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Friday, January 29, 2016

• Why Opt For Chip Stack, FD-SOI in Image Sensors?

Thursday, January 28, 2016

• Google and Movidius to Enhance Deep Learning Capabilities in Next-Gen Devices

Thursday, January 28, 2016

• Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015, According to Gartner

Thursday, January 28, 2016

• Baikal Electronics Reveals Product Roadmap

Thursday, January 28, 2016

• UltraSoC forms strategic advisory board with four industry leaders

Thursday, January 28, 2016

• India Preps RISC-V Processors

Thursday, January 28, 2016

• ST Exits Set-Top Box Chip Biz, Plans Layoffs

Thursday, January 28, 2016

• VESA Updates Display Stream Compression Standard to Support New Applications and Richer Display Content

Wednesday, January 27, 2016

• IoT Frameworks Dig in for Battle
• Xilinx Ships 16nm Virtex UltraScale+ Devices; Industry's First High-End FinFET FPGAs
• Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)
• New VESA DSC v1.2 IP Products Announced by Hardent
• Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution

Wednesday, January 27, 2016

• North American Semiconductor Equipment Industry Posts December 2015 Book-to-Bill Ratio of 0.99

Wednesday, January 27, 2016

• Linaro announces Software Reference Platform for ARM servers

Wednesday, January 27, 2016

• Silver Lining Systems to Bring the Calxeda Fabric to Hyper-scale Servers with AMD Opteron A1100 Processor

Tuesday, January 26, 2016

• India Preps RISC-V Processors
• Verification is key as automotive chip design goes 28nm
• Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015
• FDSOI carries on despite ST re-org, says COO
• Linaro announces Software Reference Platform for Arm servers
• ST Exits Set-Top Box Chip Biz, Plans Layoffs
• MorethanIP and OmniPHY Announce Sweeping Partnership on Integrated Ethernet Solutions
• Synopsys Launches New IP Subsystem to Accelerate Data Fusion Processing in IoT Devices

Tuesday, January 26, 2016

• Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi

Tuesday, January 26, 2016

• Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016

Tuesday, January 26, 2016

• CEVA-XM4 Imaging and Vision DSP Named "Best Processor IP of 2015" by The Linley Group

Tuesday, January 26, 2016

• IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications.

Tuesday, January 26, 2016

• Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology

Tuesday, January 26, 2016

• More Downside than Upside Risk to IC Insights' 2016 IC Market Growth Forecast

Tuesday, January 26, 2016

• Rambus Reports Fourth Quarter and Fiscal Year 2015 Financial Results

Monday, January 25, 2016

• Turning open source into a multicore standard
• Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology
• Synopsys Introduces USB 3.1 Type-C IP with DisplayPort 1.3 and HDCP 2.2 for High-Bandwidth Data Transfer with Content Protection
• Innovative Logic Announced Licensing of Their USB3.1 SuperSpeedPlus Dual Role IP
• Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
• Rumor: Imagination may sell Pure
• Videantis partners with Almalence for higher quality imaging

Monday, January 25, 2016

• Security Outlook Bleak, Improving

Monday, January 25, 2016

• AMD Extends Patent License Agreement with Rambus

Monday, January 25, 2016

• Cypress Unveils the World's Most Flexible One-Chip ARM Cortex-M0 Solution

Monday, January 25, 2016

• Western Digital And IBM Announce Patent Acquisition And Cross-License Agreements

Sunday, January 24, 2016

• Rambus Acquires Secure Mobile Payment and Ticketing Solutions
• Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi
• Synopsys Platform Architect MCO Delivers Industry's First Power-Aware Architecture Analysis Tool Supporting IEEE 1801-2015 UPF 3.0
• Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016
• Altera PowerSoC DC-DC Step-down Converter Delivers Industry-leading Power Density, Performance and Reliability
• Optimize the power of always-on logic with SESAME eLV library, a Dolphin Integration solution in TSMC 55 ULP / ULP-eF process

Friday, January 22, 2016

• JEDEC Announces Publication of GDDR5X Graphics Memory Standard

Friday, January 22, 2016

• Will Xilinx Join the M&A Party?

Friday, January 22, 2016

• Consolidation Redrawing Microcontroller Landscape

Thursday, January 21, 2016

• Sidense Hires Industry Veteran Ken Wagner as Senior VP Engineering

Thursday, January 21, 2016

• V-Nova Preps UHD/4K Silicon IP for Licensing

Thursday, January 21, 2016

• Xilinx Announces Q3 Fiscal 2016 Results; Strong New Product Growth Drives 7% Sequential Sales Increase

Thursday, January 21, 2016

• MPEG LA Facilitating Development of Enhanced Voice Services Patent Pool License

Thursday, January 21, 2016

• Semiconductor R&D Growth Slows in 2015

Wednesday, January 20, 2016

• Semiconductor R&D Growth Slows in 2015
• UltraSoC enhances universal SoC debug architecture with versatile serial communications
• Rambus Cryptography Research CryptoMedia Platform to be Integrated into Kaleidescape Home Cinema Products
• Sony To Use FD-SOI in Stacked Image Sensors
• Barco Silex validates interoperable VC-2 lightweight video compression solution for ASIC/FPGA - ready for UHD and 4K transport
• Ambienta buys Mikrotron
• How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity

Wednesday, January 20, 2016

• Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power "Smart and Connected" Devices

Wednesday, January 20, 2016

• Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China

Tuesday, January 19, 2016

• Qualcomm Rounds Out IoT Offerings At CES 2016
• Synopsys Unveils SiliconSmart ADV Cell Library Characterization Solution
• Analog Bits' Half Power SERDES Demonstrated at DesignCon
• Arm Unveils its Highest Performing, Most Power-Efficient 4K-Capable Mobile Display Processor

Tuesday, January 19, 2016

• Silex Technology, Inc. Acquires embWiSe Technologies PVT, LTD.

Tuesday, January 19, 2016

• Has Samsung Snagged Qualcomm Business with New Process?

Monday, January 18, 2016

• Microchip Technology To Acquire Atmel
• China's Chip Jackpot Teases
• WiLAN Subsidiary, North Star Innovations, Inc., Enters Into License Agreement With GLOBALFOUNDRIES
• Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things
• sureCore Delivers FDSOI 28nm Memory Compiler
• Samsung's 14 nm LPE FinFET Transistors
• Credo Demonstrates 56G PAM-4, 56G NRZ and 28G NRZ SerDes Technology at DesignCon
• HEVC Advance Begins Issuing Licenses
• CEVA-XM4 Imaging and Vision DSP Named Best Processor IP of 2015 by The Linley Group
• Rambus Announces R+ 28G Serial Link PHY on Samsung 14nm LPP Process
• IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications
• Arteris FlexNoC Interconnect IP is Licensed by ZTE