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Thursday, October 29, 2015

• EnSilica establishes new regional office and centralised design centre for analog and mixed-signal IC design in Bristol (UK)

Wednesday, October 28, 2015

• MIPS CPU architecture fully supported by Google's new Brillo OS for the IoT

Wednesday, October 28, 2015

• Creonic to Provide Three LDPC Decoder IP Cores for DOCSIS 3.1

Wednesday, October 28, 2015

• VESA Rolls Out Production-Ready Embedded DisplayPort Standard 1.4 for Mobile Personal Computing Devices

Tuesday, October 27, 2015

• Sony and Toshiba Sign Memorandum of Understanding for the Transfer of Certain Semiconductor Fabrication Facilities
• Globalfoundries deal broadens FD-SOI, says Leti CEO
• IoT-connected vehicles will challenge car firms
• Tiny IoT radio for smart meters
• mCube Redefines MEMS Sensor Innovation by Unveiling the World's Smallest 1x1mm Accelerometer
• Aldec Introduces Hybrid Emulation with Arm Fast Model Support
• VESA Rolls Out Production-Ready Embedded DisplayPort Standard 1.4 for Mobile Personal Computing Devices
• ACCO Semiconductor Announces World's Most Integrated Power Amplifier Module for 3G/LTE Smartphones
• MIPS CPU architecture fully supported by Google's new Brillo OS for the IoT
• Creonic to Provide Three LDPC Decoder IP Cores for DOCSIS 3.1
• Agnisys automates development of Arm-based designs

Tuesday, October 27, 2015

• Vivante to Highlight Cutting-Edge GraphiVisor Virtualization Technology at Virtualize Conference

Tuesday, October 27, 2015

• IDT to Acquire ZMDI for $310 Million

Tuesday, October 27, 2015

• AM3D and CEVA Partner to Provide Innovative Sound Enhancement Technology for Portable Devices

Monday, October 26, 2015

• eSilicon Releases Online Quoting Support for TSMC 16FF+
• IoT Startup Revises 802.15.4 Nets
• UMC Meets Expectations on 28nm Ramp as Demand Slumps
• STMicroelectronics Said to Weigh Bid for Fairchild Semiconductor
• Arm Upgrades Interconnect, Memory Control IP
• Arm launches next-gen CoreLink IP
• China driving Arm-based server market
• 5G teams need FPGAs for massive MIMO research
• New Arm CoreLink System IP Provides the Foundation for Next-Generation Heterogeneous SoCs
• AM3D and CEVA Partner to Provide Innovative Sound Enhancement Technology for Portable Devices
• Brite Semiconductor Acquires Architectural License to Uniquify's DDR Technology to Consolidate Core IP Technology

Monday, October 26, 2015

• Mentor Graphics Advances Nucleus RTOS for Internet of Things and Embedded Connected Devices

Monday, October 26, 2015

• Surpassing 100 Production Designs, Synopsys' IC Compiler II Achieves the Fastest Ramp-up in the Company's History

Monday, October 26, 2015

• Flex Logix Secures $7.4 Million in VC Financing

Monday, October 26, 2015

• Chip Mergers, Impacts Still Ahead

Monday, October 26, 2015

• intoPIX showcases UHDTV Hybrid SDI/IP Interoperability using TICO lightweight compression at the SMPTE 2015 Annual Technical Conference and Exhibition.

Monday, October 26, 2015

• Dolphin Integration launches a new Capless Regulator dedicated to low-power operation required by IoT applications

Monday, October 26, 2015

• VATICS Chooses CEVA Imaging and Vision DSP for its Surveillance and Smart Camera SoCs

Sunday, October 25, 2015

• IDT to Acquire ZMDI for $310 Million
• Cadence Reports Third Quarter 2015 Financial Results
• Rambus Initiates Accelerated Share Repurchase Program

