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Friday, October 7, 2016

• Startup Digs Deep Learning, Snags Big Backers

Friday, October 7, 2016

• GUC Monthly Sales Report - September 2016

Friday, October 7, 2016

• UMC Reports Sales for September 2016

Friday, October 7, 2016

• TSMC September 2016 Revenue Report

Thursday, October 6, 2016

• Google Does Consumer Electronics

Thursday, October 6, 2016

• EE Slashes CPU Design Cost

Thursday, October 6, 2016

• Ethernet Flexes Network Muscles

Thursday, October 6, 2016

• Ethernet Alliance Applauds Successful Completion of IEEE 802.3bz

Thursday, October 6, 2016

• Sony-Inside Huami Watch: Is It Time for FD-SOI?

Thursday, October 6, 2016

• OmniPhy Announces 1000Base-T1 "Gigabit" Automotive Ethernet Silicon IP Development

Wednesday, October 5, 2016

• SureCore SRAMs design-ready, says CEO
• INSIDE Secure and 6WIND partner to bring high-performance and scalability to the Cloud
• Open-Silicon Extends Long-Term Collaboration with Mentor Graphics Technologies for Custom SoC Design Success

Tuesday, October 4, 2016

• Nokia bolsters its base station power efficiency by acquiring Eta Devices
• NXP Pushes Hardware Isolation in i.MX8
• Accelerate SHA-3 Cryptographic Hash Processing with New Hardware IP Core
• Qualcomm Snapdragon 600E and 410E embedded/IoT processors available through distributors
• NXP Extends Secure Car Access Portfolio to Offer New Complete Passive Keyless Entry System
• NXP Doubles Its Portfolio of MagniV Microcontrollers Serving the Growing Global Automotive Motor Control Market
• VIA Labs VL716 USB 3.1 Gen 2 to SATA Bridge with Native USB-C Support Achieves USB-IF Certification
• Mentor Graphics, Northwest Logic, and Krivi Semiconductor Announce Availability of Complete DDR4 SDRAM IP Design and Verification Solution

Tuesday, October 4, 2016

• Asiczen Releases its CAN Verification IP

Monday, October 3, 2016

• Khronos Launches Dual Neural Network Standard Initiatives
• Mentor Graphics Announces 64-bit Armv8-A Support for the Nucleus Real-Time Operating System
• HMicro and STMicroelectronics Announce Wearable Wireless Biosensor Platform that Frees Patients from Cables
• TSMC Staffing R&D for 3nm Process
• STMicroelectronics Announces Timing for 3rd Quarter 2016 Earnings Release and Conference Call
• Arteris FlexNoC Resilience Package IP Licensed by STMicroelectronics
• HDL Design House Opens New Office in Thessaloniki, Greece

Monday, October 3, 2016

• Kilopass Appoints Sue Kim Vice President of Corporate Marketing

Monday, October 3, 2016

• Intrinsic-ID and Guardtime Announce Alliance on IOT Blockchain

Monday, October 3, 2016

• MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology

Monday, October 3, 2016

• Qualcomm, NXP Discuss Merger, Say Reports

Monday, October 3, 2016

• Open-Silicon to showcase ARM Cortex-M based IoT Custom SoC Platform at ARM TechCon

Monday, October 3, 2016

• CAST Introduces Low-Power, Ultra-HD Capable Video Compression Cores

Sunday, October 2, 2016

• Do Chip Designers Worry About the Impact of Power Consumption on Sustainability?
• IBM Invests to Lead Global Internet of Things Market -- Shows Accelerated Client Adoption
• Silicon Labs Acquires Leading RTOS Company Micrium for IoT
• Rambus Signs License Agreement With Xilinx

Friday, September 30, 2016

• INVECAS to Enable ASIC Designs for Tomorrow's Intelligent Systems on GLOBALFOUNDRIES' FDX Technology

