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Thursday, April 14, 2016

• Kilopass, Mie Fujitsu Semiconductor Announce Technology Development Partnership

Wednesday, April 13, 2016

• FD-SOI Expands, But Is It Disruptive?
• Cadence buys Israel multicore simulation startup
• Multicore SoCs stay a step ahead of SoC FPGAs
• Mentor Graphics Emulation Services Accelerates Verification with the Veloce Emulation Platform
• NXP mulling sale of standard chip business to China
• Toshiba Launches Arm Cortex-M3-Based Microcontrollers with Latest 65nm Flash Embedded Logic Process
• Kilopass, Mie Fujitsu Semiconductor Announce Technology Development Partnership

Wednesday, April 13, 2016

• Cadence Unveils Next-Generation Virtuoso Platform Featuring Advanced Analog Verification Technologies and 10X Performance Improvements Across Platform

Wednesday, April 13, 2016

• Brite Semiconductor Releases "YOU" Brand IP Portfolio and Silicon Platform Solution

Wednesday, April 13, 2016

• Sayonara, Japan Semiconductor Inc.

Tuesday, April 12, 2016

• 灿芯半导体发布YOU系列IP和硅平台解决方案
• Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power
• Synopsys Delivers Industry's First Verification IP for USB Power Delivery 3.0
• UMC Qualifies Cadence Virtuoso LDE Analyzer for its 28HPCU Process
• Foundry Sales Growth Slows
• Gartner Says Worldwide Semiconductor Revenue Expected to Decline 0.6 Percent in 2016
• USB 3.0 Promoter Group Defines Authentication Protocol for USB Type-C
• Digital Blocks I2C & SPI Controller IP Core Families Extend Leadership in Sensor Interface to Host Processors with System-Level Features & Low Power
• Brite Semiconductor Releases YOU Brand IP Portfolio and Silicon Platform Solution

Monday, April 11, 2016

• Imagination collaborates with Cascoda to bring innovative low-power wireless connectivity to the Creator Ci40 IoT development board
• JEDEC Launches Quality & Reliability Task Group in China; Invites Industry Participation
• US Government Seeks Guidance On Its Role in IOT
• 5 reasons why MIPS M-class CPUs are ideal for IoT
• China steps up fabless game
• Sayonara, Japan Semiconductor Inc
• Worldwide Semiconductor Foundry Market Grew 4.4 Percent in 2015, According to Final Results by Gartner
• Barco Silex announces VC-2 HQ RTP mapping ready for broadcast video production over IP

Monday, April 11, 2016

• NXP Unit Reportedly Attracts Chinese Suitors

Monday, April 11, 2016

• IBM Neurocomputer Detailed

Monday, April 11, 2016

• TSMC to Sell 5.1% of Xintec Inc.

Monday, April 11, 2016

• China Facing Long-Term Memory Gap

Monday, April 11, 2016

• TSMC March 2016 Revenue Report

Monday, April 11, 2016

• JT-SingMai will be showing their innovative video IP cores at Secutech, Taiwan

Monday, April 11, 2016

• UMC Reports Sales for March 2016

Sunday, April 10, 2016

• Addressing IoT and Industry 4.0 sensor backplane needs with an embedded smart analog architecture
• HDL Design House Joins PCI-SIG
• Cadence to Acquire Rocketick, Delivering Revolutionary Parallel Logic Simulation Speed-up

Thursday, April 7, 2016

• Ensigma Whisper RPUs and IoT applications
• Tsinghua buys stake in Lattice
• TSMC to Sell 5.1% of Xintec Inc.

Thursday, April 7, 2016

• Google Preps for IBM, ARM Shift

Thursday, April 7, 2016

• Freescale Takeover Makes NXP Largest Automotive Chip Vendor

Thursday, April 7, 2016

• Faraday Monthly Consolidated Sales Report - March 2016

Wednesday, April 6, 2016

• IoT security market to exceed $28 billion by 2020
• SNPS' Custom Compiler: closing the FinFET productivity gap
• eMemory Launches Enhanced NeoFuse IP for IoT Applications
• Arasan Announces Ultra Low Gate count, Ultra Low Latency Soundwire IP Core
• Arastu Systems announces DFI 4.0 compatible and validated LPDDR4 DRAM Memory Controller
• Wireless M-Bus evaluation kit targets IoT

Wednesday, April 6, 2016

• OmniVision's OV2718 Brings 1080p High Definition Imaging to HiSilicon's System-on-Chip IP Camera Solution

Wednesday, April 6, 2016

• Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM

Wednesday, April 6, 2016

• Hua Hong Semiconductor's 90nm eFlash Process Platform Successfully Achieved Mass Production

Wednesday, April 6, 2016

• GUC Monthly Sales Report - March 2016

Wednesday, April 6, 2016

• Image Matters and PLDA enables 8K, HDR, HFR and IP transport video system design with new levels of modularity, flexibility and performance.

