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Saturday, May 25, 2024

• Macron and Steinmeier visit Fraunhofer in Dresden

Thursday, May 23, 2024

• 4DS Unveils New Interface Switching ReRAM Technology for Faster and Energy Efficient Memory for AI Processing
• Weebit Nano and Efabless collaborate to enable easy, affordable prototyping of innovative SoC designs
• TSMC's 3nm Production Capacity Will Triple This Year! Nanjing Plant Receives "Indefinite Exemption"!
• Samsung/Arm collaboration drives software research in communication technologies

Thursday, May 23, 2024

• China's largest chipmaker SMIC is now the No. 3 foundry in the world, Counterpoint says

Wednesday, May 22, 2024

• X-FAB and Soitec team up on SiC wafers
• Qualitas Semiconductor's eDP RX PHY IP v1.5a is Ready for Mass Production
• ZeroPoint Technologies Closes Funding Round for Groundbreaking Hardware-Accelerated Memory Compression Technology
• JPEG XS Joins GenICam, a Machine Vision Standard Managed by EMVA
• IMEC Spearheads the Construction of Sub-2nm Pilot Line Project with a Fund of EUR 2.5 Billion
• HCLTech Forges Ahead in Engineering Services to global Communication Services Providers (CSPs) with purchase of Communications Technology Group assets from Hewlett Packard Enterprise (HPE)
• Embedded artificial intelligence: How to increase security for industrial systems?

Tuesday, May 21, 2024

• S2C and Sirius Wireless Collaborate on Wi-Fi 7 RF IP Verification System
• Using generative AI to simply program a quantum computer
• Unleashing the potential of industrial and commercial IoT
• GlobalFoundries Announces Launch of $950 Million Secondary Offering of Ordinary Shares, Including Concurrent $200 Million Share Repurchase
• Soitec and Tokai Carbon enter into SiC partnership
• Siemens drives sustainable and future-proof power distribution across Norway
• JEDEC Reveals Massive Speed Boosts For Next-Gen DDR6 And LPDDR6 Memory
• TSMC Launches "Eco Plus! - Ecological Harmony Program" to Enhance Green Conservation in Three Key Aspects
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2024
• Revolutionizing HPC workflows: EPI optimised kernels
• Analog Bits Joins the Silicon Catalyst In-Kind Partner Ecosystem
• Quadric Presents and Demos AI+ML Chimera GPNPU at Embedded Vision Summit 2024

Monday, May 20, 2024

• Fraunhofer IPMS supports the 300 mm process development of smart power technologies for the semiconductor manufacturer Infineon at the Dresden site
• Why verification matters in network-on-chip (NoC) design
• University of East London reduces carbon emissions in first stage of net zero strategy
• GlobalFoundries Partners with Micron and U.S. National Science Foundation to Drive Semiconductor Workforce Development at Minority Serving Institutions
• JEDEC Confirms CAMM2 Memory For Desktop PCs: DDR6 Up To 17.6 Gbps & LPDDR6 Up To 14.4 Gbps
• RISC-V adoption predicted to get AI boost - forecast shows 50% growth every year until 2030 for the open-standard ISA
• Samsung Collaborates With Arm To Drive Research in Software for Next-Generation Communication Technologies
• Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption
• Siemens simplifies development of AI accelerators for advanced system-on-chip designs with Catapult AI NN
• Crucial role for imec in EU Chips Act
• Expedera Raises $20M Series B Funding Round Led By indie Semiconductor

Sunday, May 19, 2024

• RISC-V adoption will be accelerated by AI, according to new research
• Qualitas Semiconductor expands presence in chinese market through strategic partnership with chinese chip design company
• CFX announces commercial availability of low cost automotive grade SonoS based charge trapping EFlash/MTP technology on 90nm BCD process
• High-Speed Data Transmission Enhanced by 28nm JESD204B Tx PHY & Controller IP Cores Licensed for MCU Applications
• RaiderChip raises 1 Million Euros in seed capital to market its innovative generative AI accelerator: the GenAI v1.

Thursday, May 16, 2024

• Defacto SoC Compiler performance on AWS Graviton3
• TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes
• Softbank's Arm new AI chips ready by 2025, aims to become an AI powerhouse
• South Korea Reportedly Plans to open AI Chip Center in San Jose

Wednesday, May 15, 2024

• TSMC Confirms Construction for Its First European Chip Plant to Commence in Q4, as Scheduled
• AiM Future Brings GenAI Applications to Mainstream Consumer Devices
• Siemens Sustainability report 2023
• Axiomise Names Two Executives to Newly Formed Technical Advisory Board
• Next-generation sustainable electronics are doped with air
• Solid second-quarter performance - Outlook confirmed

Tuesday, May 14, 2024

• Bosch Powers Battery Recycling Innovation
• Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP
• New Automotive Grade Linux Platform Release Adds Cloud-Native Functionality, RISC-V Architecture and Flutter-Based Applications
• Esperanto Technologies and Rapidus Partner to Enable More Energy-Efficient Designs for the Coming "Post GPU Era"
• RISC-V Chip Combines CPU, GPU, and NPU Into One Core
• An Introduction to Post-Quantum Cryptography Algorithms
• Cybersecurity threat model for embedded devices
• TSMC plans automotive chiplet process for 2025

Monday, May 13, 2024

• Frontgrade Gaisler Leads the Way in RISC-V Processor Development for Space Applications
• M31 Q1 Revenue Increases 9.3% YoY, Advanced Processes Drive QoQ Growth
• ADTechnology and ANAFLASH to Team Up for Embedded Vision Summit (EVS) showcase
• Andes, HiRain, and HPMicro Join Hands to Build RISC-V AUTOSAR Software Ecosystem
• Kevin O'Buckley to Lead Foundry Services at Intel
• Digital Core Design in cooperation with DCD-SEMI Unveils DCAN-XL: Revolutionary CAN XL IP Core Bridging the Gap Between CAN FD and Ethernet
• Siemens partners with Microsoft to deliver AI-enhanced solutions for resilient product lifecycle management with Azure
• Green IT: 10 years of cooperation on the circular economy with a record in 2023