Friday, September 30, 2016

• INSIDE Secure and Marvell Deliver Open Source Open Data Plane Security VPN Solution

Thursday, September 29, 2016

• NetSpeed Releases Gemini 3.0 Cache-Coherent NoC IP to Supercharge Heterogeneous SoC Designs

Thursday, September 29, 2016

• Arrow and Electric Imp spot big industrial IoT opportunity
• Altium Announces Major Update for TASKING VX-toolset for TriCore(tm) with Latest AURIX(tm) Technology
• X-FAB to Acquire Assets of Altis Semiconductor

Thursday, September 29, 2016

• Open-Silicon Tapes Out Industry's First High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in 16nm FF+

Thursday, September 29, 2016

• ESD Alliance Reports EDA Industry Revenue Increase For Q2 2016

Thursday, September 29, 2016

• INVECAS and GLOBALFOUNDRIES Announce Availability of Advanced 14nm FinFET Design IP Library for High-Performance Computing, Networking, and High-End Mobile Applications

Wednesday, September 28, 2016

• Via Expands LTE Patent Pool License Coverage to Include LTE-Advanced

Wednesday, September 28, 2016

• Spin Transfer Technologies Develops 20nm Magnetic Tunnel Junction MRAM Technology at On-site R&D Fab

Tuesday, September 27, 2016

• Leading-Edge Leads the Way in Pure-Play Foundry Growth
• <40nm processing drives foundry sales
• STMicroelectronics Reveals High-Efficiency Wireless Battery-Charging Chipset for Smaller, Simpler, Sealed Wearables
• Qualcomm Mobilizes in Embedded Processors
• Arm open source group address IoT software confusion
• Samsung Calls for New CPU Design
• Mesh Networking Module from Silicon Labs Simplifies Thread and ZigBee Connectivity
• Moortec Receives 2016 TSMC Open Innovation Platform Partner of the Year New IP Award

Tuesday, September 27, 2016

• Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum

Tuesday, September 27, 2016

• Analog Bits to deliver two presentations on 16nm IP at TSMC Open Innovation Platform Ecosystem Forum

Tuesday, September 27, 2016

• Kalray Works with Automobile Giants to put its MPPA Manycore Processor into Self-Driving Vehicles

Monday, September 26, 2016

• CEVA refines its Vision DSP
• iPhone 7, No Headphone Jack Creates a Recipe for e-Waste
• Arm System IP boosts SoC performance from edge to cloud
• Xilinx Extends its Cost-Optimized Portfolio Targeting a Wide Range of Applications Including Embedded Vision and Industrial IoT
• AMD Takes Embedded Applications to the Next Level With New GPUs
• Fifth-Generation CEVA Imaging & Vision Technology Simplifies Delivery of Powerful Deep Learning Solutions on Low-Power Embedded Devices
• Intrinsic-ID overall winner of EU 2016 Innovation Radar Prize
• Arteris FlexNoC Physical and FlexNoC Resilience Packages Licensed by Mobileye for Next-Generation Advanced Driver Assistance Systems (ADAS)
• Imagination licenses UltraSoC IP to deliver system-level debug and optimization capabilities for SoCs
• USB-IF Announces USB Audio Device Class 3.0 Specification
• Cadence Announces General Availability of Tensilica Xtensa LX7 Processor Architecture, Increasing Floating-Point Scalability with 2 to 64 FLOPS/Cycle
• TSMC Recognizes Synopsys with Three Partner Awards for Interface IP and Joint Development of 7-nm Mobile and HPC Design Platforms
• Cadence Recognized with Four TSMC Partner of the Year Awards

Monday, September 26, 2016

• NetSpeed systems featured in EE TIMES' Silicon 60: Emerging Companies to Watch

Monday, September 26, 2016

• Imagination 2.0 Update Ships

Monday, September 26, 2016

• Asiczen Releases its APB Verification IP

Monday, September 26, 2016

• Chip IP Biz & IC Industry M&As