Tuesday, April 5, 2016

• Chips&Media's Video IP powered SoCs reached 140 Million shipments in 2015
• Intel Acquires Yogitech for IoT Functional Safety
• Arrow Electronics Showcases IoT Solutions at Connect Expo in Australia
• INSIDE Secure and VisualOn Partner to Secure Over-The-Top Content Delivery and Playback Across Multiple Platforms
• D&R introduces a new version of its IP management platform (IPMS) integrating IP Packaging, IP Delivery and CRM features

Tuesday, April 5, 2016

• Faraday's MIPI IP Subsystem Shipment Reaches Fifteen Million

Tuesday, April 5, 2016

• Intel Mobile Chief's Hard Monday

Tuesday, April 5, 2016

• Worldwide Semiconductor Revenue Declined 2.3 Percent in 2015, According to Final Results by Gartner

Monday, April 4, 2016

• Cadence addresses complex analogue designs for IoT
• U.S. Companies Continue to Capture Bulk of IDM and Fabless IC Sales
• Hua Hong Semiconductor Cooperates with MindMotion to Develop IP Platform Targeting IoT Smart Hardware
• The Alliance for Open Media Welcomes New Members and Announces Availability of Open Source Video Codec Project
• Microsoft releases a 64-bit version of Windows 10 IoT Core Pro
• Synopsys Extends Verification IP Portfolio for Automotive Applications
• Cadence Unveils Next-Generation Virtuoso Platform Featuring Advanced Analog Verification Technologies and 10X Performance Improvements Across Platform
• Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM
• China's Interest in FD-SOI: Is It for Real?
• Intel Plans A Future of CMOS

Monday, April 4, 2016

• TSMC's Extremely Low Leakage Devices on 180nm eLL process empowers Dolphin Integration's IP offering

Monday, April 4, 2016

• JEDEC Updates Universal Flash Storage and Related Standards

Monday, April 4, 2016

• Via Licensing and Pegatron Settle Patent License Dispute Concerning AAC Essential Patents

Monday, April 4, 2016

• GigOptix, Inc. to Acquire Magnum Semiconductor, Inc.

Monday, April 4, 2016

• iPhone SE is Three iPhone Generations Rolled into One, IHS Teardown Reveals

Monday, April 4, 2016

• Global Semiconductor Sales Dip Slightly in February

Monday, April 4, 2016

• Last ASIC Vendor Standing in Japan

Monday, April 4, 2016

• InterDigital and NEC Corporation Extend and Expand Patent License Agreement

Monday, April 4, 2016

• EDA Consortium Becomes Electronic System Design Alliance

Monday, April 4, 2016

• Aplus and Flextronics Semiconductor Sign Licensing Agreement for Embedded EEPROM

Monday, April 4, 2016

• AMD Unveils Server Strategy and Roadmap

Monday, April 4, 2016

• GSA Reports a Resurgence of Semiconductor IPO Activity in November

Monday, April 4, 2016

• Microsemi Continues its FPGA Security Leadership for Secure Boot with Extension of Cryptography Research Differential Power Analysis Patent License

Monday, April 4, 2016

• IFI Announces Top Recipients of U.S. Patents in 2013

Monday, April 4, 2016

• Networking Leaders Collaborate to Maximize Choice, Performance and Power Efficiency

Monday, April 4, 2016

• Google, IBM, Mellanox, NVIDIA, Tyan Announce Development Group for Data Centers

Monday, April 4, 2016

• Synopsys Enters Software Quality and Security Market with Coverity Acquisition

Sunday, April 3, 2016

• France Brevets licenses NFC Patents to Sony
• Global Semiconductor Market Slumps in 2015, IHS Says

Friday, April 1, 2016

• WiLAN Subsidiary Reaches Agreement to License and Sell Patents to TSMC

Friday, April 1, 2016

• Gartner Says Global Smartphone Sales to Only Grow 7 Per Cent in 2016