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Saturday, January 16, 2016

• Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China

Friday, January 15, 2016

• TSMC Boosts 2016 Capex to About $9.5 Billion

Thursday, January 14, 2016

• Microsemi Corporation Completes Acquisition of PMC-Sierra, Inc.
• Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power 'Smart and Connected' Devices

Thursday, January 14, 2016

• AMD and Key Industry Partners Welcome the AMD Opteron A1100 SoC to the 64-bit ARM Datacenter Arena

Thursday, January 14, 2016

• TSMC Reports Fourth Quarter EPS of NT$2.81

Wednesday, January 13, 2016

• UPF 3.0 is Now Official
• Rambus Cryptography Research Launches CryptoMedia Platform to Provide Secure Access to Premium Digital Entertainment
• Faraday Delivers a Complete Set of Cell Libraries and Memory Compilers for UMC 28nm HPC Process
• NoC Interconnect Fabric IP Improves SoC Power, Performance and Area
• Power Integrations' InnoSwitch-CP ICs Dramatically Improve Charging Performance of Smart Mobile Devices
• Move over Moore's Law, analogue is key
• IoT and M2M solutions to lead 2016: Analysys Mason
• eMemory's NeoFuse Technology: A Major Advance in Automotive Panel Driver IC

Wednesday, January 13, 2016

• Ittiam enables OpenCL based VP9 Encode for Mobile and Consumer Applications

Tuesday, January 12, 2016

• Microchip Technology Announces That Its Proposal To Acquire Atmel Has Been Deemed A
• Qualcomm and TDK form JV
• IFI CLAIMS Announces 2015 U.S. Patent Rankings
• Global Semiconductor Market Outlook 2022
• Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology
• Arrow Electronics and Cadence Collaborate to Accelerate the Development of Production-Ready Products for Hardware Engineers

Monday, January 11, 2016

• Visteon Signs Agreement to Acquire India-based Automotive Multimedia Systems Supplier, AllGo Systems
• From IoT hype in 2015 to reality in 2016
• Chip Forecasts, Drivers Diverge
• DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
• Credo Delivers Industry's Lowest Power 100G MUX Device Based on 50Gbps SerDes Technology
• Arteris FlexNoC Physical Interconnect IP is Licensed by Renesas Electronics Europe for use in High-End SoCs
• Sonics signs first customer for ICE-Grain Power Architecture and closes 2015 with five new SonicsGN NoC licenses

Monday, January 11, 2016

• Will Apple Drive Analog ICs?

Monday, January 11, 2016

• DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points Using TSMC Standard CMOS Process

Monday, January 11, 2016

• Gartner Says Worldwide Semiconductor Capital Spending to Decline 4.7 Percent in 2016

Monday, January 11, 2016

• Semtech and MultiPhy Enter into a Strategic Agreement to Bring to Market a Complete Chipset for 100G Single Wavelength Optical Module Solutions

Monday, January 11, 2016

• Sequans and Foxconn Subsidiary Socle Form LTE for IoT Strategic Partnership

Monday, January 11, 2016

• WiLAN Subsidiary Enters Into License Agreement With GLOBALFOUNDRIES

Monday, January 11, 2016

• Xilinx Demonstrates 16nm Heterogeneous Multi-Processing SoC Solutions for ADAS Applications at CAR-ELE Japan 2016

Monday, January 11, 2016

• Microsemi Corporation Provides Acquisition and Business Updates; Announces the Expiration of the HSR Waiting Period

Monday, January 11, 2016

• Tech Tour of Metal Gate I/O Transistors

Monday, January 11, 2016

• NeuroSky Uses ARM Mobile Tech to Enable Secure Remote Patient Monitoring

Monday, January 11, 2016

• ARM Exec's Straight Car Talk at CES

Sunday, January 10, 2016

• SoC design verification at all levels is key, says Cadence
• S2C Expands Kintex UltraScale Prototyping Solutions for Consumer-based IoT and Other Small to Medium-Sized Designs
• Cadence Tempus Timing Signoff Solution Surpasses 200 Tapeout Milestone Within Two Years of Product Inception
• Will Apple Drive Analog ICs?
• Sequans and Foxconn Subsidiary Socle Form LTE for IoT Strategic Partnership
• Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015

Friday, January 8, 2016

• Faraday Monthly Consolidated Sales Report - December 2015

Friday, January 8, 2016

• TSMC December 2015 Revenue Report

Friday, January 8, 2016

• UMC Reports Sales for December 2015

Thursday, January 7, 2016

• Dolphin Integration joins the international Design & IP Partner Program of imec IC-link's

