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Tuesday, August 2, 2016

• PLDA GROUP announces tighter collaboration with Xilinx on Vivado HLS to enhance software programmability of Xilinx FPGAs in QuickPlay.

Monday, August 1, 2016

• Intel SoC FPGA Developer Forum: ReFLEX CES Showcases Arria10 SoC FPGA Cards and OpenCL Solutions
• China's IC Industry: 'Don't Let World Bully Us
• PLDA GROUP announces tighter collaboration with Xilinx on Vivado HLS to enhance software programmability of Xilinx FPGAs in QuickPlay
• Global Semiconductor Sales Increase in Second Quarter
• SIGFOX and UnaBiz Anchor French and Taiwanese Collaboration on Global Internet of Things Testbed
• GainSpan Announces Low-Power, Apple HomeKit Reference Design for Wi-Fi-Enabled Smart Home Accessories
• Semtech LoRa® RF Technology for IoT Used in Compact Wireless Module from Murata
• What the 40nm node means for the instrument cluster
• MIPI Alliance Gives Members First Access to MIPI I3C Interface Specification for Sensor Applications
• Cadence Delivers Industry's First Design and Verification IP for MIPI SoundWire v1.1 High Quality Audio Solutions
• Socionext Bleeds Top Network SoC Talent to Acacia

Monday, August 1, 2016

• Pierre Lamond Joins Flex Logix's Board of Directors

Monday, August 1, 2016

• UMC Qualifies 0.18um BCD Process for Most Stringent AEC-Q100 Grade-0 Automotive ICs

Sunday, July 31, 2016

• PLDA and Epostar to Demonstrate New PCIe/NVMe Solution, Delivering the Increased Throughput and Decreased Latency Required for Today's PCIe SSD Storage Applications
• Arm expands IoT security team in Israel
• Faraday Receives ISO9001: 2015 Plus Award, Proving the High Quality of its Design Service for Customers
• Synopsys' New Model for Infineon's Next Generation TriCore Architecture Accelerates Early Automotive Software Development and Test

Friday, July 29, 2016

• Will Semi Industry Consolidation Hurt Innovation, R&D Spending?

Thursday, July 28, 2016

• STMicroelectronics Acquires ams' NFC and RFID Reader Assets
• SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology
• Hardent Launches New DisplayPort 1.4 Forward Error Correction IP Cores

Thursday, July 28, 2016

• Xilinx Announces First Quarter 2017 Results; Advanced Products Grow 60% Y-T-Y, Strong Profitability

Wednesday, July 27, 2016

• China Likely to Give Birth to a Semiconductor Giant

Wednesday, July 27, 2016

• ARM Holdings plc Reports Results for the Second Quarter 2016

Wednesday, July 27, 2016

• Rambus Announces Silicon-proven R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP Process for Networking and Data Center Applications

Tuesday, July 26, 2016

• SST and SilTerra Announce Production Readiness of Embedded SuperFlash Macros on SilTerra's 180 nm CMOS Platform

Tuesday, July 26, 2016

• Arm Achieves Another Successful Quarter
• STMicroelectronics Returns to Profit in Q2
• China's Final Chance to Achieve Its IC Industry Ambitions Now Underway
• Acromag's New AcroPack™ I/O Platform adds a Reconfigurable Xilinx Artix-7 FPGA for Custom Computing Applications
• FPGA Mezzanine Card + IP Forms Imaging/Video Engine
• FPGA Manager IP Eases Data Streaming
• UMC Sees Jump in 28nm Demand
• MicroEJ Accelerates the Creation of IoT Software for Arm Cortex-M and Cortex-A Processors
• Synopsys Delivers Industry's First Verification IP for Ethernet 200G
• Apply Deep Learning to Building-Automation IoT Sensors
• GE Supplies IoT Developer Kit For Predix

Tuesday, July 26, 2016

• Open-Silicon Strengthens Management Team With Key Executive Appointments

Tuesday, July 26, 2016

• ams acquires MAZeT

Tuesday, July 26, 2016

• Kandou's Glasswing IP JEDEC Compliant

Tuesday, July 26, 2016

• eMemory Announces Comprehensive NVM Solution in 0.13um BCD Process for PMIC Applications

Tuesday, July 26, 2016

• IP Pioneer Mark Templeton Dies

Tuesday, July 26, 2016

• Cadence Reports Second Quarter 2016 Financial Results

Monday, July 25, 2016

• Bessemer Venture Partners Invests $15 Million in Kandou
• Analog Devices and Linear Technology to Combine Creating the Premier Analog Technology Company
• What Separates Huawei from Ericsson
• FDSOI to Get Embedded MRAM, Flash Options at 28nm
• Cadence Launches Tensilica Fusion G3 DSP Featuring Exceptional Out-of-the-Box Performance for Compute-Intensive Signal Processing Applications
• Active bridge improves PoE-based IoT performance
• Developer kit accelerates IoT sensing connectivity

Monday, July 25, 2016

• Kazan Networks Closes $4.5M Series A Funding Round

Monday, July 25, 2016

• Save up to 20 % of silicon area with Dolphin Integration's standard cell library SESAME uHD

Monday, July 25, 2016

• BaySand to Initiate a Unique Low Cost Multi Project Wafer (MPW) Program That Redefines the Silicon Shuttle Concept

Sunday, July 24, 2016

• GLOBALFOUNDRIES Appoints Wallace Pai as General Manager to Oversee China Business Development
• Startup's IoT SoC Packs a Punch
• SafeZone IoT Security Framework from INSIDE Secure delivers an integrated suite of products that addresses the broad spectrum of critical IoT security needs

Friday, July 22, 2016

• Brexit, Techxit?

Thursday, July 21, 2016

• Arm acquisition by SoftBank - is it good or bad for the UK and the electronics industry?
• SoftBank/Arm Deal: Political Hurdles Ahead?
• OTOY and Imagination unveil breakthrough PowerVR Ray Tracing hardware platform for cinematic real time rendering
• Qualcomm's China Compromise Pays Off

Thursday, July 21, 2016

• PrimeTime Smart ECO Technology Cuts Compute Costs by 10X

Thursday, July 21, 2016

• Gartner Says Worldwide Semiconductor Capital Spending to Decline 0.7 Percent in 2016

Wednesday, July 20, 2016

• Versatile FPGA IP Handing, Creation, and Packaging
• Arm aims to build trust in IoT security
• Arm, Softbank and 1,500 Engineers
• Huawei and General Electric partner on industrial IoT
• GPS-free geolocation solution for IoT
• BlackBerry hacks a kettle to demonstrate IoT security strain
• Taiwan Semiconductor Mfg. Co. Ltd. Reportedly Wins Apple Inc. A11
• RFEL supplies core for Arizona Radio Observatory