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Thursday, June 16, 2016

• Small footprint open source hypervisor makes highly efficient use of hardware virtualization technology in Imagination's MIPS CPUs

Thursday, June 16, 2016

• Cavium to Acquire QLogic

Thursday, June 16, 2016

• IP Business Should Learn from EDA's Playbook

Wednesday, June 15, 2016

• China to Dominate Fab Building
• Intel, CEA Team on IoT Research
• Imagination increases security on MIPS processors
• CEVA Welcomes the Introduction of Bluetooth 5, the Next-Generation Bluetooth Standard
• Sondrel Announced as Arm Approved Design Partner at DAC 2016
• Brite Semiconductor and Power Line Communication Leader, Semitech Semiconductor, Collaborate on Industrial M2M SoC

Wednesday, June 15, 2016

• Arastu Systems' DFI 3.1 compatible and validated DDR4 Controller Core for increased system performance and reliability

Tuesday, June 14, 2016

• Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices
• NXP gets regulatory approval for RF Power sale
• 100 US cities covered by Senet LoRa network for IoT
• Imagination and Intrinsic-ID collaborate on solutions for scalable, flexible and affordable IoT hardware security
• Updated: Micro-sequencing crams 8051 into tiny FPGA space
• Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices
• Discover the STM32 with a free 32-bit Cortex-M0/0+ MCU Professional Developer's Package
• SoC Solutions selected as Arm Approved Design Partner

Tuesday, June 14, 2016

• Andes Technology Corporation Announces a Design Win in ITE Tech. Inc. IT835X Series Sensor Hub Chips Targeting the High Growth Wearable & IOT Market

Tuesday, June 14, 2016

• SILKAN Selected by DANAM Systems as ARINC664-Part 7 and Ethernet IP supplier For military and civil helicopters

Monday, June 13, 2016

• Printing IoT security
• NXP Sells Biz Unit to China, Downsizes 25%
• STMicroelectronics Seeks Revival
• Ireland is Sigfox-enabled for IoT
• STMicroelectronics Simplifies Design-In of State-of-the-Art Security for the IoT
• Nokia announces horizontal IoT platform called Impact
• OmniShield brings security by isolation to the automotive market
• Open source hypervisor exploits hardware virtualization in MIPS CPUs
• MIPI Alliance Welcomes Synopsys as a Promoter Member
• On semiconductor extends offer to acquire Fairchild semiconductor
• Apple Expands in AI, Smart Home
• Silvaco Enters IP Market With Acquisition of IPextreme
• Rambus to Acquire Snowbush IP Assets
• Why Cypress Semiconductor Corp. Gained 18% in May
• PLDA and M31 Announce a Compliant PCI Express 3.0 Solution Including PLDA's XpressRICH3 Controller and M31's PHY IP for the TSMC 28HPC+ Process Node at 8 GT/s

Monday, June 13, 2016

• IPhone Deal Would Boost Intel

Monday, June 13, 2016

• NVM Express over Fabrics Specification Released

Sunday, June 12, 2016

• Alma Technologies Discontinues Partnership with Cast
• Embedded System Market worth USD 258 Billion by 2023: Global Market Insights, Inc.
• Python's role in developing real time embedded systems
• SILKAN Selected by DANAM Systems as ARINC664-Part 7 and Ethernet IP supplier For military and civil helicopters
• NXP Semiconductors to Sell Standard Products Unit for $2.75 Billion
• Open-Silicon Selected for Arm Approved Design Partner Program

Thursday, June 9, 2016

• Open source hypervisor runs multiple OS in IoT designs

Thursday, June 9, 2016

• VESA Develops Early Certification Program for USB Type-C Devices Using DisplayPort Alt Mode

Thursday, June 9, 2016

• TSMC May 2016 Revenue Report

Wednesday, June 8, 2016

• Inuitive Licenses Ceva Processor
• Xylon Announces Latest Release of the logiADAK Kit for Vision-Based ADAS
• Allegro DVT Reconfirms Industry Leadership in Compliance Streams, Extends Its HEVC Test Suites
• NXP Selects Synopsys As Primary SoC Verification Solution
• Taiwan foundries have strong May revenues
• RFEL wideband core IP adopted for Ultra Channeliser

Wednesday, June 8, 2016

• Global Semiconductor Sales Decrease in April; Annual Sales Projected to Dip Slightly in 2016, Rebound in 2017, 2018

Wednesday, June 8, 2016

• UMC Reports Sales for May 2016

Tuesday, June 7, 2016

• Leading Russian semiconductor foundry Angstrem-T has developed a design using a Cortus APS core
• Xilinx Extends SDSoC Development Environment, Enabling Software Defined Programming of the 16nm Zynq Ultrascale+ MPSoC
• Arm Announces POP IP for Arm Cortex-A73 on TSMC 16FFC Process
• Synopsys' New Suite of DDR4 IP Features Increases Capacity and Reliability of High-Performance Cloud Computing Systems
• Cadence - Collaboration with Arm accelerates custom SoC
• Qualcomm launches reference platform for the connected car
• SMIC and Synopsys Deliver 28-nm HKMG Low-Power Reference Flow
• Artosyn selects Chips&Media HEVC/H.265 Codec IP for Drone, Robots, AR, VR etc.

