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Friday, July 15, 2016

• NXP warns cryptographic keys can be hacked

Friday, July 15, 2016

• TSMC to Adopt Extreme Ultraviolet at 5nm

Friday, July 15, 2016

• TSMC Reports Second Quarter EPS of NT$2.80

Thursday, July 14, 2016

• IEC Formally Adopts USB Type-C, USB Power Delivery and USB 3.1 Specifications

Thursday, July 14, 2016

• TetraMAX II Shortens Test Pattern Generation From Days to Hours

Wednesday, July 13, 2016

• Infineon to buy Cree's Wolfspeed SiC business
• FinFET Startup Seeks Partners for Collaboration
• The DTPCI32DC - Dual Clock 32bit PCI Bus Target Interface from Digital Core Design

Wednesday, July 13, 2016

• Chip Equipment Spending SEMI Forecasts: Flat 2016, Rebound in 2017

Tuesday, July 12, 2016

• Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications
• Boeing Licenses Rambus DPA Countermeasures to Protect Critical Aerospace and Defense Systems from Security Threats
• eMemory's NeoEE Solution Facilitates Module Integration for Fingerprint Applications
• IC manufacturing equipment market will grow 1%
• Leti Develops 3d Network-On-Chip to Improve High-Performance Computing

Tuesday, July 12, 2016

• Huaxintong Semiconductor licenses ARMv8-A architecture

Monday, July 11, 2016

• Huaxintong Semiconductor licenses Armv8-A architectur
• prpl Foundation Unveils the First Open Source Hypervisor for the Internet of Things
• TetraMAX II Shortens Test Pattern Generation From Days to Hours
• Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications
• Synopsys TetraMAX II ATPG Certified for ISO 26262 Automotive Functional Safety
• SST Announces Qualification of Embedded SuperFlash on GLOBALFOUNDRIES' BCDLite Process
• Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
• IP-Maker to release NVMe PCIe Gen 3 reference design
• Mentor creates cloud community for PCB designers
• Microchip to boost 8bit AVR range following acquisition
• Leti Plans Startup Accelerator
• Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design
• FPGA Prototyping Becomes Even More Precise with Latest Additions to S2C's World-Class Prodigy Prototype Ready Interface Library
• Why the IoT depends on analog technology
• IoT Innovation in the Spotlight as prpl Foundation Continues to Grow
• Application of MIPI specifications for interconnecting components in IoT SoCs
• Chips&Media launches 2nd generation High Performance Google's VP9 and HEVC Multi-format Decoder IP

Monday, July 11, 2016

• TSMC June 2016 Revenue Report

Monday, July 11, 2016

• IBM, Samsung Put New Spin on MRAM

Monday, July 11, 2016

• Startup Looks to Put PAs on CMOS Express

Sunday, July 10, 2016

• Ex-Broadcom Unit to Shape Cypress IoT Future
• ST Grows STM32 MCU Family
• IoT startups begin London bootcamp programme
• SiFive Introduces Industry's First Open-Source Chip Platforms
• Renesas Adopts Cadence Interconnect Workbench to Accelerate Performance Analysis and Verification of On-Chip Interconnect
• Imec and Arm collaborate on Design-Technology Co-Optimization for 7nm technology and beyond
• Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes
• Global Semiconductor Sales Up Slightly in May
• AppliedMicro Adopting TSMC 7nm FinFET Process Technology

Friday, July 8, 2016

• IC Insights Lowers Its 2016 Semiconductor Market Forecast to -1%

Thursday, July 7, 2016

• Why Networks Need ASICs

Thursday, July 7, 2016

• Open-Silicon to Showcase Breadth of ASIC Solutions at CDNLive 2016, Bangalore, India

Thursday, July 7, 2016

• Faraday Monthly Sales Report -June 2016

Thursday, July 7, 2016

• UMC Reports Sales for June 2016

Wednesday, July 6, 2016

• Glasgow adds geo-location to LoRa IoT network trial
• Open-Silicon to Showcase Breadth of ASIC Solutions
• Cypress completes Broadcom wireless IoT acquisition
• Emerging Universal FPGA, GPU Platform for Deep Learning

Wednesday, July 6, 2016

• Imagination Technologies: Full Year Results Statement FY2015-16

Wednesday, July 6, 2016

• Synopsys Platform Architect MCO Delivers Industry's First Power-Aware Architecture Analysis Tool Supporting IEEE 1801-2015 UPF 3.0

Tuesday, July 5, 2016

• Glasgow pioneers IoT connectivity
• InterDigital and Arup Collaborate to Make Connected Smart Cities a Reality
• Google to acquire image-recognition startup Moodstocks
• S2C PRODIGY Player Pro 6.3 advance FPGA Prototyping with Progressive Design Partition and Multi-FPGA Debug Capabilities
• Elolane launches Sigfox Reference Design Module for M2M and IoT Market
• Cadence Announces Global Tensilica Design Contest for Processor Optimization
• Synopsys' New HAPS Adaptor for Juno Arm Development Platform Accelerates Software Bring-up
• How to Create a Working IoT Sensor in One Month

Tuesday, July 5, 2016

• PLDA Announces its Newest Expansion with the Launch of PLDA Training, a Full Training Program that Provides Easy-to-access Design Methodologies for SoC, Board and Low-level Software Designs

Tuesday, July 5, 2016

• GUC Monthly Sales Report - June 2016

Tuesday, July 5, 2016

• Barefoot Networks Unveils Breakthrough Switching Technology: the World's First Fully Programmable Switches That Also Happen to Be the Fastest Switches Ever Built

Monday, July 4, 2016

• IoT reference design brings Arm and open source tools to Sigfox nodes
• Lossy Imagination Says There's Good Signs in Graphics
• Synopsys Buys Glasgow EDA Startup
• Cypress Now the Leading Internet of Things Supplier with Acquisition of Broadcom's Wireless IoT Businiss
• FinScale's Program to Accelerate Semiconductor Technology Breakthroughs
• Global Semiconductor Sales Up Slightly in May

Sunday, July 3, 2016

• FPGAs solve IoT implementation issues around power efficiency, interfaces and processors
• FPGAs solve challenges at the core of IoT implementation