Search News

Thursday, September 12, 2024

• The Funding Gap in Green Technology: A Barrier to Progress
• SEALSQ Adopts RISC-V the Open-Standard RISC-V Architecture; Achievement Aligns with Rising Global Demand for Edge-AI and Machine Learning Applications
• NIST Releases First 3 Finalized Post-Quantum Encryption Standards
• Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems
• Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform
• Arm Announces Appointment of Young Sohn to its Board of Directors

Wednesday, September 11, 2024

• Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant
• intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam
• Imagination Announces Highest Performance Automotive GPU IP with FuSa Advancement
• Chevin Technology, Alpha-Data & Correct Designs collaborate to deliver fast and secure data offload for NASA-JPL's Airborne Visible/Infrared Imaging Spectrometer-3 (AVIRIS-3)
• Axiomise launches Essential Introduction to Practical Formal Verification Training

Tuesday, September 10, 2024

• Bluetooth 6.0 Channel Sounding is Here
• Sondrel appoints new Head of Projects
• Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC
• Logic Fruit Launches the Advanced Kritin iXD 6U VPX Single Board Computer (SBC)
• China wants to challenge the U.S. in AI – here's what Chinese giants are doing with the tech

Tuesday, September 10, 2024

• Intel Architects Start RISC-V Business with AheadComputing

Monday, September 9, 2024

• ZeroPoint Technologies Releases New Hardware-Accelerated Memory Optimization Solutions and Receives Industry Recognition for Innovation
• Xiphera Develops Quantum-Resilient Hardware Security Solutions for Space
• TSMC August 2024 Revenue Report
• Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
• Sondrel announces Advanced Modelling Process for AI chip designs
• Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads
• intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology
• Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
• EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP
• BrainChip Identifies Advantages to Radar and Lidar Systems Leveraging Event-Based AI
• Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design

Sunday, September 8, 2024

• Inspired by neurons: Neuromorphic hardware and the future of chip design
• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions
• T2M IP Unveils Advanced H.264 and H.265 HEVC Codec IP Cores for High-Efficiency Video Solutions
• SMIC cuts capex and R&D
• Semidynamics on major recruitment drive for RISC-V software engineers
• Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company
• Lack of Fresh Money Threatens Green Tech Sector
• Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
• Advancing AI the Brazilian Way: Fostering Innovation Through Collaboration and Open Standards

Thursday, September 5, 2024

• U.S. seeking export controls on quantum computing; limited impact expected for S. Korean firms
• Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development
• Qualcomm Rumored to Consider Acquiring Parts of Intel's Chip Design Business, with a Focus on PC Segment
• China's DRAM Expansion Raises Concerns, Potentially Impacting Samsung and SK hynix Profits
• Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details

Thursday, September 5, 2024

• CAST Ships I2C/SPI Controller IP Core for Easier Serial Communication

Wednesday, September 4, 2024

• UMC Reports Sales for August 2024
• Two Indian startups showcase innovations at Semicon Taiwan 2024
• Quebec's AI hub drives semiconductor research and development
• Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
• GUC Monthly Sales Report - August 2024
• En route towards the first German quantum computer

Tuesday, September 3, 2024

• SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development
• RISC-V Builds the Backbone of Three New Consumer Devices
• Global Semiconductor Sales Increase 18.7% Year-to-Year in July

Monday, September 2, 2024

• We are speaking, British Embassy, Paris, 3 October 2024 by PQShield
• Samsung and TSMC Unlikely to Be Buyers for Intel's Rumored Foundry Business Sale
• Europe's semiconductor sector calls for immediate 'Chips Act 2.0'
• EnSilica announces first production order for industrial ASIC
• CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices
• Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design

Sunday, September 1, 2024

• Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
• Thalia joins Siemens digital twin marketplace for automotive
• STMicroelectronics joins Quintauris to boost RISC-V adoption
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
• Intel considers foundry split, fab cancellations
• Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
• DeepX Hints At Next-Gen AI Chips
• Advanced USB 3.0 IP in 22nm boasting a very low power ULP and ULL Technology Licensed to Over 10 Global Customers
• OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip

Saturday, August 31, 2024

• Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process