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Thursday, February 4, 2016

• Cortus and Aspen Logic Offer Educational Webinar on Creating ASICs to Enable IoT & M2M Products to Stand Out

Thursday, February 4, 2016

• Cadence Reports Fourth Quarter and Fiscal Year 2015 Financial Results

Wednesday, February 3, 2016

• Don't over-constrain in formal property verification (FPV) flows
• Opportunities and Challenges for Near-Threshold Technology in End-Point SoCs for the Internet of Things
• Barco Silex launches OEM board for pro AV market, enabling 4K/UHD HDMI transport over IP
• Samsung Describes 10nm SRAM
• Arm Extends 28nm IP Leadership With Latest UMC 28HPC POPs
• SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Seminar

Wednesday, February 3, 2016

• Self-Calibrated 10 Mbit/s Phase Modulator with Low Power fractional PLL Architecture Exceeding State-of-the-Art Performance

Wednesday, February 3, 2016

• Imec and Vrije Universiteit Brussel Present Small, Low-Cost and Low-Power Chip for multi-gigabit 60GHz Communication

Wednesday, February 3, 2016

• Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution

Wednesday, February 3, 2016

• CEVA, Inc. Announces Fourth Quarter and 2015 Financial Results

Tuesday, February 2, 2016

• Silicon Laboratories Looks to the Internet of Things for Growth
• Cisco in $1.4 billion Internet of Things deal for Jasper
• Develop fail-safe single-chip solutions to high-assurance, physical security design problems using Xilinx's Isolation Design Flow
• FinFETs Flow at Samsung, TSMC
• Xilinx Announces Data Center Ecosystem Investment Program to Broaden Cloud Computing and NFV Acceleration Solutions
• e2v strengthens semiconductors business with acquisition of Signal Processing Devices
• TSMC's 300mm Chinese Wafer Fab Wins Approval

Tuesday, February 2, 2016

• Synopsys Delivers Industry's First SAS 24G Verification IP for Enterprise Storage Systems

Tuesday, February 2, 2016

• Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)

Monday, February 1, 2016

• NIST bolsters random number generators
• Fly over the Dwarf Planet Ceres: New animation based on images taken by Dawn spacecraft, processed by imaging FPGA
• New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time
• Chips&Media has licensed its VP9 and HEVC multi decoder IP to Nexell and other 5 chip manufacturers
• Xilinx Transceiver Breakthrough Brings Greater Cost Efficiency to Data Center Interconnects
• Arteris announces 9 new IP licensees in 2015
• 通信SoC中模拟前端性能的快速评估方法
• 应对IP集成与软件开发挑战，加快半导体上市时间

Monday, February 1, 2016

• Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs

Monday, February 1, 2016

• Smartphone Apps Processors Revenue Declined -9 Percent in Q3 2015

Monday, February 1, 2016

• Easy and secure solution to manage SoC power mode transitions from Dolphin Integration

Monday, February 1, 2016

• 16 Insights on ICs

Monday, February 1, 2016

• Cobham Announces QML V Qualification of their MRAM's with IP from Everspin Technologies, Inc.

Monday, February 1, 2016

• New Book Explores History of ARM and Its Processors On the Way to Dominance in Mobile Devices

Sunday, January 31, 2016

• No clear winner among IoT frameworks
• CIOs mull IoT security concerns
• Building silicon foundations for security
• System Security: A Model from Medieval History
• True Random Number Generators for Truly Secure Systems
• Argon Design licenses Argon Streams VP9 to Renesas Electronics
• NXP Semiconductors' (NXPI) Q4 Earnings: What's in Store?
• Moore's Law Goes Post-CMOS
• Global Semiconductor Sales Top $335 Billion in 2015
• Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs
• Sankalp Semiconductor Completes Acquisition of Interra Systems Design Service Business Unit
• Synopsys Delivers Industry's First SAS 24G Verification IP for Enterprise Storage Systems
• Easy and secure solution to manage SoC power mode transitions from Dolphin Integration

Friday, January 29, 2016

• Why Opt For Chip Stack, FD-SOI in Image Sensors?

