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Friday, February 12, 2016

• Percepio raises expansion capital

Friday, February 12, 2016

• Trustonic Licenses whiteCryption's Advanced IoT and Mobile App Security Solutions

Friday, February 12, 2016

• Mentor Graphics Successful Against Synopsys' Appeal Of Patent Office Decision

Thursday, February 11, 2016

• Synopsys' IC Validator Certified by Samsung Foundry 14-nm Process for Signoff Physical Verification

Thursday, February 11, 2016

• RFEL Announces Non-linear Image Contrast Enhancement module

Wednesday, February 10, 2016

• A Better Year Lies Ahead, says IC Insights
• ST Agony Goes On As Crolles Workers Strike Again

Wednesday, February 10, 2016

• Kalray To Launch High Speed I/O Processors

Wednesday, February 10, 2016

• ARM Holdings Plc Reports Results For The Fourth Quarter And Full Year 2015

Tuesday, February 9, 2016

• EUV Gets $500M Center
• Virtex-6 FPGA powers Pentek VITA 49 Radio Transport Standard CompactPCI/AMC/PCIe/VPX Modules for SDR
• Cryptography and the Internet of Everything (IoE)
• Why AMD Should Arm China
• Lattice Semiconductor Expands ECP5 FPGA Family
• SilabTech is the winner of IESA 2015 Technology Innovation Award

Monday, February 8, 2016

• Self-testing in embedded systems: Hardware failure
• Ensilica Launch New eSi IoT Board at IoT Expo
• Data Centers Tap Arm, 100GE
• Mentor Graphics Expands Embedded Software Development Capabilities for Secure Industrial Applications
• eInfochips Announces 'IoT Xcelerator' - A Framework for Solutions Built on IoT Platforms
• HCE Service Licenses INSIDE Secure's Award-Winning MatrixHCE and MatrixSSE Mobile Security Software
• Imagination to showcase leading-edge technologies for mobile, IoT, automotive and connected consumer devices at MWC 2016

Monday, February 8, 2016

• Imagination Technologies: Chief Executive change, trading update and restructuring initiatives

Monday, February 8, 2016

• GUC Monthly Sales Report - January 2016

Monday, February 8, 2016

• Palma Ceia SemiDesign Tapes Out 802.11ah Transceiver for IoT Applications

Sunday, February 7, 2016

• Embedded software for free
• CEVA Accelerates Machine-to-Machine System Design with Communication Reference Platform
• Cadence to Showcase Tensilica DSPs and Design IP at Mobile World Congress 2016
• World's No.1 Computing Ecosystem Running on Arm at Mobile World Congress

Friday, February 5, 2016

• UMC Reports Sales for January 2016

Thursday, February 4, 2016

• Cortus and Aspen Logic Offer Educational Webinar on Creating ASICs to Enable IoT & M2M Products to Stand Out

Thursday, February 4, 2016

• Cadence Reports Fourth Quarter and Fiscal Year 2015 Financial Results

Wednesday, February 3, 2016

• Don't over-constrain in formal property verification (FPV) flows
• Opportunities and Challenges for Near-Threshold Technology in End-Point SoCs for the Internet of Things
• Barco Silex launches OEM board for pro AV market, enabling 4K/UHD HDMI transport over IP
• Samsung Describes 10nm SRAM
• Arm Extends 28nm IP Leadership With Latest UMC 28HPC POPs
• SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Seminar

Wednesday, February 3, 2016

• Self-Calibrated 10 Mbit/s Phase Modulator with Low Power fractional PLL Architecture Exceeding State-of-the-Art Performance

Wednesday, February 3, 2016

• Imec and Vrije Universiteit Brussel Present Small, Low-Cost and Low-Power Chip for multi-gigabit 60GHz Communication

Wednesday, February 3, 2016

• Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution

Wednesday, February 3, 2016

• CEVA, Inc. Announces Fourth Quarter and 2015 Financial Results

Tuesday, February 2, 2016

• Silicon Laboratories Looks to the Internet of Things for Growth
• Cisco in $1.4 billion Internet of Things deal for Jasper
• Develop fail-safe single-chip solutions to high-assurance, physical security design problems using Xilinx's Isolation Design Flow
• FinFETs Flow at Samsung, TSMC
• Xilinx Announces Data Center Ecosystem Investment Program to Broaden Cloud Computing and NFV Acceleration Solutions
• e2v strengthens semiconductors business with acquisition of Signal Processing Devices
• TSMC's 300mm Chinese Wafer Fab Wins Approval

Tuesday, February 2, 2016

• Synopsys Delivers Industry's First SAS 24G Verification IP for Enterprise Storage Systems

Tuesday, February 2, 2016

• Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)

Monday, February 1, 2016

• NIST bolsters random number generators
• Fly over the Dwarf Planet Ceres: New animation based on images taken by Dawn spacecraft, processed by imaging FPGA
• New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time
• Chips&Media has licensed its VP9 and HEVC multi decoder IP to Nexell and other 5 chip manufacturers
• Xilinx Transceiver Breakthrough Brings Greater Cost Efficiency to Data Center Interconnects
• Arteris announces 9 new IP licensees in 2015
• 通信SoC中模拟前端性能的快速评估方法
• 应对IP集成与软件开发挑战，加快半导体上市时间

Monday, February 1, 2016

• Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs

Monday, February 1, 2016

• Smartphone Apps Processors Revenue Declined -9 Percent in Q3 2015

Monday, February 1, 2016

• Easy and secure solution to manage SoC power mode transitions from Dolphin Integration

Monday, February 1, 2016

• 16 Insights on ICs

Monday, February 1, 2016

• Cobham Announces QML V Qualification of their MRAM's with IP from Everspin Technologies, Inc.

Monday, February 1, 2016

• New Book Explores History of ARM and Its Processors On the Way to Dominance in Mobile Devices