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Thursday, May 19, 2016

• ARM Drives the Future of Premium Mobile Computing with a Multicore Test Chip based on 10FinFET from TSMC

Thursday, May 19, 2016

• Synopsys' Custom Compiler Enabled for Samsung Foundry's 14-nm FinFET Process

Thursday, May 19, 2016

• Imagination accelerates Debian development for 64-bit MIPS CPUs

Thursday, May 19, 2016

• Sivers IMA signs agreement with Blu Wireless Technology

Wednesday, May 18, 2016

• ANSYS Introduces First Big Data and Machine Learning System for Engineering Simulation
• Microsemi Announces RTG4 PROTO FPGAs to Enable Lower Cost Prototyping and Design Validation for High-Speed Radiation-Tolerant FPGAs
• INSIDE Secure to sell its semiconductor business to Swiss cybersecurity expert WISeKey
• Fujitsu and BAE Systems enter into a cybersecurity partnership
• Intel selects Mercury Systems to join FPGA tech-based network

Wednesday, May 18, 2016

• M31 Technology Develops a Complete Set of New-Generation High-Performance USB IP solutions

Tuesday, May 17, 2016

• 円星科技完整佈局新一代高效能USB矽智財解決方案
• Experts find IoT security lacking
• Nokia's brand goes to startup with $500M plan
• Security startups strive on IoT, attract venture capital
• CEA expands collaboration with Intel in wireless and IoT
• Arm multi-core v8 test chip fabbed on TSMC 10nm finfet process
• Imagination goes with Debian OS for MIPS64 processors
• Mobileye, ST to develop autonomous driving SoC
• Arm Acquires Apical - a Global Leader in Imaging and Embedded Computer Vision

Tuesday, May 17, 2016

• Xilinx Appoints Saar Gillai, Ron Jankov, and Tom Lee to its Board of Directors

Tuesday, May 17, 2016

• Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle

Monday, May 16, 2016

• UltraSOC refines tool suite
• Arteris Redefines Heterogeneous Multicore Cache Coherency with Configurable, Distributed Semiconductor Architecture
• The World's Best Multiplexer
• S2C Shares Expert FPGA Prototyping Knowledge at 2016 Design Automation Conference
• Synopsys Completes Acquisition of Simpleware
• Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet Ethernet Packet Generators
• Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle
• Aldec Extends Spectrum of Verification Tools for Use in Digital ASIC Designs
• Latest Synopsys IC Compiler II Release Boosts Quality-of-Results for Performance-Critical Designs
• New Layers Form within the Cloud

Monday, May 16, 2016

• Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays

Monday, May 16, 2016

• Five Months into the Year and Market Finally Reaching Bottom; IDC Forecasts Worldwide Semiconductor Revenue Still to Fall 2.3% to $324 Billion

Monday, May 16, 2016

• UltraSoC announces significant product update, improved support for analytics and "any CPU" capability

Sunday, May 15, 2016

• Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs
• Xilinx Board Of Directors Increases Repurchase Authorization By $1 Billion
• Lattice bridge IC brings mobile display interfaces to industrial apps
• NEWRACOM to exhibit top-notch Wi-Fi and Bluetooth technologies for mobile, IoT, and M2M connected consumer devices at COMPUTEX 2016 and DAC 2016
• First Quarter 2016 Silicon Wafer Shipments Increase Quarter-Over-Quarter
• Truechip announces first customer shipment of CPRI Comprehensive Verification IP (CVIP)

Friday, May 13, 2016

• Seven Top-20 1Q16 Semiconductor Suppliers Show Double-Digit Declines

Friday, May 13, 2016

• Open-Silicon CEO: Creating a legacy through traditional values

Thursday, May 12, 2016

• Moortec to exhibit at next week's TSMC China Technology Symposium

Thursday, May 12, 2016

• VORAGO Technologies Announces Availability of Industry's First ARM Cortex MCUs Built for Extreme Conditions

Thursday, May 12, 2016

• SMIC Reports 2016 First Quarter Results

Thursday, May 12, 2016

• CEO Interview: Andes' Cores For IoT Suit Europe

Wednesday, May 11, 2016

• Sidense Exhibiting Secure and Reliable 1T-OTP at TSMC 2016 China and Taiwan Symposiums
• VeriSilicon Supports the Connected Car by Joining Automotive Grade Linux
• Istuary Innovation Group Selects Agnisys IDesignSpec for Enterprise Storage Chips
• EC funds SMEs to develop cyber-physical systems for robotics and industry
• From catching up to forging ahead: China's new role in the semiconductor industry
• Samsung prepares for China attacks on semiconductor

Wednesday, May 11, 2016

• PowerVR GPUs from Imagination pass OpenVX conformance with Khronos

Wednesday, May 11, 2016

• High Performance HEVC decoder IP released by Chips&Media

Wednesday, May 11, 2016

• ARM University Program Introduces New Mobile Gaming Education Kit

Tuesday, May 10, 2016

• Analysis of Cypress Semiconductor acquisition of Broadcom wireless IoT assets
• Synopsys Expands Portfolio of ARC Processors for Safety-Critical Automotive Applications to Include DSP and Cache Support
• NXP takes No.1 auto IC slot
• ON Semiconductor Expands Low Power Wireless Solutions Portfolio with SIGFOX and Arm for Rapid IoT Deployment
• Arm University Program Introduces New Mobile Gaming Education Kit
• Algo-Logic Systems Launches FPGA Accelerated CME Tick-To-Trade System

Tuesday, May 10, 2016

• Synopsys Verification Solution Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard

Tuesday, May 10, 2016

• TSMC April 2016 Revenue Report

Monday, May 9, 2016

• 10 Favorite FPGA-Based Prototyping Boards
• Sigfox plans to build IoT networks in U.S. 100 cities this year
• FPGAs for the Masses?
• VORAGO Technologies Announces Availability of Industry?s First Arm Cortex MCUs Built for Extreme Conditions
• Imagination Inside Innovative Video Analytics Engine
• Synopsys Verification Solution Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard
• Cypress Adopts Cadence Digital Implementation and Circuit Simulation Tools for 40nm Automotive Designs
• Automotive Electronics System Demand Fails to Boost Automotive IC Market in 2015
• Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications
• Gartner Says Worldwide Semiconductor Capital Spending to Decline 2 Percent in 2016
• HDL Design House Appoints New Representative for Central Europe, Nordic Region and the US
• Design, Test & Repair Methodology for FinFET-Based Memories
• Addressing Three Critical Challenges of USB Type-C Implementation

Monday, May 9, 2016

• InvenSense and ARM Innovation Ecosystem Accelerator Partner to Advance China's IoT Industry

Monday, May 9, 2016

• UMC Reports Sales for April 2016

Sunday, May 8, 2016

• Smart cities are a mystery to most of us
• FinFET Technology Market by Technology, Product, End-User and Geography - Global Forecast to 2022
• RFEL adds Wideband capability to its award-winning ChannelCore Flex advanced channeliser IP core
• Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
• MagnaChip and YMC Expand Cost-Effective 0.18um Multiple-Time Programmable (MTP) Manufacturing Processes
• Tsinghua buys 3% of Imagination
• InvenSense and Arm Innovation Ecosystem Accelerator Partner to Advance China's IoT Industry
• Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software
• Why is NXP Moving to FD-SOI?
• EnSilica launches eSi-ECDSA cryptographic IP for standards-compliant automotive Car2x communications
• Credo 16-nm 28G and 56G PAM-4 SerDes Now Available on TSMC FinFET Compact Process