Thursday, January 7, 2016

• Free Core, Some Assembly Required

Thursday, January 7, 2016

• Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015

Thursday, January 7, 2016

• VeriSilicon Completes Acquisition of Vivante

Wednesday, January 6, 2016

• prpl Foundation Reveals Vision for a Secure Internet of Things
• Moortec Announces New PVT Controller - Complete PVT Sub-System Solution
• Samsung, TSMC Remain Tops in Available Wafer Fab Capacity
• INSIDE Secure DRM Fusion Adds Support for Google Widevine Modular DRM System
• INSIDE Secure Collaborates with Microsoft to Address Hollywood Studios' Security Requirements for 4K/UHD and HDR Content

Wednesday, January 6, 2016

• Imagination announces that 2016 will be "the year of MIPS"

Wednesday, January 6, 2016

• Imagination showcases its leadership in the automotive market at CES 2016

Wednesday, January 6, 2016

• Lattice Announces New Release of ispLEVER Classic Design Tool Suite

Wednesday, January 6, 2016

• Lattice Semiconductor, Helion Demonstrate 3D Video Camera Based on LatticeECP3 FPGA

Wednesday, January 6, 2016

• Broadcom Introduces World's First 28nm Heterogeneous Knowledge-Based Processors

Wednesday, January 6, 2016

• Xilinx Improves Transceiver Simulation Time 100x With Release of Industry's First IBIS-AMI FPGA Transceiver Models

Wednesday, January 6, 2016

• Anite, Blue Wonder and 4M Wireless Showcase LTE Interoperability

Wednesday, January 6, 2016

• Virage Logic Names IBEX Technology as Japanese Sales Representative

Wednesday, January 6, 2016

• New DaVinci DM37x video processors from Texas Instruments combine 1 GHz ARM Cortex-A8 and 800MHz C64x+ DSP, enabling 720p HD video for media-rich applications

Wednesday, January 6, 2016

• Altium acquires Morfik to help electronics designers add cloud connectivity to anything

Wednesday, January 6, 2016

• Broadcom Gains Microwave Transmission Technology with Acquisition of Provigent

Wednesday, January 6, 2016

• SRS Labs and Qualcomm Sign Licensing Agreement to Bring HD-Quality Audio to Mobile Devices

Wednesday, January 6, 2016

• MagnaChip and YMC Enter Into a Joint Development Agreement for MTP-IP Devices

Wednesday, January 6, 2016

• Room for IC industry expansion, analyst says

Wednesday, January 6, 2016

• Synopsys and UMC Collaborate to Accelerate Development of UMC's 14-nm FinFET Process

Wednesday, January 6, 2016

• MStar Licenses Tensilica IP Core From Cadence

Wednesday, January 6, 2016

• Peraso Releases WiGig Chipset to Production

Wednesday, January 6, 2016

• Chips&Media Inc. releases its new ultra small size and low power HEVC/H.265 codec IP

Tuesday, January 5, 2016

• Amazon Enters Semiconductor Business With Its Own Branded Chips
• Samsung pledges to become IoT leader
• Annapurna Labs, an Amazon Company, Announces Availability of Home Network and Storage Platform-on-Chip and Subsystem Solutions
• VeriSilicon Completes Acquisition of Vivante
• Cadence Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS12 Multistream Decoder
• Synopsys DesignWare IP Enables First-Pass Silicon Success for SK Hynix Universal Flash Storage Device
• EDA Consortium Reports EDA Industry Revenue Increase For Q3 2015
• New PowerVR GPUs from Imagination combine advanced graphics with optimizations for vision and computational photography
• Imagination announces new fabric collaboration with NetSpeed
• Chips&Media Inc. releases its new ultra-small size and low power HEVC/H.265 codec IP

Tuesday, January 5, 2016

• AMD Demonstrates Revolutionary 14nm FinFET Polaris GPU Architecture

Tuesday, January 5, 2016

• GUC Monthly Sales Report - December 2015

Tuesday, January 5, 2016

• Flex Logix Appoints Andy Jaros as VP Sales

Monday, January 4, 2016

• Global Semiconductor Sales Dip Slightly in November
• RFaxis Expands Portfolio of CMOS RF Front-End ICs for Internet of Things (IoT)
• China Is Chip Market's Only Growth Region
• Synopsys Boosts Software Integrity Platform with Coverity 8.0 Release
• Codasip Joins RISC-V Foundation and Announces Availability of RISC-V Compliant Codix Processor IP
• Arteris FlexNoC Interconnect IP is Licensed for use in Select Samsung SUHD TV Models
• DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs

Monday, January 4, 2016

• STMicroelectronics and ClevX Offer World's First Wireless User-Authentication Technology Platform for IoT-Device Security

Monday, January 4, 2016

• Broadcom Announces Industry's First 64Bit Quad-core Router Processor

Monday, January 4, 2016

• 8 Predictions for 2016

Monday, January 4, 2016

• WiLAN Subsidiary Enters into License Agreement with Toshiba

Monday, January 4, 2016

• Car as a Commodity: From Hummers to Ho-Hum