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Thursday, March 17, 2016

• Acorn Technologies Licenses hellaPHY to Sequans Communications

Wednesday, March 16, 2016

• Imagination to lay off another 200 people
• Analog Devices Enhances IoT Sensing Portfolio with SNAP Sensor Acquisition
• Imagination Technologies: Restructuring update
• GUC Announces Progress in LPDDR4 IP and Reaffirms Commitment to DIMM Application of DDR3/4

Wednesday, March 16, 2016

• Altera and MorethanIP Announce Industry’s First Fibre Channel IP Cores For FPGAs

Tuesday, March 15, 2016

• Xilinx All Programmable Optical Transport Network (OTN) IP Subsystems Honored by 2016 Lightwave Innovation Reviews
• The Internet Of Things And Machine Learning
• Rapid prototyping platforms for embedded developers
• TSMC Details Silicon Road Map
• Rambus Cryptography Research Division Licenses Advanced Security Technologies to Altis Semiconductor

Tuesday, March 15, 2016

• Credo 16-nm 56G PAM-4 SerDes IP Now Available

Tuesday, March 15, 2016

• ARM and TSMC Announce Multi-Year Agreement to Collaborate on 7nm FinFET Process Technology for High-Performance Compute

Tuesday, March 15, 2016

• Quantum Computer May Crack Public-Key Encryption

Monday, March 14, 2016

• Google says
• Exploring design methodologies for next-generation IoT sensors
• Cadence Design IP to Support TSMC 16FFC and 28HPC+ Process Technologies
• TSMC and MediaTek Extend Collaboration on Ultra-Low Power Technology to Capture the Emerging IoT Market
• SEMI reports 2015 semiconductor equipment sales of US$36.5 billion
• Semiconductor (Silicon) IP Market Worth 7.01 Billion USD by 2022
• Bluetooth Transport Discovery Service Enables Collaborative IoT
• It is time to prioritize security for Internet of Things and wearables
• Cryptographic keys protect production FPGAs, says Microsemi
• TSMC, Arm Aim 7nm at Data Centers
• Socionext transceiver claims record for 100Gbit/s transmission on a single wavelength
• Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overbuilding, Cloning, Reverse Engineering, Malware Insertion and Other Security Threats
• Imagination announces latest PowerVR Graphics SDK including full support for new Vulkan API
• GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices

Monday, March 14, 2016

• True Circuits Announces New Line of Low Power, 32KHz IoT PLLs

Monday, March 14, 2016

• Silicon Shift Ahead in Comms

Monday, March 14, 2016

• Mellanox and Cadence Demonstrate PCI Express 4.0 Multi-Lane PHY IP Interoperability

Monday, March 14, 2016

• Lattice Semiconductor and MediaTek Deliver the World’s Most Power Efficient 4K Video Solution Over USB Type-C

Monday, March 14, 2016

• Flex Logix Announces Program for Fast-Track Evaluation and Prototyping

Monday, March 14, 2016

• RivieraWaves Announces its Wi-Fi Partnership with Celeno

Monday, March 14, 2016

• New Wave Design and Verification Acquires Advanced IO's Assets

Monday, March 14, 2016

• Zoran Corporation reports first quarter 2002 results

Monday, March 14, 2016

• TI India working on single-chip solution for mobile phones

Monday, March 14, 2016

• Multiband OFDM Alliance releases UWB PHY specs

Monday, March 14, 2016

• DSP Group buys Bermai's Wi-Fi chip IP

Monday, March 14, 2016

• elitePLUS semiconductor Technologies released a fully functional 400G PCS VIP.

Sunday, March 13, 2016

• TSMC认证Synopsys IC Compiler II适合10-nm FinFET生产，并开始7-nm工艺的初步设计
• TSMC Certifies Synopsys IC Compiler II for 10-nm FinFET Production and 7-nm Early Design Starts
• Synopsys Announces Broad IP Portfolio for TSMC 16FFC Process
• Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
• eMemory Announces Industry's First 16nm FinFET Compact (FFC) Process Verified OTP Silicon IP
• M31 Technology Announces Its Release of TSMC's 28HPC+ ULL SRAM Compilers for the Intelligent Device Market

Friday, March 11, 2016

• Mn_nH release deep-learing accelerated and 8-bit pixel anti-banding HEVC encoder.

Thursday, March 10, 2016

• Mentor says software apps are vital for SoC emulation
• SMIC and RRAM Leader Crossbar Announce Strategic Partnership Agreement

Thursday, March 10, 2016

• Up to Their ARMs in Concrete

Thursday, March 10, 2016

• TSMC February 2016 Revenue Report

Wednesday, March 9, 2016

• GLOBALFOUNDRIES Releases New 7SW SOI RF PDK Featuring Latest Keysight Technologies Advanced Design System Software
• Jury Finds in Favor of Synopsys in ATopTech Copyright Infringement Case
• THine Electronics Licenses SILICONGATE's Power Management IP Solutions for its Next Generation of Serial Interfaces
• Analog Devices Rolls MCUs for IoT
• Renesas protects IoT IP from cradle to grave

Wednesday, March 9, 2016

• Trilinear Technologies Delivers Next Generation DisplayPort Link Controllers

Wednesday, March 9, 2016

• UMC Reports Sales for February 2016

Tuesday, March 8, 2016

• Aldec delivers enhanced UVM Support and New Debugging Features with the latest release of Riviera-PRO
• eMemory Announces Innovative Solution for Cryptographic Security
• Synopsys Releases LucidShape and LucidDrive Version 2.1
• Mentor Graphics Optimizes Tools and Flows to Help Designers Succeed With Samsung Foundry's 10nm FinFET Process
• TSMC Doubles 16nm Capacity; Recruits In USA.
• PowerVR graphics for cost-sensitive applications

Tuesday, March 8, 2016

• Intel Security Expands Partner Ecosystem

Tuesday, March 8, 2016

• VESA Publishes DisplayPort Standard Version 1.4

Tuesday, March 8, 2016

• IPrium releases Burst BPSK Modem

Tuesday, March 8, 2016

• New Lossless & Lossy Hybrid frame buffer compression IP, CFrame50 released by Chips&Media

Tuesday, March 8, 2016

• Arasan Announces USB 2.0 PHY in Ultra Low Power TSMC 40LP

Monday, March 7, 2016

• Taiwan Semiconductor May Be Doubling Chip Production for the iPhone 7
• Imagination to Showcase Ground-Breaking Graphics Technologies at GDC 2016
• Arm Showcases the World's No. 1 Computing Ecosystem at Bluetooth World 2016
• Are Microcontrollers Up For the Challenge of the Internet of Things?
• Taiwan Semiconductor May Be Doubling Chip Production for the iPhone 7
• Semiconductor Shipments to Top 1 Trillion Units in 2018

Monday, March 7, 2016

• Sidense Exhibiting at TSMC 2016 North American Technology Symposiums

Monday, March 7, 2016

• MRAM Breakthrough Looms

Monday, March 7, 2016

• Semiconductor Unit Shipments To Exceed One Trillion Devices in 2018

Monday, March 7, 2016

• GUC Monthly Sales Report - February 2016

Monday, March 7, 2016

• Linaro announces support for 96Boards HiKey in AOSP

Sunday, March 6, 2016

• Linaro announces Arm Based Developer Cloud