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Thursday, February 4, 2016
Cortus and Aspen Logic Offer Educational Webinar on Creating ASICs to Enable IoT & M2M Products to Stand Out
Thursday, February 4, 2016
Cadence Reports Fourth Quarter and Fiscal Year 2015 Financial Results
Wednesday, February 3, 2016
Don't over-constrain in formal property verification (FPV) flows
Opportunities and Challenges for Near-Threshold Technology in End-Point SoCs for the Internet of Things
Barco Silex launches OEM board for pro AV market, enabling 4K/UHD HDMI transport over IP
Samsung Describes 10nm SRAM
Arm Extends 28nm IP Leadership With Latest UMC 28HPC POPs
SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Seminar
Wednesday, February 3, 2016
Self-Calibrated 10 Mbit/s Phase Modulator with Low Power fractional PLL Architecture Exceeding State-of-the-Art Performance
Wednesday, February 3, 2016
Imec and Vrije Universiteit Brussel Present Small, Low-Cost and Low-Power Chip for multi-gigabit 60GHz Communication
Wednesday, February 3, 2016
Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution
Wednesday, February 3, 2016
CEVA, Inc. Announces Fourth Quarter and 2015 Financial Results
Tuesday, February 2, 2016
Silicon Laboratories Looks to the Internet of Things for Growth
Cisco in $1.4 billion Internet of Things deal for Jasper
Develop fail-safe single-chip solutions to high-assurance, physical security design problems using Xilinx's Isolation Design Flow
FinFETs Flow at Samsung, TSMC
Xilinx Announces Data Center Ecosystem Investment Program to Broaden Cloud Computing and NFV Acceleration Solutions
e2v strengthens semiconductors business with acquisition of Signal Processing Devices
TSMC's 300mm Chinese Wafer Fab Wins Approval
Tuesday, February 2, 2016
Synopsys Delivers Industry's First SAS 24G Verification IP for Enterprise Storage Systems
Tuesday, February 2, 2016
Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)
Monday, February 1, 2016
NIST bolsters random number generators
Fly over the Dwarf Planet Ceres: New animation based on images taken by Dawn spacecraft, processed by imaging FPGA
New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time
Chips&Media has licensed its VP9 and HEVC multi decoder IP to Nexell and other 5 chip manufacturers
Xilinx Transceiver Breakthrough Brings Greater Cost Efficiency to Data Center Interconnects
Arteris announces 9 new IP licensees in 2015
通信SoC中模拟前端性能的快速评估方法
应对IP集成与软件开发挑战,加快半导体上市时间
Monday, February 1, 2016
Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs
Monday, February 1, 2016
Smartphone Apps Processors Revenue Declined -9 Percent in Q3 2015
Monday, February 1, 2016
Easy and secure solution to manage SoC power mode transitions from Dolphin Integration
Monday, February 1, 2016
16 Insights on ICs
Monday, February 1, 2016
Cobham Announces QML V Qualification of their MRAM's with IP from Everspin Technologies, Inc.
Monday, February 1, 2016
New Book Explores History of ARM and Its Processors On the Way to Dominance in Mobile Devices
Sunday, January 31, 2016
No clear winner among IoT frameworks
CIOs mull IoT security concerns
Building silicon foundations for security
System Security: A Model from Medieval History
True Random Number Generators for Truly Secure Systems
Argon Design licenses Argon Streams VP9 to Renesas Electronics
NXP Semiconductors' (NXPI) Q4 Earnings: What's in Store?
Moore's Law Goes Post-CMOS
Global Semiconductor Sales Top $335 Billion in 2015
Cadence Announces Complete Digital and Signoff Reference Flow for Imagination Technologies' PowerVR Series7 GPUs
Sankalp Semiconductor Completes Acquisition of Interra Systems Design Service Business Unit
Synopsys Delivers Industry's First SAS 24G Verification IP for Enterprise Storage Systems
Easy and secure solution to manage SoC power mode transitions from Dolphin Integration
Friday, January 29, 2016
Why Opt For Chip Stack, FD-SOI in Image Sensors?
