ship First, Perfect Later
• Cadence Delivers IP for Automotive Applications with TSMC's Advanced 16nm FinFET C Process
• Arteris FlexNoC IP and FlexNoC Resilience Package Licensed by Toshiba for Advanced Driver Assistance Systems (ADAS)
• Cambium Networks choses FlexSwitch IP for their PTP 700 platform
• M31 Technology Develops Complete MIPI PHY Solution Targeting Mobile Device Market
• Arm enables autonomous vehicles with its most advanced safety processor
• Synopsys Delivers Complete DesignWare Bluetooth Low Energy IP Solution with Link Layer and PHY on TSMC 40ULP Process for IoT SoCs
• iPhone 7 Sports Intel, TSMC
• 円星科技推出完整MIPI物理层IP解决方案 进军行动装置应用市场

Sunday, September 18, 2016

• ON Semiconductor Successfully Completes Acquisition of Fairchild Semiconductor for $2.4 Billion in Cash
• IoT development kits come with Arm or Atom
• IoT Design 2016: Smart buildings, privacy and trust
• Cadence Delivers Rapid Adoption Kit for Fast Implementation and Signoff of New Arm Cortex-R52 CPU
• Synopsys Accelerates Development of Safety-Critical Products with Design Solutions for Arm Cortex-R52
• Arm Raises Bar for Safety, Determinism
• TSMC Certifies Synopsys IC Compiler II for the Most Advanced 7-nm Process Node Enabling Early Tapeouts
• Synopsys and TSMC Collaborate on Development of Interface and Foundation IP for 7-nm FinFET Process
• Credo Demonstrates Single-Lane 112G and 56G PAM-4 SerDes IP at TSMC OIP Forum
• Cache Controller Core from CAST Augments Cache-Less 32-bit Processors

Friday, September 16, 2016

• Most embedded to become IoT

Friday, September 16, 2016

• North American Semiconductor Equipment Industry Posts August 2016 Book-to-Bill Ratio of 1.03

Thursday, September 15, 2016

• Asia-Pacific To Top 2016 Regional IC Sales In Major System Categories

Wednesday, September 14, 2016

• CEVA and AdasWorks to Demonstrate Free Space Detection for Autonomous Driving at AutoSens Conference 2016
• GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX Platform
• GLOBALFOUNDRIES to Deliver Industry's Leading-Performance Offering of 7nm FinFET Technology
• Inova Semiconductors licenses APIX3 to Socionext
• Chevin Technology releases 25G Ultra Low Latency MAC/PCS for Xilinx Virtex UltraScale FPGAs
• Linde Starts Specialty Gases R&D in Taiwan
• Green Hills Software to Showcase Its Technology for Automotive Electronics Solutions at the SAE 2016 Convergence Conference
• IoT platforms target proprietary smart building systems