Thursday, January 28, 2016

• Google and Movidius to Enhance Deep Learning Capabilities in Next-Gen Devices

Thursday, January 28, 2016

• Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015, According to Gartner

Thursday, January 28, 2016

• Baikal Electronics Reveals Product Roadmap

Thursday, January 28, 2016

• UltraSoC forms strategic advisory board with four industry leaders

Thursday, January 28, 2016

• India Preps RISC-V Processors

Thursday, January 28, 2016

• ST Exits Set-Top Box Chip Biz, Plans Layoffs

Thursday, January 28, 2016

• VESA Updates Display Stream Compression Standard to Support New Applications and Richer Display Content

Wednesday, January 27, 2016

• IoT Frameworks Dig in for Battle
• Xilinx Ships 16nm Virtex UltraScale+ Devices; Industry's First High-End FinFET FPGAs
• Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)
• New VESA DSC v1.2 IP Products Announced by Hardent
• Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution

Wednesday, January 27, 2016

• North American Semiconductor Equipment Industry Posts December 2015 Book-to-Bill Ratio of 0.99

Wednesday, January 27, 2016

• Linaro announces Software Reference Platform for ARM servers

Wednesday, January 27, 2016

• Silver Lining Systems to Bring the Calxeda Fabric to Hyper-scale Servers with AMD Opteron A1100 Processor

Tuesday, January 26, 2016

• India Preps RISC-V Processors
• Verification is key as automotive chip design goes 28nm
• Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015
• FDSOI carries on despite ST re-org, says COO
• Linaro announces Software Reference Platform for Arm servers
• ST Exits Set-Top Box Chip Biz, Plans Layoffs
• MorethanIP and OmniPHY Announce Sweeping Partnership on Integrated Ethernet Solutions
• Synopsys Launches New IP Subsystem to Accelerate Data Fusion Processing in IoT Devices

Tuesday, January 26, 2016

• Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi

Tuesday, January 26, 2016

• Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016

Tuesday, January 26, 2016

• CEVA-XM4 Imaging and Vision DSP Named "Best Processor IP of 2015" by The Linley Group

Tuesday, January 26, 2016

• IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications.

Tuesday, January 26, 2016

• Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology

Tuesday, January 26, 2016

• More Downside than Upside Risk to IC Insights' 2016 IC Market Growth Forecast

Tuesday, January 26, 2016

• Rambus Reports Fourth Quarter and Fiscal Year 2015 Financial Results

Monday, January 25, 2016

• Turning open source into a multicore standard
• Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology
• Synopsys Introduces USB 3.1 Type-C IP with DisplayPort 1.3 and HDCP 2.2 for High-Bandwidth Data Transfer with Content Protection
• Innovative Logic Announced Licensing of Their USB3.1 SuperSpeedPlus Dual Role IP
• Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
• Rumor: Imagination may sell Pure
• Videantis partners with Almalence for higher quality imaging

Monday, January 25, 2016

• Security Outlook Bleak, Improving

Monday, January 25, 2016

• AMD Extends Patent License Agreement with Rambus

Monday, January 25, 2016

• Cypress Unveils the World's Most Flexible One-Chip ARM Cortex-M0 Solution

Monday, January 25, 2016

• Western Digital And IBM Announce Patent Acquisition And Cross-License Agreements

Sunday, January 24, 2016

• Rambus Acquires Secure Mobile Payment and Ticketing Solutions
• Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi
• Synopsys Platform Architect MCO Delivers Industry's First Power-Aware Architecture Analysis Tool Supporting IEEE 1801-2015 UPF 3.0
• Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016
• Altera PowerSoC DC-DC Step-down Converter Delivers Industry-leading Power Density, Performance and Reliability
• Optimize the power of always-on logic with SESAME eLV library, a Dolphin Integration solution in TSMC 55 ULP / ULP-eF process