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Thursday, April 21, 2016

• samsung foundry updates 7nm euv 10lpp and 14lpc
• Samsung Details Foundry Roadmap

Thursday, April 21, 2016

• DENSO, eSOL, and NEC Communication Systems Form Joint Venture To Enhance Development of In-vehicle Electronic Systems Software

Wednesday, April 20, 2016

• Billions of trainers tagged in "biggest" IoT deployment
• Rambus joins the RISC-V Foundation
• Alpha Data has partnered with Chevin Technology to support low latency 10G Ethernet and UDP offload IP on the ADM-PCIE-KU3 Accelerator board with Xilinx Kintex Ultrascale FPGA
• Combining Deeply Depleted Channel and near / sub-threshold technologies to reduce energy

Wednesday, April 20, 2016

• Intel Reorg Shows Clouds Ahead

Wednesday, April 20, 2016

• ARM Holdings plc Reports Results For the First Quarter 2016

Tuesday, April 19, 2016

• Shifting gears for the IoT
• Qualcomm Signs 3G/4G Chinese Patent License Agreement with Hisense
• Gartner: 10 Semiconductor Vendors With The Most Market Share In 2015
• Ams Breaks Ground on N.Y. Fab
• Comcores provide Flexible Ethernet Switch IP Design Optimized for switching in C-RAN and Next-Generation LTE Advanced Networking Equipment
• Comcores Announce Availability of CPRI v7.0

Tuesday, April 19, 2016

• Open Source: Licensing Pitfalls May Outweigh Benefits

Tuesday, April 19, 2016

• Intel Reportedly Readies Mass Layoff

Tuesday, April 19, 2016

• Rambus Reports First Quarter Financial Results

Tuesday, April 19, 2016

• Blackmagic Design selects the TICO lightweight compression to move to Live video production over IP.

Monday, April 18, 2016

• Analysts bullish on IoT security
• Xilinx Extends SmartConnect Technology to Deliver 20 -- 30% Breakthrough in Performance for 16nm UltraScale+ Devices
• Number of 300mm IC Wafer Fabs Expected to Reach 100 in 2016
• 14 IC Product Categories to Exceed Total IC Market Growth in 2016
• Intel Cuts 12,000, 11% of Staff
• Imagination, Microchip and Digilent deliver cutting-edge IoT curriculum for universities worldwide
• Longtime Verific Customer S2C Upgrades to SystemVerilog
• Istuary Innovation Group Selects Arteris FlexNoC Interconnect IP For Development of Proprietary Enterprise Storage Controllers
• Cypress Semiconductor Corp utilizes Aceic Design Technologies for their BLE verification Requirements
• NetSpeed Systems Extends Global Footprint in Israel Through Sales Rep Agreement with Ipro
• 使用优化的视频DAC提供高质量模拟视频信号
• 真正安全系统的真随机数发生器

Monday, April 18, 2016

• Argon Design launches real-time video stitching IP

Monday, April 18, 2016

• NGCodec and Xilinx Demonstrate H.265/HEVC Video Encoder IP at NAB 2016

Monday, April 18, 2016

• HEVC Advance Expands License Agreement

Monday, April 18, 2016

• Via Licensing Announces Extended High Efficiency AAC Patent Pool

Monday, April 18, 2016

• Atmel and Rockchip Join ARM Global University Program Alliance

Monday, April 18, 2016

• Data Centers Hit the Accelerator

Monday, April 18, 2016

• Mystery Buyer for IDT?