Friday, October 23, 2015

• Altera Announces Third Quarter Results

Friday, October 23, 2015

• Altera Demonstrates Security and System Acceleration Solutions at MILCOM 2015

Friday, October 23, 2015

• Foundry Sales Defy IC Decline

Friday, October 23, 2015

• North American Semiconductor Equipment Industry Posts September 2015 Book-to-Bill Ratio of 1.07

Thursday, October 22, 2015

• Socionext Licenses and Deploys CEVA Imaging and Vision DSP for Milbeaut Image Processors

Thursday, October 22, 2015

• Trillium Certainly Can Encrypt CAN Bus

Wednesday, October 21, 2015

• Arm tide surges on
• Arteris tackles tyranny of wires
• IC Insights Lowers its Worldwide 2015 IC Market Forecast from +1% to -1%
• The IP companies creep toward an SoC

Wednesday, October 21, 2015

• Anapass Achieves First-Time Success with Mixel's Complete MIPI Solution

Wednesday, October 21, 2015

• Sequans Selects VeriSilicon ZSP Digital Signal Processor for LTE Cat0/Cat1 IoT and M2M Chipsets

Wednesday, October 21, 2015

• Synopsys Demonstrates Industry's First MIPI D-PHY IP Operating at 2.5 Gbps per Lane on TSMC 16-nm FinFET Plus Process

Wednesday, October 21, 2015

• ARM Launches IoT Education Kit in China at Opening of Peking University’s New Smart Device Lab

Wednesday, October 21, 2015

• ARM Holdings PLC Reports Results For The Third Quarter And Nine Months Ended 30 September 2015

Tuesday, October 20, 2015

• CEVA Announces Silicon-based Platform to Streamline Development of Low-Power 'Smart and Connected' Devices
• Andes Technology and INVECAS Enter Into a High Value Collaboration to Win Designs for GLOBALFOUNDRIES 22FDSOI and 14LPP Processes
• Arm Launches IoT Education Kit in China at Opening of Peking University's New Smart Device Lab

Tuesday, October 20, 2015

• Rambus Reports Third Quarter Financial Results

Monday, October 19, 2015

• Imagination announces single board MIPS computer for IoT
• Understanding the IoT cloud and how it will change things
• Eyeing the IoT with the Arm-powered Raspberry Pi
• SEMI Announces Continued Annual Growth for Silicon Shipment Volumes
• Server Benchmark Debuts at Arm Event
• Arm Mali-470 GPU Offers Improved Efficiency and Experiences on Wearable and IoT Devices
• Cadence Announces the First IP Subsystem with Integrated USB Type-C, USB Power Delivery and DisplayPort Alternate Mode Support
• Arm to Offer Cycle-Accurate Virtual Prototyping for Complex SoCs Through an Asset Acquisition from Carbon Design Systems
• Innovasic and OmniPhy Announce Collaboration on Automotive Ethernet Solutions
• Moortec Semiconductor Announces New UMC 28nm HPC High Accuracy Embedded Temperature Sensor
• AXSEM AG is now a part of ON Semiconductor
• New Release of Synopsys Synplify Software Delivers Up to 3X Faster Runtime with Higher FPGA Performance

Monday, October 19, 2015

• Microsemi Corporation Announces Superior Proposal to Acquire PMC-Sierra, Inc. for $11.50 Per Share With Intent to Close in December 2015

Monday, October 19, 2015

• Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols for Leading-edge Networking Designs

Monday, October 19, 2015

• Shanghai Seeks 'More-than-Moore' in Silicon Valley

Monday, October 19, 2015

• Dolphin Integration receives TSMC's Open Innovation Platform 2015 Partner of the Year Award for Specialty IP

Monday, October 19, 2015

• TSMC Slashes 2015 Capex by over 25% to $8 Billion

Monday, October 19, 2015

• Sensory TrulySecure Face Authentication Software Now Available on Cadence Tensilica Imaging/Vision DSPs

Monday, October 19, 2015

• Apple Gives a Foundry Lesson

Sunday, October 18, 2015

• iPhone 7: Will It Have Intel Inside?