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Thursday, January 7, 2016
Free Core, Some Assembly Required
Thursday, January 7, 2016
Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015
Thursday, January 7, 2016
VeriSilicon Completes Acquisition of Vivante
Wednesday, January 6, 2016
prpl Foundation Reveals Vision for a Secure Internet of Things
Moortec Announces New PVT Controller - Complete PVT Sub-System Solution
Samsung, TSMC Remain Tops in Available Wafer Fab Capacity
INSIDE Secure DRM Fusion Adds Support for Google Widevine Modular DRM System
INSIDE Secure Collaborates with Microsoft to Address Hollywood Studios' Security Requirements for 4K/UHD and HDR Content
Wednesday, January 6, 2016
Imagination announces that 2016 will be "the year of MIPS"
Wednesday, January 6, 2016
Imagination showcases its leadership in the automotive market at CES 2016
Wednesday, January 6, 2016
Lattice Announces New Release of ispLEVER Classic Design Tool Suite
Wednesday, January 6, 2016
Lattice Semiconductor, Helion Demonstrate 3D Video Camera Based on LatticeECP3 FPGA
Wednesday, January 6, 2016
Broadcom Introduces World's First 28nm Heterogeneous Knowledge-Based Processors
Wednesday, January 6, 2016
Xilinx Improves Transceiver Simulation Time 100x With Release of Industry's First IBIS-AMI FPGA Transceiver Models
Wednesday, January 6, 2016
Anite, Blue Wonder and 4M Wireless Showcase LTE Interoperability
Wednesday, January 6, 2016
Virage Logic Names IBEX Technology as Japanese Sales Representative
Wednesday, January 6, 2016
New DaVinci DM37x video processors from Texas Instruments combine 1 GHz ARM Cortex-A8 and 800MHz C64x+ DSP, enabling 720p HD video for media-rich applications
Wednesday, January 6, 2016
Altium acquires Morfik to help electronics designers add cloud connectivity to anything
Wednesday, January 6, 2016
Broadcom Gains Microwave Transmission Technology with Acquisition of Provigent
Wednesday, January 6, 2016
SRS Labs and Qualcomm Sign Licensing Agreement to Bring HD-Quality Audio to Mobile Devices
Wednesday, January 6, 2016
MagnaChip and YMC Enter Into a Joint Development Agreement for MTP-IP Devices
Wednesday, January 6, 2016
Room for IC industry expansion, analyst says
Wednesday, January 6, 2016
Synopsys and UMC Collaborate to Accelerate Development of UMC's 14-nm FinFET Process
Wednesday, January 6, 2016
MStar Licenses Tensilica IP Core From Cadence
Wednesday, January 6, 2016
Peraso Releases WiGig Chipset to Production
Wednesday, January 6, 2016
Chips&Media Inc. releases its new ultra small size and low power HEVC/H.265 codec IP
Tuesday, January 5, 2016
Amazon Enters Semiconductor Business With Its Own Branded Chips
Samsung pledges to become IoT leader
Annapurna Labs, an Amazon Company, Announces Availability of Home Network and Storage Platform-on-Chip and Subsystem Solutions
VeriSilicon Completes Acquisition of Vivante
Cadence Tensilica HiFi Audio DSP Becomes First IP Core Approved for Dolby MS12 Multistream Decoder
Synopsys DesignWare IP Enables First-Pass Silicon Success for SK Hynix Universal Flash Storage Device
EDA Consortium Reports EDA Industry Revenue Increase For Q3 2015
New PowerVR GPUs from Imagination combine advanced graphics with optimizations for vision and computational photography
Imagination announces new fabric collaboration with NetSpeed
Chips&Media Inc. releases its new ultra-small size and low power HEVC/H.265 codec IP
Tuesday, January 5, 2016
AMD Demonstrates Revolutionary 14nm FinFET Polaris GPU Architecture
Tuesday, January 5, 2016
GUC Monthly Sales Report - December 2015
Tuesday, January 5, 2016
Flex Logix Appoints Andy Jaros as VP Sales
Monday, January 4, 2016
Global Semiconductor Sales Dip Slightly in November
RFaxis Expands Portfolio of CMOS RF Front-End ICs for Internet of Things (IoT)
China Is Chip Market's Only Growth Region
Synopsys Boosts Software Integrity Platform with Coverity 8.0 Release
Codasip Joins RISC-V Foundation and Announces Availability of RISC-V Compliant Codix Processor IP
Arteris FlexNoC Interconnect IP is Licensed for use in Select Samsung SUHD TV Models
DSP Concepts Enhances Audio Weaver to Support Cadence Tensilica HiFi DSPs
Monday, January 4, 2016
STMicroelectronics and ClevX Offer World's First Wireless User-Authentication Technology Platform for IoT-Device Security
Monday, January 4, 2016
Broadcom Announces Industry's First 64Bit Quad-core Router Processor
Monday, January 4, 2016
8 Predictions for 2016
Monday, January 4, 2016
WiLAN Subsidiary Enters into License Agreement with Toshiba
Monday, January 4, 2016
Car as a Commodity: From Hummers to Ho-Hum
Sunday, January 3, 2016
AMD Demonstrates Revolutionary 14nm FinFET Polaris GPU Architecture
SiBEAM Introduces USB 3.0 802.11ad Reference Design Delivering Wireless Connectivity at Multi-Gigabit Speeds
Wi-Fi Alliance introduces low power, long range Wi-Fi HaLow
When System Designers Must Care About Silicon IP
dbx-tv Total Technology Now Available on Cadence Tensilica HiFi Audio/Voice Processors
Dolphin Integration unveils extremely dense audio CODECs for application processors at 28 nm and 16 nm
STMicroelectronics and ClevX Offer World's First Wireless User-Authentication Technology Platform for IoT-Device Security
Celeno Adopts CEVA DSP for High Performance 802.11ac Wave 2 4x4 Products
CEVA Announces Certification of RivieraWaves Surf Wi-Fi 802.11ac IP Platform
Friday, January 1, 2016
Chip Sales Dipped Slightly in 2015
Thursday, December 31, 2015
16 analog, MEMS and sensor startups to follow in 2016
Thursday, December 31, 2015
2016: Expect Unexpected Innovation in IP Development
Monday, December 28, 2015
Sidense Qualifies 1T-OTP Memory IP at GLOBALFOUNDRIES 55nm Low-Power Process Node
Rambus Renews Patent License Agreement With Toshiba
Monday, December 28, 2015
CEVA Releases ISO 26262 Compliant Safety Design Package for ADAS Vision Processor
Monday, December 28, 2015
Google, HP, Oracle Join RISC-V
Monday, December 28, 2015
Intel Completes Acquisition of Altera
Monday, December 28, 2015
Mn_nH release AXI chip-to-chip interface IP and HEVC encoding expand up to 8K 30fps
Monday, December 28, 2015
Mergers in Memory Abundant in 2015
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