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Friday, May 6, 2016

• Faraday Monthly Consolidated Sales Report - April 2016

Friday, May 6, 2016

• GUC Monthly Sales Report - April 2016

Thursday, May 5, 2016

• Samsung considers partnering with Chinese companies in semiconductors
• Analog, MEMS Drag On ST's Results
• OmniPHY Named One of 2016 20 Most Promising Semiconductor Companies by SiliconIndia

Wednesday, May 4, 2016

• A new architecture for consumer IoT applications

Wednesday, May 4, 2016

• eASIC Joins the OpenPOWER Foundation to Offer Custom-designed Accelerator Chips

Tuesday, May 3, 2016

• Faraday Reduces Packaging Design Time by 60 Percent Using Cadence OrbitIO Interconnect Designer and SiP Layout
• Texas Instruments Leads Industrial Semiconductor Vendor Share Ranking in 2015; Market Rises to $40.7 billion
• Creonic Participates in International SENDATE-TANDEM Research Project
• CMOS Image Sensors Expected To Set Record-High Sales for Another Five Years
• Faraday Showcases Virtual Platform Solution and 28nm IP at ChipEx 2016
• Chip Sales Edge Up Slightly

Monday, May 2, 2016

• High Performance HEVC decoder IP release by Chips&Media
• Semtech Announces the Industry's First Single Chip Hybrid PLC and LoRa Wireless Platform for Smart Grid, Smart Metering and IoT Applications
• Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices
• Russian mobile processor firm uses MIPS and PowerVR cores
• IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1-2016
• NetSpeed Systems expands presence in Taiwan through partnership with Maojet Technology
• Sonics Develops Industry's First Energy Processing Unit Based on the ICE-Grain Power Architecture
• New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies

Monday, May 2, 2016

• How Intel Missed the Smartphone Call

Monday, May 2, 2016

• Attopsemi Published a Paper in ICMTS 2016, Yokohama, Japan

Monday, May 2, 2016

• Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architecture

Monday, May 2, 2016

• Indian fabs, the free market and central planning

Monday, May 2, 2016

• CEVA, Inc. Announces First Quarter 2016 Financial Results

Monday, May 2, 2016

• BittWare and Atomic Rules announce an FPGA-based UDP Offload Engine IP Core for 10/25/50/100 GbE

Sunday, May 1, 2016

• MaxLinear Buys Microsemi's Broadband Wireless Unit
• Samsung cranks up third gen FinFET process
• Next-generation multi-platform video analytics SoC results from collaboration between Imagination and ELVEES
• Global Semiconductor Sales Increase Slightly in March
• Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
• Dongbu HiTek Provides Process Design Kits for Synopsys' Custom Compiler Solution
• Attopsemi Published a Paper in ICMTS 2016, Ultra-small and Ultra-reliable Innovative Fuse Scalable from 0.35um to 28nm
• Try and adopt Motu-Uta, the benchmark from Dolphin Integration for a fair evaluation of Standard Cell libraries
• Synopsys Delivers Next-Generation Verification IP for Micron's Hybrid Memory Cube Architectur

Thursday, April 28, 2016

• Intel to Exit Mobile SoC Business

Thursday, April 28, 2016

• Xilinx Shares Decline After Light Forecast

Thursday, April 28, 2016

• Xilinx Announces Fourth Quarter & Fiscal 2016 Results; Record 28nm & 20nm Sales, Dividend Raised For 11th Consecutive Year

Thursday, April 28, 2016

• UMC Reports First Quarter 2016 Results

Thursday, April 28, 2016

• Xilinx and IBM to Enable FPGA-Based Acceleration within SuperVessel OpenPOWER Development Cloud

Wednesday, April 27, 2016

• Cypress to Pay $550 Million for Broadcom's IoT Business
• Microsemi and Mercury Systems Announce Scheduled Closing for Microsemi's Sale of its Embedded Security, RF and Microwave, and Custom Microelectronics Businesses to Mercury
• Cypress to Acquire Broadcom's Wireless Internet of Things Business
• Cadence Completes Acquisition of Rocketick Technologies
• Altera's Design Solutions Network Connects Customers with Experts to Help Innovate With Their FPGA-Based Designs

Tuesday, April 26, 2016

• President Obama embraces IoT and Industrie 4.0
• NXP Bullish on Future With Freescale in Fold
• Pleora Brings High-Performance Imaging Expertise to NBASE-T Alliance
• UMC: Business to Bounce Back This Year
• Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset
• Apple Drove Entire Foundry Sales Increase at TSMC in 2015

Tuesday, April 26, 2016

• Cadence Reports First Quarter 2016 Financial Results

Monday, April 25, 2016

• Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT and Automotive Applications
• MACOM Initiates Legal Action Against Infineon Technologies Over Next-Generation Semiconductor Technology for 4G/LTE and 5G Networks
• RFEL launches new Fractional Rate Resampler IP core
• GCT Semiconductor Licenses Arteris FlexNoC Interconnect IP for LTE Digital Baseband Systems-on-Chip (SoCs)
• ANSYS Simulation Solutions Bolster Arm Energy-Efficient IP For Internet of Things and Cloud Servers

Monday, April 25, 2016

• MPEG LA Expands DisplayPort License Coverage

Monday, April 25, 2016

• China's Chip Patent Growth May Be Short Lived

Monday, April 25, 2016

• Toshiba Adopts Cadence Innovus Implementation System for Production Mobile Memory Controller Design

Monday, April 25, 2016

• Peraso Raises $20M Series C Financing Co-Led by Integrated Device Technology (IDT) and Roadmap Capital

Monday, April 25, 2016

• North American Semiconductor Equipment Industry Posts March 2016 Book-to-Bill Ratio of 1.15

Sunday, April 24, 2016

• MicroPnP IoT platform uses LTC SmartMesh networking IP
• AMD Licenses x86 To China
• Low-power of Bluetooth SoCs depends on Dolphin Integration's oscillators