Monday, April 18, 2016

• State of On-Shoring: Problem of China

Monday, April 18, 2016

• Intel targets multithreaded software for multicore processors

Sunday, April 17, 2016

• Could China Get Approval for a Semiconductor Acquisition?
• Altera Demonstrates Ultra High Definition (UHD) Solutions at NAB; Offering a Path to Virtualized Studio Infrastructure
• Blackmagic Design selects the TICO lightweight compression to move to Live video production over IP
• Server and Cloud Leaders Collaborate to Create China-based Green Computing Consortium
• Qualcomm Signs 3G/4G Chinese Patent License Agreement with Yulong
• Imagination collaborates with Cascoda to bring innovative low-power wireless connectivity to the Creator Ci40 IoT development board
• Rambus Cryptography Research Unveils Latest Release of DPA Workstation Analysis Platform

Thursday, April 14, 2016

• UMC Standardizes on Industry-Leading Arm Artisan Platform for Physical IP
• CAN FD Plug Fest Shows Robust Operation of Controller IP Core by CAST and Fraunhofer IPMS
• 联华电子认证Cadence Virtuoso LDE Analyzer适用于其28HPCU制程

Thursday, April 14, 2016

• TSMC Expects to Rise from Industry Falloff in 2H

Thursday, April 14, 2016

• TSMC Reports First Quarter EPS of NT$2.50

Thursday, April 14, 2016

• Kilopass, Mie Fujitsu Semiconductor Announce Technology Development Partnership

Wednesday, April 13, 2016

• FD-SOI Expands, But Is It Disruptive?
• Cadence buys Israel multicore simulation startup
• Multicore SoCs stay a step ahead of SoC FPGAs
• Mentor Graphics Emulation Services Accelerates Verification with the Veloce Emulation Platform
• NXP mulling sale of standard chip business to China
• Toshiba Launches Arm Cortex-M3-Based Microcontrollers with Latest 65nm Flash Embedded Logic Process
• Kilopass, Mie Fujitsu Semiconductor Announce Technology Development Partnership

Wednesday, April 13, 2016

• Cadence Unveils Next-Generation Virtuoso Platform Featuring Advanced Analog Verification Technologies and 10X Performance Improvements Across Platform

Wednesday, April 13, 2016

• Brite Semiconductor Releases "YOU" Brand IP Portfolio and Silicon Platform Solution

Wednesday, April 13, 2016

• Sayonara, Japan Semiconductor Inc.

Tuesday, April 12, 2016

• 灿芯半导体发布YOU系列IP和硅平台解决方案
• Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power
• Synopsys Delivers Industry's First Verification IP for USB Power Delivery 3.0
• UMC Qualifies Cadence Virtuoso LDE Analyzer for its 28HPCU Process
• Foundry Sales Growth Slows
• Gartner Says Worldwide Semiconductor Revenue Expected to Decline 0.6 Percent in 2016
• USB 3.0 Promoter Group Defines Authentication Protocol for USB Type-C
• Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power
• Brite Semiconductor Releases YOU Brand IP Portfolio and Silicon Platform Solution

Monday, April 11, 2016

• Imagination collaborates with Cascoda to bring innovative low-power wireless connectivity to the Creator Ci40 IoT development board
• JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation
• US Government Seeks Guidance On Its Role in IOT
• 5 reasons why MIPS M-class CPUs are ideal for IoT
• China steps up fabless game
• Sayonara, Japan Semiconductor Inc
• Worldwide Semiconductor Foundry Market Grew 4.4 Percent in 2015, According to Final Results by Gartner
• Barco Silex announces VC-2 HQ RTP mapping ready for broadcast video production over IP

Monday, April 11, 2016

• NXP Unit Reportedly Attracts Chinese Suitors

Monday, April 11, 2016

• IBM Neurocomputer Detailed

Monday, April 11, 2016

• TSMC to Sell 5.1% of Xintec Inc.

Monday, April 11, 2016

• China Facing Long-Term Memory Gap

Monday, April 11, 2016

• TSMC March 2016 Revenue Report

Monday, April 11, 2016

• JT-SingMai will be showing their innovative video IP cores at Secutech, Taiwan

Monday, April 11, 2016

• UMC Reports Sales for March 2016

Sunday, April 10, 2016

• Addressing IoT and Industry 4.0 sensor backplane needs with an embedded smart analog architecture
• HDL Design House Joins PCI-SIG
• Cadence to Acquire Rocketick, Delivering Revolutionary Parallel Logic Simulation Speed-up