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Thursday, January 21, 2016

• Sidense Hires Industry Veteran Ken Wagner as Senior VP Engineering

Thursday, January 21, 2016

• V-Nova Preps UHD/4K Silicon IP for Licensing

Thursday, January 21, 2016

• Xilinx Announces Q3 Fiscal 2016 Results; Strong New Product Growth Drives 7% Sequential Sales Increase

Thursday, January 21, 2016

• MPEG LA Facilitating Development of Enhanced Voice Services Patent Pool License

Thursday, January 21, 2016

• Semiconductor R&D Growth Slows in 2015

Wednesday, January 20, 2016

• Semiconductor R&D Growth Slows in 2015
• UltraSoC enhances universal SoC debug architecture with versatile serial communications
• Rambus Cryptography Research CryptoMedia Platform to be Integrated into Kaleidescape Home Cinema Products
• Sony To Use FD-SOI in Stacked Image Sensors
• Barco Silex validates interoperable VC-2 lightweight video compression solution for ASIC/FPGA - ready for UHD and 4K transport
• Ambienta buys Mikrotron
• How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity

Wednesday, January 20, 2016

• Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power "Smart and Connected" Devices

Wednesday, January 20, 2016

• Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China

Tuesday, January 19, 2016

• Qualcomm Rounds Out IoT Offerings At CES 2016
• Synopsys Unveils SiliconSmart ADV Cell Library Characterization Solution
• Analog Bits' Half Power SERDES Demonstrated at DesignCon
• Arm Unveils its Highest Performing, Most Power-Efficient 4K-Capable Mobile Display Processor

Tuesday, January 19, 2016

• Silex Technology, Inc. Acquires embWiSe Technologies PVT, LTD.

Tuesday, January 19, 2016

• Has Samsung Snagged Qualcomm Business with New Process?

Monday, January 18, 2016

• Microchip Technology To Acquire Atmel
• China's Chip Jackpot Teases
• WiLAN Subsidiary, North Star Innovations, Inc., Enters Into License Agreement With GLOBALFOUNDRIES
• Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things
• sureCore Delivers FDSOI 28nm Memory Compiler
• Samsung's 14 nm LPE FinFET Transistors
• Credo Demonstrates 56G PAM-4, 56G NRZ and 28G NRZ SerDes Technology at DesignCon
• HEVC Advance Begins Issuing Licenses
• CEVA-XM4 Imaging and Vision DSP Named Best Processor IP of 2015 by The Linley Group
• Rambus Announces R+ 28G Serial Link PHY on Samsung 14nm LPP Process
• IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications
• Arteris FlexNoC Interconnect IP is Licensed by ZTE

Sunday, January 17, 2016

• HiSilicon Adopts Cadence Innovus Implementation System for Production DSP Designs
• NXP Embraces 28nm FDSOI for MCUs
• QuickPlay Redefines FPGA Design, Significantly Reducing Development Cost and Time-to-Market
• Allegro DVT Launches Industry's First HEVC Scalable Extension (SHVC) Compliance Streams

Saturday, January 16, 2016

• Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China

Friday, January 15, 2016

• TSMC Boosts 2016 Capex to About $9.5 Billion

Thursday, January 14, 2016

• Microsemi Corporation Completes Acquisition of PMC-Sierra, Inc.
• Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power 'Smart and Connected' Devices

Thursday, January 14, 2016

• AMD and Key Industry Partners Welcome the AMD Opteron A1100 SoC to the 64-bit ARM Datacenter Arena

Thursday, January 14, 2016

• TSMC Reports Fourth Quarter EPS of NT$2.81

Wednesday, January 13, 2016

• UPF 3.0 is Now Official
• Rambus Cryptography Research Launches CryptoMedia Platform to Provide Secure Access to Premium Digital Entertainment
• Faraday Delivers a Complete Set of Cell Libraries and Memory Compilers for UMC 28nm HPC Process
• NoC Interconnect Fabric IP Improves SoC Power, Performance and Area
• Power Integrations' InnoSwitch-CP ICs Dramatically Improve Charging Performance of Smart Mobile Devices
• Move over Moore's Law, analogue is key
• IoT and M2M solutions to lead 2016: Analysys Mason
• eMemory's NeoFuse Technology: A Major Advance in Automotive Panel Driver IC

Wednesday, January 13, 2016

• Ittiam enables OpenCL based VP9 Encode for Mobile and Consumer Applications

Tuesday, January 12, 2016

• Microchip Technology Announces That Its Proposal To Acquire Atmel Has Been Deemed A
• Qualcomm and TDK form JV
• IFI CLAIMS Announces 2015 U.S. Patent Rankings
• Global Semiconductor Market Outlook 2022
• Samsung Announces Mass Production of 2nd Generation 14-Nanometer FinFET Logic Process Technology
• Arrow Electronics and Cadence Collaborate to Accelerate the Development of Production-Ready Products for Hardware Engineers

Monday, January 11, 2016

• Visteon Signs Agreement to Acquire India-based Automotive Multimedia Systems Supplier, AllGo Systems
• From IoT hype in 2015 to reality in 2016
• Chip Forecasts, Drivers Diverge
• DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
• Credo Delivers Industry's Lowest Power 100G MUX Device Based on 50Gbps SerDes Technology
• Arteris FlexNoC Physical Interconnect IP is Licensed by Renesas Electronics Europe for use in High-End SoCs
• Sonics signs first customer for ICE-Grain Power Architecture and closes 2015 with five new SonicsGN NoC licenses

Monday, January 11, 2016

• Will Apple Drive Analog ICs?

Monday, January 11, 2016

• DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points Using TSMC Standard CMOS Process

Monday, January 11, 2016

• Gartner Says Worldwide Semiconductor Capital Spending to Decline 4.7 Percent in 2016

Monday, January 11, 2016

• Semtech and MultiPhy Enter into a Strategic Agreement to Bring to Market a Complete Chipset for 100G Single Wavelength Optical Module Solutions

Monday, January 11, 2016

• Sequans and Foxconn Subsidiary Socle Form LTE for IoT Strategic Partnership

Monday, January 11, 2016

• WiLAN Subsidiary Enters Into License Agreement With GLOBALFOUNDRIES

Monday, January 11, 2016

• Xilinx Demonstrates 16nm Heterogeneous Multi-Processing SoC Solutions for ADAS Applications at CAR-ELE Japan 2016

Monday, January 11, 2016

• Microsemi Corporation Provides Acquisition and Business Updates; Announces the Expiration of the HSR Waiting Period

Monday, January 11, 2016

• Tech Tour of Metal Gate I/O Transistors

Monday, January 11, 2016

• NeuroSky Uses ARM Mobile Tech to Enable Secure Remote Patient Monitoring

Monday, January 11, 2016

• ARM Exec's Straight Car Talk at CES

Sunday, January 10, 2016

• SoC design verification at all levels is key, says Cadence
• S2C Expands Kintex UltraScale Prototyping Solutions for Consumer-based IoT and Other Small to Medium-Sized Designs
• Cadence Tempus Timing Signoff Solution Surpasses 200 Tapeout Milestone Within Two Years of Product Inception
• Will Apple Drive Analog ICs?
• Sequans and Foxconn Subsidiary Socle Form LTE for IoT Strategic Partnership
• Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015