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Tuesday, July 19, 2016

• Rambus Reports Second Quarter Results

Monday, July 18, 2016

• Test and Verification Solutions expands its operations in Silicon Valley, USA
• Arm Acquisition: What's In It for SoftBank?
• If not Arm, which architecture next for IoT
• Synopsys' IC Validator Certified by TowerJazz for Signoff Physical Verification

Monday, July 18, 2016

• ARM-SoftBank: Selling at Top or Buying at Bottom?

Monday, July 18, 2016

• Why SoftBank Is Spending $32 Billion on ARM

Monday, July 18, 2016

• ARM at the Heart of the Industrial Internet of Things

Sunday, July 17, 2016

• Sizing up the IoT, IoE and connected devices market
• Arm Agrees To Be Bought by Japan's Softbank
• Comment: IoT made Arm takeover inevitable
• Cypress Aims Low-Pin Memory at Automotive, IoT
• MIPS virtualization brings secure isolation to deeply embedded applications
• Ceva unveils IP for first 5G smartphone chips
• Recommended acquisition of Arm by SoftBank
• ParkerVision Enters into Patent License and Settlement Agreement with Samsung
• Rambus CryptoMedia Security Platform Will Protect Pay TV Content for DishTV India
• CEVA to Unveil its CEVA-X2 DSP at the Linley Mobile & Wearable Conference 2016

Friday, July 15, 2016

• NXP warns cryptographic keys can be hacked

Friday, July 15, 2016

• TSMC to Adopt Extreme Ultraviolet at 5nm

Friday, July 15, 2016

• TSMC Reports Second Quarter EPS of NT$2.80

Thursday, July 14, 2016

• IEC Formally Adopts USB Type-C, USB Power Delivery and USB 3.1 Specifications

Thursday, July 14, 2016

• TetraMAX II Shortens Test Pattern Generation From Days to Hours

Wednesday, July 13, 2016

• Infineon to buy Cree's Wolfspeed SiC business
• FinFET Startup Seeks Partners for Collaboration
• The DTPCI32DC - Dual Clock 32bit PCI Bus Target Interface from Digital Core Design

Wednesday, July 13, 2016

• Chip Equipment Spending SEMI Forecasts: Flat 2016, Rebound in 2017

Tuesday, July 12, 2016

• Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications
• Boeing Licenses Rambus DPA Countermeasures to Protect Critical Aerospace and Defense Systems from Security Threats
• eMemory's NeoEE Solution Facilitates Module Integration for Fingerprint Applications
• IC manufacturing equipment market will grow 1%
• Leti Develops 3d Network-On-Chip to Improve High-Performance Computing

Tuesday, July 12, 2016

• Huaxintong Semiconductor licenses ARMv8-A architecture

Monday, July 11, 2016

• Huaxintong Semiconductor licenses Armv8-A architectur
• prpl Foundation Unveils the First Open Source Hypervisor for the Internet of Things
• TetraMAX II Shortens Test Pattern Generation From Days to Hours
• Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications
• Synopsys TetraMAX II ATPG Certified for ISO 26262 Automotive Functional Safety
• SST Announces Qualification of Embedded SuperFlash on GLOBALFOUNDRIES' BCDLite Process
• Intel Custom Foundry Certifies Cadence Implementation and Signoff Tools for 10nm Tri-Gate Process
• IP-Maker to release NVMe PCIe Gen 3 reference design
• Mentor creates cloud community for PCB designers
• Microchip to boost 8bit AVR range following acquisition
• Leti Plans Startup Accelerator
• Toshiba Plans Deployment of Synopsys TetraMAX II on Upcoming SoC Design
• FPGA Prototyping Becomes Even More Precise with Latest Additions to S2C's World-Class Prodigy Prototype Ready Interface Library
• Why the IoT depends on analog technology
• IoT Innovation in the Spotlight as prpl Foundation Continues to Grow
• Application of MIPI specifications for interconnecting components in IoT SoCs
• Chips&Media launches 2nd generation High Performance Google's VP9 and HEVC Multi-format Decoder IP

Monday, July 11, 2016

• TSMC June 2016 Revenue Report

Monday, July 11, 2016

• IBM, Samsung Put New Spin on MRAM

Monday, July 11, 2016

• Startup Looks to Put PAs on CMOS Express

Sunday, July 10, 2016

• Ex-Broadcom Unit to Shape Cypress IoT Future
• ST Grows STM32 MCU Family
• IoT startups begin London bootcamp programme
• SiFive Introduces Industry's First Open-Source Chip Platforms
• Renesas Adopts Cadence Interconnect Workbench to Accelerate Performance Analysis and Verification of On-Chip Interconnect
• Imec and Arm collaborate on Design-Technology Co-Optimization for 7nm technology and beyond
• Imec and Synopsys Collaborate on Interconnect Resistivity Model to Enable Early Screening of Interconnect Technology Options at Advanced Nodes
• Global Semiconductor Sales Up Slightly in May
• AppliedMicro Adopting TSMC 7nm FinFET Process Technology

Friday, July 8, 2016

• IC Insights Lowers Its 2016 Semiconductor Market Forecast to -1%

Thursday, July 7, 2016

• Why Networks Need ASICs

Thursday, July 7, 2016

• Open-Silicon to Showcase Breadth of ASIC Solutions at CDNLive 2016, Bangalore, India

Thursday, July 7, 2016

• Faraday Monthly Sales Report -June 2016

Thursday, July 7, 2016

• UMC Reports Sales for June 2016

Wednesday, July 6, 2016

• Glasgow adds geo-location to LoRa IoT network trial
• Open-Silicon to Showcase Breadth of ASIC Solutions
• Cypress completes Broadcom wireless IoT acquisition
• Emerging Universal FPGA, GPU Platform for Deep Learning