Tuesday, June 7, 2016

• Truechip adds a new customer for PCIe Verification Solution

Tuesday, June 7, 2016

• Icron Technologies Announces New Maverick Extension Platform Featuring ExtremeUSB 2.0 and 3.0 with intoPIX TICO UHD Video over Single Cable at InfoComm 2016

Tuesday, June 7, 2016

• Menta Delivers Industry's Highest Performing Embedded Programmable Logic IP for SoCs

Tuesday, June 7, 2016

• CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor

Monday, June 6, 2016

• Andes Technology Corporation Announces Quick-Start Design Package That Significantly Reduces Time to Market of SoC Designs
• LoRa module extends range of IoT wireless links
• Avery Design Systems Announces SimXACT 3.0 for Improved X-Verification
• Intel Custom Foundry Certifies Mentor Graphics Physical Verification and Circuit Simulation Tools for 10nm Tri-Gate Process
• Intento Enters EDA Market with Software that Accelerates Analog and Mixed-Signal Design, Enables IP Re-Use Through Technology Migration
• eInfochips Joins Arm Approved Design Partner Program as a Founding Member
• Arm Announces Solutions for Custom SoC Development
• Truechip adds a new customer for PCIe Verification Solution
• CAST Licenses GZIP Core to Tier 1 Wireless Chipset Vendor
• Icron Technologies Announces New Maverick Extension Platform Featuring ExtremeUSB 2.0 and 3.0 with intoPIX TICO UHD Video over Single Cable at InfoComm 2016
• Arastu Systems' DFI 3.1 compatible and validated DDR4 Controller Core for increased system performance and reliability
• Menta Delivers Industry's Highest Performing Embedded Programmable Logic IP for SoCs
• Cadence and SMIC Collaborate on Delivery of Low-Power 28nm Digital Design Reference Flow

Monday, June 6, 2016

• ARM-Based Server Processors Finally Hitting Stride

Monday, June 6, 2016

• PLDA to Showcase its Extensive PCIe Ecosystem During DAC 2016, Providing the Broadest Node Solutions for Optimized Power, Area and Signal Integrity

Monday, June 6, 2016

• Former NASA Chief Dan Goldin's Neural Computing Company, KnuEdge, Emerges From Stealth to Transform Real-World Human-Machine Interaction

Monday, June 6, 2016

• KnuEdge Accelerates Neural Computing With Introduction of KNUPATH LambdaFabric Processor Technology

Monday, June 6, 2016

• Open-Silicon to Present and Demonstrate at DAC 2016

Monday, June 6, 2016

• Codasip and CAST Collaboration Ships First Products to Customers

Monday, June 6, 2016

• GUC Monthly Sales Report - May 2016

Monday, June 6, 2016

• EnSilica and Micrium partner to port µC/OS-III RTOS to eSi-RISC processor cores

Monday, June 6, 2016

• CERTON to Provide RTCA/DO-254 COTS IP Functional Safety Certification Packages for Commercial and Military Aerospace Applications

Sunday, June 5, 2016

• SILICONGATE Presents the IoT Flexible Power Management Solution at the 53th DAC
• vestigating Cavium's ThunderX: The First Arm Server SoC With Ambition
• Arm expands DesignStart - 45 sample SoCs for $16k
• Arm provides 'simplified access' to EDA tools
• Imec, Holst Centre and Methods2Business Develop Complete Low-Power Wi-Fi HaLow Radio Solution for Internet of Things (IoT) Applications
• Arm Extends Solutions for Custom SoC development in Embedded and IoT Markets
• EnSilica and Micrium partner to port uC/OS-III RTOS to eSi-RISC processor cores
• Fraunhofer IIS/EAS and SilabTech Announces Best in Class 2.5D Based Chip-to-Chip Interconnect Solution
• Arasan Announces DPHY IP Core @2.5Gbps per lane with TSMC 28nm HPC Process
• Ultrasoc, Sondrel team up on debug IP
• Rambus to Pay $32.5M for Semtech?s IP Biz
• EnSilica, Micrium Partners on RTOS/MCU Integration
• Cadence Expands Collaboration with Arm to Accelerate Custom SoC and IoT System Designs with Industry's First End-to-End Hosted Design Solution
• Arm expands DesignStart - 45 sample SoCs for $16k
• CEVA-XM4 vector vision processor IP powers vision SoC NU4000