Thursday, January 28, 2016
Google and Movidius to Enhance Deep Learning Capabilities in Next-Gen Devices
Thursday, January 28, 2016
Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015, According to Gartner
Thursday, January 28, 2016
Baikal Electronics Reveals Product Roadmap
Thursday, January 28, 2016
UltraSoC forms strategic advisory board with four industry leaders
Thursday, January 28, 2016
India Preps RISC-V Processors
Thursday, January 28, 2016
ST Exits Set-Top Box Chip Biz, Plans Layoffs
Thursday, January 28, 2016
VESA Updates Display Stream Compression Standard to Support New Applications and Richer Display Content
Wednesday, January 27, 2016
IoT Frameworks Dig in for Battle
Xilinx Ships 16nm Virtex UltraScale+ Devices; Industry's First High-End FinFET FPGAs
Truechip announces first customer shipment of Interlaken and MIPI DSI Comprehensive Verification IP (CVIP)
New VESA DSC v1.2 IP Products Announced by Hardent
Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution
Wednesday, January 27, 2016
North American Semiconductor Equipment Industry Posts December 2015 Book-to-Bill Ratio of 0.99
Wednesday, January 27, 2016
Linaro announces Software Reference Platform for ARM servers
Wednesday, January 27, 2016
Silver Lining Systems to Bring the Calxeda Fabric to Hyper-scale Servers with AMD Opteron A1100 Processor
Tuesday, January 26, 2016
India Preps RISC-V Processors
Verification is key as automotive chip design goes 28nm
Samsung and Apple Continue to Lead as Top Global Semiconductor Customers in 2015
FDSOI carries on despite ST re-org, says COO
Linaro announces Software Reference Platform for Arm servers
ST Exits Set-Top Box Chip Biz, Plans Layoffs
MorethanIP and OmniPHY Announce Sweeping Partnership on Integrated Ethernet Solutions
Synopsys Launches New IP Subsystem to Accelerate Data Fusion Processing in IoT Devices
Tuesday, January 26, 2016
Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi
Tuesday, January 26, 2016
Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016
Tuesday, January 26, 2016
CEVA-XM4 Imaging and Vision DSP Named "Best Processor IP of 2015" by The Linley Group
Tuesday, January 26, 2016
IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications.
Tuesday, January 26, 2016
Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology
Tuesday, January 26, 2016
More Downside than Upside Risk to IC Insights' 2016 IC Market Growth Forecast
Tuesday, January 26, 2016
Rambus Reports Fourth Quarter and Fiscal Year 2015 Financial Results
Monday, January 25, 2016
Turning open source into a multicore standard
Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology
Synopsys Introduces USB 3.1 Type-C IP with DisplayPort 1.3 and HDCP 2.2 for High-Bandwidth Data Transfer with Content Protection
Innovative Logic Announced Licensing of Their USB3.1 SuperSpeedPlus Dual Role IP
Kandou Uses Cadence Analog/Mixed-Signal Timing and Power Signoff Tools to Deliver High-Speed SerDes PHY IP Design on 28nm Process
Rumor: Imagination may sell Pure
Videantis partners with Almalence for higher quality imaging
Monday, January 25, 2016
Security Outlook Bleak, Improving
Monday, January 25, 2016
AMD Extends Patent License Agreement with Rambus
Monday, January 25, 2016
Cypress Unveils the World's Most Flexible One-Chip ARM Cortex-M0 Solution
Monday, January 25, 2016
Western Digital And IBM Announce Patent Acquisition And Cross-License Agreements
Sunday, January 24, 2016
Rambus Acquires Secure Mobile Payment and Ticketing Solutions
Palma Ceia SemiDesign Selected by LG Electronics to Provide Analog IP for Advanced WiFi
Synopsys Platform Architect MCO Delivers Industry's First Power-Aware Architecture Analysis Tool Supporting IEEE 1801-2015 UPF 3.0
Xilinx Demonstrates Next Generation Video Over IP, Processing and Connectivity for the Broadcast and Pro A/V Industry at ISE 2016
Altera PowerSoC DC-DC Step-down Converter Delivers Industry-leading Power Density, Performance and Reliability
Optimize the power of always-on logic with SESAME eLV library, a Dolphin Integration solution in TSMC 55 ULP / ULP-eF process
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